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MC74ACT74DG

Onsemi

MC74ACT74DG by Onsemi

MC74ACT74DG by Onsemi is a CMOS latch/flip-flop with 2 functions. It operates at a nominal voltage of 5V and has a max frequency of 125MHz. This small outline package is commonly used in industrial applications requiring positive edge triggering.

Median Price

$0.330

Lifecycle Status

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24

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1k+

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Chip1Stop

Japan . 58 parts In-Stock

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$0.312

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$0.124

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58

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Arrow

USA . 3,280 parts In-Stock

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$0.336

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$0.195

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$0.152

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$0.128

3,280

$0.336

$0.195

$0.152

$0.128

Mouser Electronics

USA . 583 parts In-Stock

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$0.520

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$0.320

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$0.304

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$0.248

583

$0.520

$0.320

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$0.248

DigiKey

USA . 152 parts In-Stock

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$0.610

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$0.356

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$0.297

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$0.268

152

$0.610

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$0.268

Rochester

USA . 19,969 parts In-Stock

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-

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$0.325

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$0.270

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Verical

USA . 6,820 parts In-Stock

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Avnet

USA . 1,705 parts In-Stock

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Digiode

USA . 1,827 parts In-Stock

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$0.253

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TME

Poland . 20 parts In-Stock

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$0.540

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$0.304

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$0.291

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20

$0.540

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$0.291

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Bristol Electronics

USA . 1,265 parts In-Stock

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$0.698

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$0.279

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$0.195

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$0.181

1,265

$0.698

$0.279

$0.195

$0.181

Flip Electronics

USA . 14,190 parts In-Stock

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NAC Semi

USA . 5,445 parts In-Stock

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$0.392

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Prism Electronics

USA . 3,366 parts In-Stock

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Vyrian

USA . 3,143 parts In-Stock

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Mil-Aero Solutions, Inc.

USA . 1,502 parts In-Stock

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ACDS - Activité Composants Distribution Service

France . 1,265 parts In-Stock

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Dan-Mar Components

USA . 1,265 parts In-Stock

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Atlantic Semiconductor

USA . 791 parts In-Stock

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ECAB

Sweden . 550 parts In-Stock

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Cogito LLC

Ukraine . 237 parts In-Stock

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Microfarads

USA . 95 parts In-Stock

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Nova Conductors

Japan . 95 parts In-Stock

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LWI Electronics Inc

India . 50 parts In-Stock

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Inventory MP

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Corphita

USA . 2,279 parts In-Stock

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$0.239

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Corohmni

South Africa . 328 parts In-Stock

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Semicontronic

India . 3,186 parts In-Stock

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$0.372

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$0.363

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$0.361

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Continental Prestige Electronics

USA . 796 parts In-Stock

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$0.538

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$0.370

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$0.251

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$0.206

796

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$0.206

Aztec Data Supply Inc.

USA . 255 parts In-Stock

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$10.493

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Perfect Parts

USA . 11,019 parts In-Stock

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SupplyDigital Components

Austria . 6,493 parts In-Stock

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Problanco Electronics

Mexico . 6,349 parts In-Stock

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A-Z Elektronik GmbH

Germany . 5,880 parts In-Stock

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TANS Electronics

Latvia . 4,280 parts In-Stock

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GreenTree Electronics

Israel . 3,410 parts In-Stock

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Authorized Procurement Solutions

USA . 2,500 parts In-Stock

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Eastek

USA . 1,705 parts In-Stock

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Bastille Electronics

Australia . 1,000 parts In-Stock

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Kulean Microsystems

USA . 727 parts In-Stock

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Argo Parts USA

USA . 504 parts In-Stock

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UHIMA Technologies

Türkiye . 474 parts In-Stock

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Overview

Discover the MC74ACT74DG by Onsemi, a top-quality latch and flip-flop that will revolutionize your applications. With its advanced technology and industrial-grade design, this product offers unmatched reliability and performance. Whether you're working on data storage, clock synchronization, or signal processing, the MC74ACT74DG delivers precise and efficient results. Its compact size and surface-mount capability make it incredibly versatile, fitting seamlessly into any project. Experience the value and benefits of this exceptional product today and take your projects to new heights with Onsemi's MC74ACT74DG.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

The plastic/epoxy material used for the package body ensures durability and protection for the product, making it a reliable choice.

Surface Mount: YES

The surface mount feature allows for easy installation and integration onto circuit boards, simplifying the assembly process.

No. of Functions: 2

With two functions incorporated into a single product, it offers versatility and efficiency in various applications.

Package Shape: RECTANGULAR

The rectangular package shape of the product enables space-saving designs, making it suitable for compact electronic devices.

No. of Bits: 1

The one-bit design provides simplicity and compatibility with systems requiring a single bit operation, enhancing compatibility and ease of use.

Nominal Supply Voltage / Vsup (V): 5

The nominal supply voltage of 5V ensures compatibility with standard power sources, making it suitable for a wide range of applications.

Load Capacitance (CL): 50 pF

The 50 pF load capacitance allows for efficient signal transmission and manipulation, improving the performance and reliability of the product.

Power Supplies (V): 5

Powered by a 5V power supply, it can be seamlessly integrated into existing systems without requiring additional power sources.

No. of Terminals: 14

With 14 terminals available, it provides ample connectivity options and versatility for various circuit configurations.

Package Style (Meter): SMALL OUTLINE

The small outline package style ensures space efficiency, enabling the utilization of the product in compact designs.

Maximum I (ol) 24 Amp

The maximum output current of 24 Amp allows for high-power operation, making it suitable for applications that require robust performance.

Propagation Delay (tpd): 13 ns

With a propagation delay of 13 ns, it offers fast signal processing and response times, enhancing the overall operational efficiency.

Maximum Operating Temperature: 85 °C

The maximum operating temperature of 85°C ensures reliability and stability in demanding environments, making it suitable for industrial applications.

Trigger Type: POSITIVE EDGE

The positive edge trigger type enables precise control and synchronization of signals, offering enhanced functionality and accuracy.

Minimum Operating Temperature: -40 °C

With a minimum operating temperature of -40°C, it can withstand extreme cold conditions, making it suitable for various environments.

Terminal Finish: MATTE TIN

The matte tin terminal finish provides excellent conductivity and corrosion resistance, ensuring optimal performance and longevity.

Terminal Position: DUAL

The dual terminal position allows for versatile mounting options, providing flexibility in circuit board layouts and configurations.

Maximum Seated Height: 1.75 mm

The maximum seated height of 1.75 mm ensures compactness and ease of integration, enabling its use in space-constrained applications.

Width: 3.9 mm

With a width of 3.9 mm, it offers a compact form factor, facilitating space-efficient designs.

Output Polarity: COMPLEMENTARY

The complementary output polarity provides flexibility and compatibility with various system architectures and logic circuits.

Minimum Supply Voltage (Vsup): 4.5 V

With a minimum supply voltage of 4.5V, it can operate efficiently even with slightly lower power sources, enhancing flexibility in power supply options.

Maximum Time At Peak Reflow Temperature (s): 30

The maximum time at peak reflow temperature of 30 seconds ensures proper soldering and assembly during manufacturing processes, ensuring reliable performance.

Peak Reflow Temperature °C: 260

With a peak reflow temperature of 260°C, it can withstand high-temperature soldering processes without damage, ensuring robust construction and reliability.

Length: 8.65 mm

With a length of 8.65 mm, it offers a compact footprint, allowing for space-saving designs and integration.

Temperature Grade: INDUSTRIAL

The industrial temperature grade designation ensures reliability and performance in harsh operating conditions, making it suitable for industrial applications.

Maximum Frequency At Nominal Supply: 125000000 Hz

With a maximum frequency of 125,000,000 Hz, it provides high-speed operation, facilitating quick data processing and manipulation.

Technology: CMOS

Utilizing CMOS technology, it offers low power consumption, high noise immunity, and compatibility with various logic families, making it an efficient and versatile choice.

Terminal Form: GULL WING

The gull-wing terminal form ensures secure and reliable soldering connections, reducing the risk of solder joint failures and improving overall reliability.

Terminal Pitch: 1.27 mm

With a terminal pitch of 1.27 mm, it enables precise and compact placement on circuit boards, allowing for intricate and space-efficient designs.

Minimum fmax: 125 MHz

The minimum fmax of 125 MHz ensures compatibility and high-speed performance, making it suitable for applications requiring quick signal processing.

Moisture Sensitivity Level (MSL): 1

With an MSL rating of 1, it exhibits excellent resistance to moisture and humidity, ensuring long-term reliability and performance.

Maximum Supply Voltage (Vsup): 5.5 V

With a maximum supply voltage of 5.5V, it can safely operate within a wide voltage range, offering flexibility in power supply options.

Technical Specifications

Latches & Flip-Flops MC74ACT74DG attributes and parameters. Explore more Latches & Flip-Flops devices from Onsemi

Specs

Family:

ACT

JESD-30 Code:

R-PDSO-G14

JESD-609 Code:

e3

Length:

8.65 mm

Load Capacitance (CL):

50 pF

Logic IC Type:

Maximum Frequency At Nominal Supply:

125000000 Hz

Maximum I (ol):

24 Amp

Moisture Sensitivity Level (MSL):

1

No. of Bits:

1

No. of Functions:

2

No. of Terminals:

14

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

-40 Cel

Output Polarity:

COMPLEMENTARY

Package Body Material:

PLASTIC/EPOXY

Package Code:

SOP

Package Equivalence Code:

SOP14,.25

Package Shape:

Package Style (Meter):

SMALL OUTLINE

Peak Reflow Temperature (C):

260

Power Supplies (V):

5

Propagation Delay (tpd):

13 ns

Qualification:

Not Qualified

Maximum Seated Height:

1.75 mm

Sub-Category:

FF/Latches

Maximum Supply Voltage (Vsup):

5.5 V

Minimum Supply Voltage (Vsup):

4.5 V

Nominal Supply Voltage / Vsup (V):

5

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Finish:

MATTE TIN

Terminal Form:

Terminal Pitch:

1.27 mm

Terminal Position:

DUAL

Maximum Time At Peak Reflow Temperature (s):

30

Trigger Type:

POSITIVE EDGE

Width:

3.9 mm

Minimum fmax:

125 MHz

Trade Compliance

MC74ACT74DG Logic ICs trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8542.39.00.01

SB

8542.39.00.00

Manufacturer Highlights

Onsemi

Established in 1999, Onsemi is a leading global provider of power and image-sensing technologies. They are dedicated to building a better future for the automotive, industrial, cloud, medical, and IoT markets. Onsemi's core technologies include analog, digital, and mixed-signal products that offer innovative solutions for advanced automotive systems; highly reliable power management products for industrial applications; low-cost imaging solutions for medical equipment and consumer electronics; and robust communication architectures for the Internet of Things (IoT).

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Management team

President, CEO

Hassane El-Khoury

Executive VP, CFO, Treasurer

Thad Trent

Senior VP

Ross F. Jatou

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

Aizu Fab

Fabrication

Fab Initiation

1995

Japan

Aizu Wakamatsu

Wafer Capacity

52,000

1995

52,000

Si/EPI Fab

Fabrication

Fab Initiation

2018

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

10,000

2018

10,000

Expansion Phase 1 for SiC / EPI

Fabrication

Fab Initiation

2019

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

14,500

2019

14,500

Expansion Phase 2 for SiC / EPI

Fabrication

Fab Initiation

2024

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

2024

SiC Fab

Fabrication

Fab Initiation

2022

USA

Hudson

Wafer Capacity

2022

Bucheon

Fabrication

Fab Initiation

2013

South Korea

Bucheon

Wafer Capacity

61,000

2013

61,000

ISMF - Malaysia

Fabrication

Fab Initiation

1990

Malaysia

Seremban

Wafer Capacity

95,000

1990

95,000

Roznov Device Fab

Fabrication

Fab Initiation

1987

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

80,000

1987

80,000

Fab 10

Fabrication

Fab Initiation

2002

USA

East Fishkill

Wafer Capacity

15,000

2002

15,000

Burlington

Fabrication

Fab Initiation

1986

Canada

Burlington

Wafer Capacity

1986

Gresham

Fabrication

Fab Initiation

1998

USA

Gresham

Wafer Capacity

45,000

1998

45,000

Bucheon 150mm

Fabrication

Fab Initiation

2000

South Korea

Bucheon

Wafer Capacity

50,000

2000

50,000

Rochester

Fabrication

Fab Initiation

1983

USA

Rochester

Wafer Capacity

10,000

1983

10,000

Nampa

Fabrication

Fab Initiation

1995

USA

Nampa

Wafer Capacity

1995

Pennsylvania

Fabrication

Fab Initiation

1997

USA

Mountain Top

Wafer Capacity

36,000

1997

36,000

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