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MC14043BCP

Onsemi

MC14043BCP by Onsemi

MC14043BCP by Onsemi is a CMOS latch/flip-flop with 4 bits and a propagation delay of 350 ns. It operates at a nominal voltage of 5V and has a temperature range of -55 to 125°C. This device is commonly used in military applications due to its MILITARY temperature grade.

Median Price

$1.828

Lifecycle Status

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33

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1k+

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EXC GmbH

Germany . 23 parts In-Stock

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TEDSS.com

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Forefront Electronics and Design

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Component Electronics Inc.

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American Microsemiconductor Inc.

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Inland Empire Components Inc.

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Nova Conductors

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LIBRA Elektronik GmbH

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Fibra_Brandt Electronic GMBH

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Mentor Electronics Marketing, LLC

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Prism Electronics

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M&R Communications

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Corohmni

South Africa . 348 parts In-Stock

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AZTECH Wire

Italy . 715 parts In-Stock

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Aztec Data Supply Inc.

USA . 4,433 parts In-Stock

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Continental Prestige Electronics

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Kulean Microsystems

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Authorized Procurement Solutions

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Perfect Parts

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SupplyDigital Components

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Corphita

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Problanco Electronics

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UHIMA Technologies

Türkiye . 938 parts In-Stock

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Kepictronics

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Overview

Discover the MC14043BCP by Onsemi, a high-quality latch and flip-flop device that offers unmatched performance and reliability. Manufactured by Onsemi, a trusted industry leader known for their cutting-edge technology, this product is designed to meet the demands of various applications. With its advanced features and innovative design, the MC14043BCP provides customers with exceptional value and benefits. Whether you need to store data or control circuit operations, this versatile product ensures fast and efficient functionality. Experience seamless operation and maximize your productivity with the MC14043BCP from Onsemi.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

This product is made of a durable and reliable plastic/epoxy material, ensuring long-lasting performance and protection.

Propagation Delay At Nominal Supply: 350 ns

With a low propagation delay, this latch and flip-flop product offers fast and efficient operation, increasing overall system speed and performance.

No. of Functions: 1

Featuring a single function, this latch and flip-flop is compact and streamlined, making it a cost-effective and space-saving choice for your application.

Package Shape: RECTANGULAR

Designed in a rectangular shape, this product is easy to handle and install, fitting seamlessly into existing systems or designs.

No. of Bits: 4

With four bits, this latch and flip-flop can handle a wide range of input signals, providing versatility and flexibility for various applications.

Nominal Supply Voltage / Vsup (V): 5

Operating at a nominal supply voltage of 5V, this product offers compatibility with standard power supplies, ensuring easy integration into existing setups.

Load Capacitance (CL): 50 pF

With a load capacitance of 50 pF, this latch and flip-flop can reliably handle and drive external loads, enabling smooth and stable signal transmission.

Power Supplies (V): 5/15

Supporting both 5V and 15V power supplies, this product offers flexibility for different voltage requirements, making it a versatile choice for various systems.

No. of Terminals: 16

Featuring 16 terminals, this latch and flip-flop provides ample connection options, allowing seamless integration into circuits and systems.

Package Style (Meter): IN-LINE

Designed in an in-line package style, this product is easy to assemble and install, offering convenience during the manufacturing process.

Propagation Delay (tpd): 350 ns

With a propagation delay of 350 ns, this latch and flip-flop ensure minimal delays in signal processing, enhancing system efficiency and response time.

Maximum Operating Temperature: 125 °C

With a maximum operating temperature of 125°C, this product can withstand high-temperature environments, offering reliability in demanding conditions.

Output Characteristics: 3-STATE

Equipped with 3-STATE output characteristics, this latch and flip-flop offer high flexibility in signal output, making it suitable for multiplexing and bus-oriented applications.

Trigger Type: HIGH LEVEL

Operating on a high-level trigger, this product ensures stable and accurate signal triggering, improving system reliability and performance.

Minimum Operating Temperature: -55 °C

With a minimum operating temperature of -55°C, this product remains operational even in extremely low-temperature environments, guaranteeing reliable performance in various conditions.

Terminal Finish: Tin/Lead (Sn80Pb20)

The terminal finish of tin/lead (Sn80Pb20) provides enhanced solderability and conductivity, making it easier to integrate and solder this latch and flip-flop onto PCBs or other components.

Terminal Position: DUAL

Featuring dual terminal positions, this product offers flexibility in circuit design and installation, adapting to various orientations and configurations.

Maximum Seated Height: 4.44 mm

With a maximum seated height of 4.44 mm, this latch and flip-flop have a compact profile, ensuring compatibility with space-constrained applications and designs.

Width: 7.62 mm

Measuring 7.62 mm in width, this product is compact and space-saving, allowing for efficient use of board space and facilitating system miniaturization.

Output Polarity: TRUE

Featuring a true output polarity, this latch and flip-flop provide accurate and reliable signal outputs, ensuring correct data transmission and processing.

Minimum Supply Voltage (Vsup): 3 V

With a minimum supply voltage requirement of 3V, this product is energy-efficient and can operate with lower power sources, contributing to reduced power consumption.

Maximum Time At Peak Reflow Temperature (s): 30

Designed to withstand peak reflow temperatures for up to 30 seconds, this latch and flip-flop offer robustness during the soldering process, ensuring product reliability and longevity.

Peak Reflow Temperature °C: 235

Supporting peak reflow temperatures of 235°C, this product can withstand high-temperature soldering processes, allowing for efficient and reliable assembly.

Length: 19.175 mm

With a length of 19.175 mm, this latch and flip-flop have a compact form factor, facilitating installation in limited space scenarios.

Temperature Grade: MILITARY

Designed and tested to meet military-grade temperature requirements, this product offers high reliability and performance even in harsh operating conditions.

Technology: CMOS

Utilizing CMOS technology, this latch and flip-flop provides low power consumption, high noise immunity, and enhanced performance, making it an excellent choice for various applications.

Terminal Form: THROUGH-HOLE

With a through-hole terminal form, this product ensures secure and durable connections, allowing for easy soldering and reducing the risk of terminal damage during assembly.

Packing Method: RAIL

Packed in a rail format, this product enables efficient handling and storage, allowing for streamlined production processes and effective inventory management.

Terminal Pitch: 2.54 mm

With a terminal pitch of 2.54 mm, this latch and flip-flop offer standardized spacing, ensuring compatibility with standard connectors and PCBs.

Maximum Supply Voltage (Vsup): 18 V

Supporting a maximum supply voltage of 18V, this product can handle higher voltage requirements, making it suitable for a wide range of applications.

Technical Specifications

Latches & Flip-Flops MC14043BCP attributes and parameters. Explore more Latches & Flip-Flops devices from Onsemi

Specs

Family:

4000/14000/40000

JESD-30 Code:

R-PDIP-T16

JESD-609 Code:

e0

Length:

19.175 mm

Load Capacitance (CL):

50 pF

Logic IC Type:

No. of Bits:

4

No. of Functions:

1

No. of Terminals:

16

Maximum Operating Temperature:

125 Cel

Minimum Operating Temperature:

-55 Cel

Output Characteristics:

3-STATE

Output Polarity:

TRUE

Package Body Material:

PLASTIC/EPOXY

Package Code:

DIP

Package Equivalence Code:

DIP16,.3

Package Shape:

Package Style (Meter):

IN-LINE

Packing Method:

RAIL

Peak Reflow Temperature (C):

235

Power Supplies (V):

5/15

Propagation Delay At Nominal Supply:

350 ns

Propagation Delay (tpd):

350 ns

Qualification:

Not Qualified

Maximum Seated Height:

4.44 mm

Sub-Category:

FF/Latches

Maximum Supply Voltage (Vsup):

18 V

Minimum Supply Voltage (Vsup):

3 V

Nominal Supply Voltage / Vsup (V):

5

Surface Mount:

NO

Technology:

CMOS

Temperature Grade:

Terminal Finish:

Tin/Lead (Sn80Pb20)

Terminal Form:

Terminal Pitch:

2.54 mm

Terminal Position:

DUAL

Maximum Time At Peak Reflow Temperature (s):

30

Trigger Type:

HIGH LEVEL

Width:

7.62 mm

Trade Compliance

MC14043BCP Logic ICs trade compliance attributes, and parameters.

HTS

8542.39.00.01

SB

8542.39.00.00

NSN

5962-00-592-4794, 5962005924794, 5962-21-910-4132, 5962219104132

NIIN

005924794, 219104132

Manufacturer Highlights

Onsemi

Established in 1999, Onsemi is a leading global provider of power and image-sensing technologies. They are dedicated to building a better future for the automotive, industrial, cloud, medical, and IoT markets. Onsemi's core technologies include analog, digital, and mixed-signal products that offer innovative solutions for advanced automotive systems; highly reliable power management products for industrial applications; low-cost imaging solutions for medical equipment and consumer electronics; and robust communication architectures for the Internet of Things (IoT).

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Management team

President, CEO

Hassane El-Khoury

Executive VP, CFO, Treasurer

Thad Trent

Senior VP

Ross F. Jatou

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

Aizu Fab

Fabrication

Fab Initiation

1995

Japan

Aizu Wakamatsu

Wafer Capacity

52,000

1995

52,000

Si/EPI Fab

Fabrication

Fab Initiation

2018

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

10,000

2018

10,000

Expansion Phase 1 for SiC / EPI

Fabrication

Fab Initiation

2019

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

14,500

2019

14,500

Expansion Phase 2 for SiC / EPI

Fabrication

Fab Initiation

2024

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

2024

SiC Fab

Fabrication

Fab Initiation

2022

USA

Hudson

Wafer Capacity

2022

Bucheon

Fabrication

Fab Initiation

2013

South Korea

Bucheon

Wafer Capacity

61,000

2013

61,000

ISMF - Malaysia

Fabrication

Fab Initiation

1990

Malaysia

Seremban

Wafer Capacity

95,000

1990

95,000

Roznov Device Fab

Fabrication

Fab Initiation

1987

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

80,000

1987

80,000

Fab 10

Fabrication

Fab Initiation

2002

USA

East Fishkill

Wafer Capacity

15,000

2002

15,000

Burlington

Fabrication

Fab Initiation

1986

Canada

Burlington

Wafer Capacity

1986

Gresham

Fabrication

Fab Initiation

1998

USA

Gresham

Wafer Capacity

45,000

1998

45,000

Bucheon 150mm

Fabrication

Fab Initiation

2000

South Korea

Bucheon

Wafer Capacity

50,000

2000

50,000

Rochester

Fabrication

Fab Initiation

1983

USA

Rochester

Wafer Capacity

10,000

1983

10,000

Nampa

Fabrication

Fab Initiation

1995

USA

Nampa

Wafer Capacity

1995

Pennsylvania

Fabrication

Fab Initiation

1997

USA

Mountain Top

Wafer Capacity

36,000

1997

36,000

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