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CD74AC273M96E4

Texas Instruments

CD74AC273M96E4 by Texas Instruments

CD74AC273M96E4 by Texas Instruments is an 8-bit latch with a 3.3V nominal voltage and 50pF load capacitance. It operates at temperatures ranging from -55 to 125°C, making it suitable for military-grade applications requiring a max frequency of 71MHz. This surface-mount flip-flop has a small outline package style and Gull Wing terminal form, ideal for compact electronic designs.

Median Price

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Lifecycle Status

Suppliers In-Stock

4

In-Stock Inventory

1k+

Distributors (In-Stock)

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Vyrian

USA . 8,732 parts In-Stock

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Chip Stock

USA . 7,320 parts In-Stock

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Digiode

USA . 1,684 parts In-Stock

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Nova Conductors

Japan . 650 parts In-Stock

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650

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Distributors (Availability)

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AZTECH Wire

Italy . 568 parts In-Stock

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$10.026

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568

$10.026

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Parana Technologies

USA . 967 parts In-Stock

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$11.086

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$11.545

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967

$11.086

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$11.545

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DigiPath Technology Company

USA . 1,099 parts In-Stock

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$12.207

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$11.230

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1,099

$12.207

$11.230

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ChromeModa Solutions

Germany . 2,730 parts In-Stock

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$12.456

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$10.214

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$12.456

$10.214

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IDEA Electronic Components Group

UK . 347 parts In-Stock

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$12.456

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$11.833

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$11.210

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347

$12.456

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One Stop Electronics

USA . 157 parts In-Stock

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$14.000

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157

$14.000

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Corohmni

South Africa . 33 parts In-Stock

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$26.607

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33

$26.607

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Semicontronic

India . 637 parts In-Stock

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$33.000

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$32.175

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$32.010

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$33.000

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$32.010

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Ampacity Inc.

Singapore . 707 parts In-Stock

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$42.000

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$42.000

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Corphita

USA . 1,774 parts In-Stock

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Bastille Electronics

Australia . 500 parts In-Stock

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Argo Parts USA

USA . 176 parts In-Stock

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Continental Prestige Electronics

USA . 39 parts In-Stock

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Overview

Enhance your electronic projects with the CD74AC273M96E4 by Texas Instruments. As a leader in the industry, Texas Instruments delivers top-notch quality and reliability. This latch & flip-flop component offers seamless integration and versatile applications, making it an essential tool for any electronics enthusiast. With its high performance and efficient design, this product ensures smooth operation and optimal results. Upgrade your projects today with the CD74AC273M96E4 and experience the difference that Texas Instruments brings to the table.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

The use of plastic/epoxy material makes this latch & flip-flop lightweight and durable for various electronic applications.

Surface Mount: YES

With the ability to be surface mounted, this product offers easy installation and space-saving design in electronic circuits.

Package Shape: RECTANGULAR

The rectangular package shape provides a standard form factor for ease of integration into circuit designs.

No. of Bits: 8

This latch & flip-flop has 8 bits, allowing for versatile and complex digital data handling capabilities.

Nominal Supply Voltage / Vsup (V): 3.3

The 3.3V nominal supply voltage ensures compatibility with a wide range of electronic devices for seamless integration.

Load Capacitance (CL): 50 pF

With a load capacitance of 50 pF, this product offers stable and reliable performance in various circuit configurations.

Power Supplies (V): 3.3/5

Supporting both 3.3V and 5V power supplies, this latch & flip-flop offers flexibility in voltage requirements for compatibility with different systems.

No. of Terminals: 20

The 20 terminals provide multiple connection points for enhanced connectivity options in circuit designs.

Package Style (Meter): SMALL OUTLINE

The small outline package style ensures efficient use of space on a circuit board while maintaining a compact size.

Maximum I (ol): 12 Amp

With a maximum output current of 12 Amps, this latch & flip-flop can handle high power requirements in electronic applications.

Technical Specifications

Latches & Flip-Flops CD74AC273M96E4 attributes and parameters. Explore more Latches & Flip-Flops devices from Texas Instruments

Specs

Family:

AC

JESD-30 Code:

R-PDSO-G20

JESD-609 Code:

e4

Length:

12.8 mm

Load Capacitance (CL):

50 pF

Logic IC Type:

Maximum Frequency At Nominal Supply:

71000000 Hz

Maximum I (ol):

12 Amp

Moisture Sensitivity Level (MSL):

1

No. of Bits:

8

No. of Functions:

1

No. of Terminals:

20

Maximum Operating Temperature:

125 Cel

Minimum Operating Temperature:

-55 Cel

Output Polarity:

TRUE

Package Body Material:

PLASTIC/EPOXY

Package Code:

SOP

Package Equivalence Code:

SOP20,.4

Package Shape:

Package Style (Meter):

SMALL OUTLINE

Packing Method:

TR

Peak Reflow Temperature (C):

260

Power Supplies (V):

3.3/5

Propagation Delay (tpd):

169 ns

Qualification:

Not Qualified

Maximum Seated Height:

2.65 mm

Sub-Category:

FF/Latch

Maximum Supply Voltage (Vsup):

5.5 V

Minimum Supply Voltage (Vsup):

1.5 V

Nominal Supply Voltage / Vsup (V):

3.3

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Finish:

NICKEL PALLADIUM GOLD

Terminal Form:

Terminal Pitch:

1.27 mm

Terminal Position:

DUAL

Maximum Time At Peak Reflow Temperature (s):

30

Trigger Type:

POSITIVE EDGE

Width:

7.5 mm

Minimum fmax:

100 MHz

Trade Compliance

CD74AC273M96E4 Logic ICs trade compliance attributes, and parameters.

HTS

8542.39.00.01

SB

8542.39.00.00

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

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Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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