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SN74AHC74PWLE

Texas Instruments

SN74AHC74PWLE by Texas Instruments

SN74AHC74PWLE by Texas Instruments is a dual-function latches & flip-flops IC with 10.5 ns propagation delay at 3.3V, suitable for automotive applications. It operates b/w -40 to 125°C, has a max frequency of 75MHz, and features positive edge triggering. This CMOS technology chip comes in a small outline package with surface mount capability.

Median Price

$0.060

Lifecycle Status

Suppliers In-Stock

6

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

American Microsemiconductor Inc.

USA . 1,884 parts In-Stock

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$0.060

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$0.060

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Chip Stock

USA . 48,500 parts In-Stock

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48,500

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Vyrian

USA . 7,577 parts In-Stock

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7,577

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EMSNET

USA . 2,000 parts In-Stock

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2,000

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Digiode

USA . 314 parts In-Stock

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314

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Nova Conductors

Japan . 300 parts In-Stock

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300

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Distributors (Availability)

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AZTECH Wire

Italy . 200 parts In-Stock

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$5.607

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200

$5.607

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Semicontronic

India . 242 parts In-Stock

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$12.000

100+ parts

$11.700

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$11.640

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242

$12.000

$11.700

$11.640

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Corohmni

South Africa . 201 parts In-Stock

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$22.352

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201

$22.352

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Parana Technologies

USA . 2,100 parts In-Stock

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$29.935

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$64.930

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2,100

$29.935

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$64.930

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DigiPath Technology Company

USA . 795 parts In-Stock

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$32.962

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795

$32.962

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ChromeModa Solutions

Germany . 1,789 parts In-Stock

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$33.635

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$27.581

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$27.581

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IDEA Electronic Components Group

UK . 1,169 parts In-Stock

1+ parts

$33.635

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$31.953

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$30.272

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1,169

$33.635

$31.953

$30.272

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Ampacity Inc.

Singapore . 1,153 parts In-Stock

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$51.000

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One Stop Electronics

USA . 603 parts In-Stock

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$54.000

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Continental Prestige Electronics

USA . 5,620 parts In-Stock

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Corphita

USA . 1,748 parts In-Stock

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Bastille Electronics

Australia . 300 parts In-Stock

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300

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Argo Parts USA

USA . 81 parts In-Stock

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Overview

Experience the superior quality and reliability of Texas Instruments with the SN74AHC74PWLE, a top-of-the-line latches & flip-flops component that guarantees exceptional performance. Perfect for a wide range of applications, this product offers customers unparalleled value with its advanced technology and innovative design. Trust in Texas Instruments to provide you with the best solutions for your electronic needs, ensuring efficiency and precision every step of the way. Choose the SN74AHC74PWLE for unbeatable quality and unbeatable results.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

Plastic/Epoxy material is lightweight and durable, making the latch or flip-flop easier to handle and less prone to damage during installation or operation.

Propagation Delay At Nominal Supply: 10.5 ns

Low propagation delay ensures fast operation, making this latch or flip-flop suitable for high-speed applications where quick response times are crucial.

Surface Mount: YES

Surface mount capability allows for easy PCB assembly and space-saving integration, making this latch or flip-flop ideal for compact electronic devices.

Nominal Supply Voltage / Vsup (V): 3.3

Operates at a common supply voltage of 3.3V, making it compatible with a wide range of electronic systems and power sources.

Maximum Operating Temperature: 125 °C

High maximum operating temperature allows this latch or flip-flop to withstand harsh environmental conditions, making it suitable for automotive and industrial applications.

Technical Specifications

Latches & Flip-Flops SN74AHC74PWLE attributes and parameters. Explore more Latches & Flip-Flops devices from Texas Instruments

Specs

Family:

AHC/VHC/H/U/V

JESD-30 Code:

R-PDSO-G14

Length:

5 mm

Load Capacitance (CL):

50 pF

Logic IC Type:

Maximum Frequency At Nominal Supply:

75000000 Hz

Maximum I (ol):

8 Amp

No. of Bits:

1

No. of Functions:

2

No. of Terminals:

14

Maximum Operating Temperature:

125 Cel

Minimum Operating Temperature:

-40 Cel

Output Polarity:

COMPLEMENTARY

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Equivalence Code:

TSSOP14,.25

Package Shape:

Package Style (Meter):

SMALL OUTLINE, THIN PROFILE, SHRINK PITCH

Packing Method:

TR

Peak Reflow Temperature (C):

NOT SPECIFIED

Power Supplies (V):

2/5.5

Propagation Delay At Nominal Supply:

10.5 ns

Propagation Delay (tpd):

17.5 ns

Qualification:

Not Qualified

Maximum Seated Height:

1.2 mm

Sub-Category:

FF/Latches

Maximum Supply Voltage (Vsup):

5.5 V

Minimum Supply Voltage (Vsup):

2 V

Nominal Supply Voltage / Vsup (V):

3.3

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Form:

Terminal Pitch:

.65 mm

Terminal Position:

DUAL

Maximum Time At Peak Reflow Temperature (s):

NOT SPECIFIED

Trigger Type:

POSITIVE EDGE

Width:

4.4 mm

Minimum fmax:

110 MHz

Trade Compliance

SN74AHC74PWLE Logic ICs trade compliance attributes, and parameters.

HTS

8542.39.00.01

SB

8542.39.00.00

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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