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MC14013BDR2G

Onsemi

MC14013BDR2G by Onsemi

MC14013BDR2G by Onsemi is a CMOS latch with 350ns propagation delay, suitable for military applications. It operates at 5V with 14 terminals and a load capacitance of 50pF. The flip-flop has a max frequency of 2MHz and can handle supply voltages up to 18V, making it ideal for high-speed digital circuits.

Median Price

$0.189

Lifecycle Status

Suppliers In-Stock

30

In-Stock Inventory

1k+

Distributors (Authorized)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Rochester

USA . 161,010 parts In-Stock

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$0.150

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$0.140

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Newark

USA . 2,700 parts In-Stock

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DigiKey

USA . 22,066 parts In-Stock

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$0.490

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$0.267

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$0.229

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22,066

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$0.267

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$0.211

Mouser Electronics

USA . 19,753 parts In-Stock

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$0.268

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19,753

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$0.268

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EBV Elektronik

Germany . 362,500 parts In-Stock

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Chip1Stop

Japan . 162,500 parts In-Stock

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Arrow

USA . 125,000 parts In-Stock

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Verical

USA . 125,000 parts In-Stock

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Future Electronics

Canada . 45,000 parts In-Stock

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Master Electronics

USA . 10,000 parts In-Stock

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$0.216

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Farnell

UK . 9,565 parts In-Stock

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$0.231

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Element14

Singapore . 9,565 parts In-Stock

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$0.385

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Adafruit Industries

USA . 550 parts In-Stock

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Nova Conductors

Japan . 91 parts In-Stock

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TME

Poland . 151 parts In-Stock

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Bristol Electronics

USA . 2,475 parts In-Stock

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$0.137

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Digiode

USA . 1,041 parts In-Stock

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Flip Electronics

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IBS Electronics

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NAC Semi

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Vyrian

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Chip Stock

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Sensible Micro Corp

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Electro Sonic

Canada . 10,000 parts In-Stock

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ComSIT Distribution GmbH

Germany . 6,024 parts In-Stock

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Speed Components Ltd

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Classic Components Corporation

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Prism Electronics

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Atlantic Semiconductor

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Ampacity Inc.

Singapore . 50,369 parts In-Stock

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$0.098

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Semicontronic

India . 69,005 parts In-Stock

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Corohmni

South Africa . 122 parts In-Stock

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Argo Parts USA

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Continental Prestige Electronics

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Corphita

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Aztec Data Supply Inc.

USA . 2,530 parts In-Stock

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Perfect Parts

USA . 1,231,048 parts In-Stock

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RC Electronics

USA . 94,427 parts In-Stock

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Metaverse IC Inc.

Canada . 80,109 parts In-Stock

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GreenTree Electronics

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QUARKTWIN TECHNOLOGY LTD

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TANS Electronics

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Kulean Microsystems

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Authorized Procurement Solutions

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Problanco Electronics

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Microchip USA

USA . 5,487 parts In-Stock

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SupplyDigital Components

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Lixinc

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Assy Fe

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Glotronic Ltd.

UK . 2,000 parts In-Stock

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iodParts Technologies Inc.

India . 1,795 parts In-Stock

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Bastille Electronics

Australia . 800 parts In-Stock

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UHIMA Technologies

Türkiye . 785 parts In-Stock

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Advanced Electronics

New Zealand . 550 parts In-Stock

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Robosynatics

Brazil . 325 parts In-Stock

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$13.655

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$13.377

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Lucentia Tech

USA . 325 parts In-Stock

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$13.655

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$13.377

Overview

Discover the innovative MC14013BDR2G by Onsemi, a top-tier manufacturer known for delivering high-quality latches & flip-flops. This versatile product offers exceptional value and benefits to customers in various applications. With a nominal supply voltage of 5V and a propagation delay of 350 ns, this device ensures reliable performance. Whether you're looking to enhance your circuit design or streamline your project, the MC14013BDR2G is the perfect choice. Trust Onsemi for cutting-edge technology and superior quality.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

The plastic/epoxy material used for the package body provides durability and protection for the internal components of the latch or flip-flop.

Propagation Delay At Nominal Supply: 350 ns

The low propagation delay ensures quick response times, making this product suitable for high-speed applications.

Surface Mount: YES

Being surface mountable makes installation easier and more efficient, especially in compact electronic devices.

Nominal Supply Voltage / Vsup (V): 5

The 5V supply voltage is commonly used in many electronic systems, ensuring compatibility with a wide range of applications.

Temperature Grade: MILITARY

The military-grade temperature rating means this product can operate in harsh environments with extreme temperature variations.

Technology: CMOS

The CMOS technology offers low power consumption and high noise immunity, making it ideal for battery-operated devices and noise-sensitive applications.

Technical Specifications

Latches & Flip-Flops MC14013BDR2G attributes and parameters. Explore more Latches & Flip-Flops devices from Onsemi

Specs

Family:

4000/14000/40000

JESD-30 Code:

R-PDSO-G14

JESD-609 Code:

e3

Length:

8.65 mm

Load Capacitance (CL):

50 pF

Logic IC Type:

Maximum Frequency At Nominal Supply:

2000000 Hz

Moisture Sensitivity Level (MSL):

1

No. of Bits:

1

No. of Functions:

2

No. of Terminals:

14

Maximum Operating Temperature:

125 Cel

Minimum Operating Temperature:

-55 Cel

Output Polarity:

COMPLEMENTARY

Package Body Material:

PLASTIC/EPOXY

Package Code:

SOP

Package Equivalence Code:

SOP14,.25

Package Shape:

Package Style (Meter):

SMALL OUTLINE

Packing Method:

TR

Peak Reflow Temperature (C):

260

Power Supplies (V):

5/15

Propagation Delay At Nominal Supply:

350 ns

Propagation Delay (tpd):

350 ns

Qualification:

Not Qualified

Maximum Seated Height:

1.75 mm

Sub-Category:

FF/Latches

Maximum Supply Voltage (Vsup):

18 V

Minimum Supply Voltage (Vsup):

3 V

Nominal Supply Voltage / Vsup (V):

5

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Finish:

MATTE TIN

Terminal Form:

Terminal Pitch:

1.27 mm

Terminal Position:

DUAL

Maximum Time At Peak Reflow Temperature (s):

30

Trigger Type:

POSITIVE EDGE

Width:

3.9 mm

Minimum fmax:

7 MHz

Trade Compliance

MC14013BDR2G Logic ICs trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8542.39.00.01

SB

8542.39.00.00

PCN

Manufacturer Highlights

Onsemi

Established in 1999, Onsemi is a leading global provider of power and image-sensing technologies. They are dedicated to building a better future for the automotive, industrial, cloud, medical, and IoT markets. Onsemi's core technologies include analog, digital, and mixed-signal products that offer innovative solutions for advanced automotive systems; highly reliable power management products for industrial applications; low-cost imaging solutions for medical equipment and consumer electronics; and robust communication architectures for the Internet of Things (IoT).

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Management team

President, CEO

Hassane El-Khoury

Executive VP, CFO, Treasurer

Thad Trent

Senior VP

Ross F. Jatou

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

Aizu Fab

Fabrication

Fab Initiation

1995

Japan

Aizu Wakamatsu

Wafer Capacity

52,000

1995

52,000

Si/EPI Fab

Fabrication

Fab Initiation

2018

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

10,000

2018

10,000

Expansion Phase 1 for SiC / EPI

Fabrication

Fab Initiation

2019

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

14,500

2019

14,500

Expansion Phase 2 for SiC / EPI

Fabrication

Fab Initiation

2024

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

2024

SiC Fab

Fabrication

Fab Initiation

2022

USA

Hudson

Wafer Capacity

2022

Bucheon

Fabrication

Fab Initiation

2013

South Korea

Bucheon

Wafer Capacity

61,000

2013

61,000

ISMF - Malaysia

Fabrication

Fab Initiation

1990

Malaysia

Seremban

Wafer Capacity

95,000

1990

95,000

Roznov Device Fab

Fabrication

Fab Initiation

1987

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

80,000

1987

80,000

Fab 10

Fabrication

Fab Initiation

2002

USA

East Fishkill

Wafer Capacity

15,000

2002

15,000

Burlington

Fabrication

Fab Initiation

1986

Canada

Burlington

Wafer Capacity

1986

Gresham

Fabrication

Fab Initiation

1998

USA

Gresham

Wafer Capacity

45,000

1998

45,000

Bucheon 150mm

Fabrication

Fab Initiation

2000

South Korea

Bucheon

Wafer Capacity

50,000

2000

50,000

Rochester

Fabrication

Fab Initiation

1983

USA

Rochester

Wafer Capacity

10,000

1983

10,000

Nampa

Fabrication

Fab Initiation

1995

USA

Nampa

Wafer Capacity

1995

Pennsylvania

Fabrication

Fab Initiation

1997

USA

Mountain Top

Wafer Capacity

36,000

1997

36,000

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