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MC14013BCPG

Onsemi

MC14013BCPG by Onsemi

MC14013BCPG by Onsemi is a CMOS Latches & Flip-Flops IC with 2 functions, 350 ns propagation delay at 5V. It operates in the temperature range of -55 to 125 °C and has a max frequency of 2MHz. Ideal for military-grade applications requiring positive edge triggering and complementary output polarity.

Median Price

$2.112

Lifecycle Status

Suppliers In-Stock

16

In-Stock Inventory

1k+

Distributors (In-Stock)

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Nova Conductors

Japan . 45 parts In-Stock

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$0.261

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Component Electronics Inc.

Canada . 60 parts In-Stock

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$3.080

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$2.310

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$2.000

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$3.080

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Chip Stock

USA . 14,510 parts In-Stock

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Vyrian

USA . 12,630 parts In-Stock

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Cyclops Electronics Ltd

UK . 10,000 parts In-Stock

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Digiode

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North Shore Components

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Bristol Electronics

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Atlantic Semiconductor

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Sensible Micro Corp

USA . 57 parts In-Stock

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Semtec, LLC

USA . 50 parts In-Stock

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ComSIT Distribution GmbH

Germany . 24 parts In-Stock

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Prism Electronics

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Diverse Electronics

Canada . 10 parts In-Stock

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4 Star Electronics, Inc.

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LittleDiode

UK . 2 parts In-Stock

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Distributors (Availability)

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Aranea Global

USA . 1,000 parts In-Stock

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$0.256

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$0.246

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$0.256

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Continental Prestige Electronics

USA . 2,602 parts In-Stock

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$0.261

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$0.256

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Argo Parts USA

USA . 749 parts In-Stock

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$0.261

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$0.253

749

$0.261

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$0.253

Benley Electronics

USA . 14 parts In-Stock

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$1.000

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Corohmni

South Africa . 67 parts In-Stock

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$2.112

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Semicontronic

India . 457 parts In-Stock

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$9.000

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$8.775

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$8.730

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$9.000

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Aztec Data Supply Inc.

USA . 1,676 parts In-Stock

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$9.919

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AZTECH Wire

Italy . 594 parts In-Stock

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Ampacity Inc.

Singapore . 1,603 parts In-Stock

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Kepictronics

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Authorized Procurement Solutions

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Lixinc

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Kulean Microsystems

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TANS Electronics

Latvia . 8,122 parts In-Stock

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Problanco Electronics

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Corphita

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SupplyDigital Components

Austria . 615 parts In-Stock

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Microchip USA

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UHIMA Technologies

Türkiye . 399 parts In-Stock

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Futuretech Components

Singapore . 344 parts In-Stock

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Component Stockers USA

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USA . 23 parts In-Stock

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Overview

Elevate your electronic designs with the MC14013BCPG by Onsemi, a top-tier manufacturer renowned for quality and reliability. As a leading product in the Latches & Flip-Flops category, this component offers unmatched performance and precision. With fast propagation delay and versatile applications, this device is perfect for a wide range of projects. Experience the value and benefits of choosing Onsemi for your next design project and unlock a world of possibilities with the MC14013BCPG.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

This material provides durability and protection for the internal components of the latch or flip-flop, ensuring a longer lifespan.

Propagation Delay At Nominal Supply: 350 ns

The low propagation delay allows for fast and efficient operation, making this latch or flip-flop suitable for time-sensitive applications.

No. of Functions: 2

Having multiple functions in a single device maximizes functionality and saves space in the circuit design.

Nominal Supply Voltage / Vsup (V): 5

Operates at a standard voltage level of 5V, making it compatible with a wide range of systems and components.

Temperature Grade: MILITARY

Designed to meet military-grade standards, ensuring reliability and performance in harsh environments.

Technical Specifications

Latches & Flip-Flops MC14013BCPG attributes and parameters. Explore more Latches & Flip-Flops devices from Onsemi

Specs

Family:

4000/14000/40000

JESD-30 Code:

R-PDIP-T14

JESD-609 Code:

e3

Length:

18.86 mm

Load Capacitance (CL):

50 pF

Logic IC Type:

Maximum Frequency At Nominal Supply:

2000000 Hz

No. of Bits:

1

No. of Functions:

2

No. of Terminals:

14

Maximum Operating Temperature:

125 Cel

Minimum Operating Temperature:

-55 Cel

Output Polarity:

COMPLEMENTARY

Package Body Material:

PLASTIC/EPOXY

Package Code:

DIP

Package Equivalence Code:

DIP14,.3

Package Shape:

Package Style (Meter):

IN-LINE

Packing Method:

RAIL

Peak Reflow Temperature (C):

260

Power Supplies (V):

5/15

Propagation Delay At Nominal Supply:

350 ns

Propagation Delay (tpd):

350 ns

Qualification:

Not Qualified

Maximum Seated Height:

4.69 mm

Sub-Category:

FF/Latches

Maximum Supply Voltage (Vsup):

18 V

Minimum Supply Voltage (Vsup):

3 V

Nominal Supply Voltage / Vsup (V):

5

Surface Mount:

NO

Technology:

CMOS

Temperature Grade:

Terminal Finish:

Tin (Sn)

Terminal Form:

Terminal Pitch:

2.54 mm

Terminal Position:

DUAL

Trigger Type:

POSITIVE EDGE

Width:

7.62 mm

Minimum fmax:

7 MHz

Trade Compliance

MC14013BCPG Logic ICs trade compliance attributes, and parameters.

HTS

8542.39.00.01

SB

8542.39.00.00

NSN

5962-01-077-2242, 5962010772242

NIIN

010772242

PCN

Manufacturer Highlights

Onsemi

Established in 1999, Onsemi is a leading global provider of power and image-sensing technologies. They are dedicated to building a better future for the automotive, industrial, cloud, medical, and IoT markets. Onsemi's core technologies include analog, digital, and mixed-signal products that offer innovative solutions for advanced automotive systems; highly reliable power management products for industrial applications; low-cost imaging solutions for medical equipment and consumer electronics; and robust communication architectures for the Internet of Things (IoT).

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Management team

President, CEO

Hassane El-Khoury

Executive VP, CFO, Treasurer

Thad Trent

Senior VP

Ross F. Jatou

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

Aizu Fab

Fabrication

Fab Initiation

1995

Japan

Aizu Wakamatsu

Wafer Capacity

52,000

1995

52,000

Si/EPI Fab

Fabrication

Fab Initiation

2018

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

10,000

2018

10,000

Expansion Phase 1 for SiC / EPI

Fabrication

Fab Initiation

2019

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

14,500

2019

14,500

Expansion Phase 2 for SiC / EPI

Fabrication

Fab Initiation

2024

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

2024

SiC Fab

Fabrication

Fab Initiation

2022

USA

Hudson

Wafer Capacity

2022

Bucheon

Fabrication

Fab Initiation

2013

South Korea

Bucheon

Wafer Capacity

61,000

2013

61,000

ISMF - Malaysia

Fabrication

Fab Initiation

1990

Malaysia

Seremban

Wafer Capacity

95,000

1990

95,000

Roznov Device Fab

Fabrication

Fab Initiation

1987

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

80,000

1987

80,000

Fab 10

Fabrication

Fab Initiation

2002

USA

East Fishkill

Wafer Capacity

15,000

2002

15,000

Burlington

Fabrication

Fab Initiation

1986

Canada

Burlington

Wafer Capacity

1986

Gresham

Fabrication

Fab Initiation

1998

USA

Gresham

Wafer Capacity

45,000

1998

45,000

Bucheon 150mm

Fabrication

Fab Initiation

2000

South Korea

Bucheon

Wafer Capacity

50,000

2000

50,000

Rochester

Fabrication

Fab Initiation

1983

USA

Rochester

Wafer Capacity

10,000

1983

10,000

Nampa

Fabrication

Fab Initiation

1995

USA

Nampa

Wafer Capacity

1995

Pennsylvania

Fabrication

Fab Initiation

1997

USA

Mountain Top

Wafer Capacity

36,000

1997

36,000

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