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74HC174PW,118

NXP Semiconductors

74HC174PW,118 by NXP Semiconductors

74HC174PW,118 by NXP Semiconductors is a CMOS latch with 6 bits and a max frequency of 20MHz. It operates at a nominal voltage of 5V and has a propagation delay of 250ns. This latch is commonly used in automotive applications due to its small size and high temperature tolerance.

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$0.381

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Verical

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Element14

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Arrow

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Nova Conductors

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Netroflash

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Overview

Discover the power of the 74HC174PW,118 by NXP Semiconductors. As a leading manufacturer in the industry, NXP Semiconductors ensures unmatched quality and reliability. The 74HC174PW,118 is a versatile latches & flip-flops device that offers seamless functionality and superior performance. With its compact rectangular shape and small outline, it is perfect for space-constrained applications. Operating at a nominal supply voltage of 5V, this product delivers exceptional speed and efficiency with a maximum propagation delay of only 250ns. Its true output polarity guarantees accurate and reliable results. Whether you're designing automotive systems or working on high-frequency projects, the 74HC174PW,118 is your ultimate solution. Experience the value and benefits it brings to your designs today!

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

The use of plastic/epoxy as the package body material provides durability and resistance to environmental factors, making this latch & flip-flop product suitable for various applications.

Surface Mount: YES

With the surface mount feature, this latch & flip-flop can be easily mounted onto circuit boards, simplifying the assembly process and saving valuable space.

Package Shape: RECTANGULAR

The rectangular package shape allows for efficient placement and installation of the latch & flip-flop, optimizing the use of available board space.

No. of Bits: 6

With 6 bits, this latch & flip-flop product offers a high level of data storage capacity, which is beneficial for complex electronic systems that require extensive memory capacities.

Nominal Supply Voltage / Vsup (V): 5

Operating at a nominal supply voltage of 5V, this latch & flip-flop can be easily integrated into standard power supply systems, providing compatibility and ease of use.

Load Capacitance (CL): 50 pF

The moderate load capacitance of 50 pF ensures optimal signal transmission and reception, improving the overall performance and reliability of the latch & flip-flop.

Power Supplies (V): 2/6

This latch & flip-flop supports power supplies of 2V and 6V, allowing for versatile applications in various voltage environments.

No. of Terminals: 16

Equipped with 16 terminals, this latch & flip-flop provides sufficient connectivity options for interconnecting with other electronic components, enhancing system integration possibilities.

Package Style (Meter): SMALL OUTLINE, THIN PROFILE, SHRINK PITCH

The small outline, thin profile, and shrink pitch package style ensure space-saving installation and efficient use of board real estate, making it suitable for compact designs.

Maximum I (ol): 4 Amp

With a maximum output current of 4 Amps, this latch & flip-flop can handle high-power applications, offering robust and reliable performance.

Propagation Delay (tpd): 250 ns

The propagation delay of 250 ns guarantees fast and responsive signal processing, enabling efficient data transfer in time-critical applications.

Maximum Operating Temperature: 125 °C

With a high maximum operating temperature of 125°C, this latch & flip-flop can withstand harsh environments and remain operational under elevated temperatures.

Trigger Type: POSITIVE EDGE

The positive edge trigger type ensures accurate and synchronized switching, enabling precise control and timing in digital applications.

Minimum Operating Temperature: -40 °C

Operating at a minimum temperature of -40°C, this latch & flip-flop is suitable for use in extreme cold conditions without compromising its functionality.

Terminal Finish: Nickel/Palladium/Gold (Ni/Pd/Au)

The terminal finish of nickel/palladium/gold provides excellent corrosion resistance and ensures reliable electrical connections, enhancing the longevity and performance of the latch & flip-flop.

Terminal Position: DUAL

The dual terminal position allows for flexible and convenient layout options, accommodating various circuit board designs and simplifying the connection process.

Maximum Seated Height: 1.1 mm

With a maximum seated height of 1.1 mm, this latch & flip-flop maintains a low profile, making it suitable for applications with height restrictions.

Width: 4.4 mm

The compact width of 4.4 mm contributes to space-efficient board layouts, facilitating the integration of this latch & flip-flop into small electronic devices.

Output Polarity: TRUE

The true output polarity ensures accurate and reliable signal output, enabling seamless integration with other components and enhancing overall system performance.

Minimum Supply Voltage (Vsup): 2 V

Supporting a minimum supply voltage of 2V, this latch & flip-flop allows for operation in low-power environments or battery-powered applications.

Maximum Time At Peak Reflow Temperature (s): 30

With a maximum time of 30 seconds at peak reflow temperature, this latch & flip-flop can endure soldering processes without any degradation, ensuring reliable assembly and minimizing manufacturing risks.

Peak Reflow Temperature °C: 260

The peak reflow temperature of 260°C ensures compatibility with standard soldering techniques, providing ease of manufacturing and compatibility with industry standards.

Length: 5 mm

The compact length of 5 mm contributes to space-efficient board layouts, enabling integration in small form-factor applications.

Temperature Grade: AUTOMOTIVE

This latch & flip-flop product has a temperature grade classification of "Automotive," indicating its suitability for automotive applications, where reliable operation in varying temperature conditions is crucial.

Maximum Frequency At Nominal Supply: 20,000,000 Hz

Supporting a maximum frequency of 20 MHz at the nominal supply voltage, this latch & flip-flop enables high-speed data processing and is ideal for applications requiring fast signal transmission.

Technology: CMOS

Utilizing CMOS technology, this latch & flip-flop offers low power consumption, high noise immunity, and excellent compatibility with digital systems, making it a reliable choice for various electronic applications.

Terminal Form: GULL WING

The gull-wing terminal form allows for easy surface-mounting and soldering, ensuring secure electrical connections and simplified manufacturing processes.

Packing Method: TR

The TR packing method provides tape and reel packaging, enabling efficient handling, storage, and integration of this latch & flip-flop into automated assembly processes.

Terminal Pitch: 0.65 mm

With a terminal pitch of 0.65 mm, this latch & flip-flop provides close pin spacing, enabling high-density board designs and saving precious board space.

Minimum fmax: 24 MHz

With a minimum fmax of 24 MHz, this latch & flip-flop supports high-frequency applications and is suitable for demanding digital systems requiring fast signal processing.

Maximum Supply Voltage (Vsup): 6 V

Supporting a maximum supply voltage of 6V, this latch & flip-flop ensures compatibility with a wide range of power supply systems, providing flexibility and versatility in various applications.

Technical Specifications

Latches & Flip-Flops 74HC174PW,118 attributes and parameters. Explore more Latches & Flip-Flops devices from NXP Semiconductors

Specs

Family:

HC/UH

JESD-30 Code:

R-PDSO-G16

JESD-609 Code:

e4

Length:

5 mm

Load Capacitance (CL):

50 pF

Logic IC Type:

Maximum Frequency At Nominal Supply:

20000000 Hz

Maximum I (ol):

4 Amp

Moisture Sensitivity Level (MSL):

1

No. of Bits:

6

No. of Functions:

1

No. of Terminals:

16

Maximum Operating Temperature:

125 Cel

Minimum Operating Temperature:

-40 Cel

Output Polarity:

TRUE

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Equivalence Code:

TSSOP16,.25

Package Shape:

Package Style (Meter):

SMALL OUTLINE, THIN PROFILE, SHRINK PITCH

Packing Method:

TR

Peak Reflow Temperature (C):

260

Power Supplies (V):

2/6

Propagation Delay (tpd):

250 ns

Qualification:

Not Qualified

Maximum Seated Height:

1.1 mm

Sub-Category:

FF/Latches

Maximum Supply Voltage (Vsup):

6 V

Minimum Supply Voltage (Vsup):

2 V

Nominal Supply Voltage / Vsup (V):

5

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Finish:

Nickel/Palladium/Gold (Ni/Pd/Au)

Terminal Form:

Terminal Pitch:

.65 mm

Terminal Position:

DUAL

Maximum Time At Peak Reflow Temperature (s):

30

Trigger Type:

POSITIVE EDGE

Width:

4.4 mm

Minimum fmax:

24 MHz

Trade Compliance

74HC174PW,118 Logic ICs trade compliance attributes, and parameters.

HTS

8542.39.00.01

SB

8542.39.00.00

PCN

Manufacturer Highlights

NXP Semiconductors

NXP is a leading semiconductor company that creates cutting-edge technology to power secure connections in a smarter world. Founded in 2006, they have grown to become one of the top five global semiconductor companies and serve their customers in over 70 countries around the world.

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The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

Executive Director, President, CEO

Kurt Sievers

Executive VP, CFO

Bill Betz

Executive VP, Chief Sales Officer

Ron Martino

Manufacturer fab locations 7

Fab name Location Fab Initiation Wafer Capacity

ICN8

Fabrication

Fab Initiation

1996

Netherlands

Nijmegen

Wafer Capacity

55,000

1996

55,000

ATMC (Austin Tech & Mfg Center)

Fabrication

Fab Initiation

1995

USA

Austin

Wafer Capacity

30,000

1995

30,000

N/A

Fabrication

Fab Initiation

1989

Germany

Boeblingen

Wafer Capacity

1989

CHD

Fabrication

Fab Initiation

1993

USA

Chandler

Wafer Capacity

30,000

1993

30,000

OHTC

Fabrication

Fab Initiation

1991

USA

Austin

Wafer Capacity

24,000

1991

24,000

New Expansion Fab

Fabrication

Fab Initiation

2026

USA

Austin

Wafer Capacity

2026

ECHO

Fabrication

Fab Initiation

2020

USA

Chandler

Wafer Capacity

10,000

2020

10,000

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