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CD74HCT174M

Texas Instruments

CD74HCT174M by Texas Instruments

CD74HCT174M by Texas Instruments is a 6-bit latches & flip-flops IC with a propagation delay of 60 ns at 5V. It operates in the temperature range of -55 to 125°C, suitable for military-grade applications. With a max frequency of 17 MHz, it is ideal for high-speed digital systems requiring fast data transfer.

Median Price

$0.790

Lifecycle Status

Suppliers In-Stock

30

In-Stock Inventory

1k+

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Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

DigiKey

USA . 1,488 parts In-Stock

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$1.120

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$0.701

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$0.562

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1,488

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Mouser Electronics

USA . 1,376 parts In-Stock

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$1.280

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$0.541

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$0.495

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$1.280

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$0.495

Rochester

USA . 19,865 parts In-Stock

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-

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$0.776

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$0.644

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$0.574

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Verical

USA . 5,689 parts In-Stock

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Master Electronics

USA . 1,096 parts In-Stock

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$0.700

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Chip1Stop

Japan . 1,096 parts In-Stock

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Distributors (In-Stock)

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Nova Conductors

Japan . 500 parts In-Stock

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$0.498

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$0.498

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Digiode

USA . 2,154 parts In-Stock

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$0.505

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$0.505

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Component Electronics Inc.

Canada . 10 parts In-Stock

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$1.230

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$0.920

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$0.800

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10

$1.230

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Vyrian

USA . 4,759 parts In-Stock

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Q Components

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Rapid Electronics

USA . 1,096 parts In-Stock

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IBS Electronics

USA . 1,096 parts In-Stock

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Prism Electronics

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TME

Poland . 899 parts In-Stock

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$0.551

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ComSIT Distribution GmbH

Germany . 669 parts In-Stock

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M&R Communications

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Resion

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NPI Materials, Inc.

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Bristol Electronics

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Atlantic Semiconductor

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Semi Source

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ACDS - Activité Composants Distribution Service

France . 80 parts In-Stock

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Connector Distribution Corp

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Right Parts Inc.

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Electronics Depot

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Florida Circuit

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A2Z Electronics, Inc.

USA . 23 parts In-Stock

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EMSNET

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North Shore Components

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Distributors (Availability)

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Corphita

USA . 59 parts In-Stock

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$0.479

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Aranea Global

USA . 2,000 parts In-Stock

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$0.488

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$0.469

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Argo Parts USA

USA . 4,318 parts In-Stock

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$0.498

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$0.483

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Continental Prestige Electronics

USA . 2,984 parts In-Stock

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$0.498

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$0.488

2,984

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Parana Technologies

USA . 1,183 parts In-Stock

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$8.492

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$9.146

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$8.492

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DigiPath Technology Company

USA . 166 parts In-Stock

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$9.351

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$8.603

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$9.351

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IDEA Electronic Components Group

UK . 578 parts In-Stock

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$9.542

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$9.065

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$8.588

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ChromeModa Solutions

Germany . 146 parts In-Stock

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$9.542

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$7.824

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Microchip USA

USA . 1,789 parts In-Stock

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$26.670

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$26.290

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$26.100

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$25.910

1,789

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$25.910

Corohmni

South Africa . 1,229 parts In-Stock

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$32.017

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QUARKTWIN TECHNOLOGY LTD

USA . 25,299 parts In-Stock

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Perfect Parts

USA . 12,665 parts In-Stock

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Authorized Procurement Solutions

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Supply Digital

USA . 2,526 parts In-Stock

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Overview

Discover the unparalleled reliability and performance of the CD74HCT174M by Texas Instruments, a top-tier manufacturer in the industry. As a part of the Latches & Flip-Flops category, this product offers seamless integration and precision for a wide range of applications. With a nominal supply voltage of 5V and a propagation delay of just 60 ns, this small outline package brings unmatched value to customers seeking efficiency and quality. Trust Texas Instruments to deliver excellence with every component.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

This material is lightweight and durable, making the latch or flip-flop easy to handle and resistant to damage.

Propagation Delay At Nominal Supply: 60 ns

Low propagation delay ensures fast operation of the latch or flip-flop, making it suitable for high-speed applications.

Surface Mount: YES

Surface mount capability allows for easy and compact integration onto circuit boards, saving space and simplifying assembly.

No. of Bits: 6

With 6 bits, this latch or flip-flop can store a moderate amount of data or control signals effectively.

Nominal Supply Voltage / Vsup (V): 5

Operating at a standard 5V supply voltage makes it compatible with a wide range of circuits and power sources.

Maximum Operating Temperature: 125 °C

High maximum operating temperature ensures reliability in harsh environments or during prolonged use.

Technology: CMOS

CMOS technology offers low power consumption and high noise immunity, ideal for efficient and reliable operation.

Maximum Frequency At Nominal Supply: 17000000 Hz

This high frequency capability allows for rapid signal processing and data transfer, making it suitable for high-performance applications.

Technical Specifications

Latches & Flip-Flops CD74HCT174M attributes and parameters. Explore more Latches & Flip-Flops devices from Texas Instruments

Specs

Additional Features:

DUMMY VAL

Family:

HCT

JESD-30 Code:

R-PDSO-G16

JESD-609 Code:

e4

Length:

9.9 mm

Load Capacitance (CL):

50 pF

Logic IC Type:

Maximum Frequency At Nominal Supply:

17000000 Hz

Maximum I (ol):

4 Amp

Moisture Sensitivity Level (MSL):

1

No. of Bits:

6

No. of Functions:

1

No. of Terminals:

16

Maximum Operating Temperature:

125 Cel

Minimum Operating Temperature:

-55 Cel

Output Polarity:

TRUE

Package Body Material:

PLASTIC/EPOXY

Package Code:

SOP

Package Equivalence Code:

SOP16,.25

Package Shape:

Package Style (Meter):

SMALL OUTLINE

Packing Method:

TUBE

Peak Reflow Temperature (C):

260

Power Supplies (V):

5

Maximum Power Supply Current (ICC):

.16 mA

Propagation Delay At Nominal Supply:

60 ns

Propagation Delay (tpd):

60 ns

Qualification:

Not Qualified

Maximum Seated Height:

1.75 mm

Sub-Category:

FF/Latch

Maximum Supply Voltage (Vsup):

5.5 V

Minimum Supply Voltage (Vsup):

4.5 V

Nominal Supply Voltage / Vsup (V):

5

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Finish:

NICKEL PALLADIUM GOLD

Terminal Form:

Terminal Pitch:

1.27 mm

Terminal Position:

DUAL

Maximum Time At Peak Reflow Temperature (s):

30

Trigger Type:

POSITIVE EDGE

Width:

3.9 mm

Minimum fmax:

17 MHz

Trade Compliance

CD74HCT174M Logic ICs trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8542.39.00.01

SB

8542.39.00.00

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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