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MC14043BCPG

Onsemi

MC14043BCPG by Onsemi

MC14043BCPG by Onsemi is a 4-bit latches & flip-flops IC with 350 ns propagation delay at 5V. It has a package style of IN-LINE and operates b/w -55 to 125 °C. Ideal for military-grade applications requiring high-level trigger type and true output polarity.

Median Price

$0.370

Lifecycle Status

Suppliers In-Stock

4

In-Stock Inventory

1k+

Distributors (In-Stock)

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Nova Conductors

Japan . 550 parts In-Stock

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$0.370

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Vyrian

USA . 9,983 parts In-Stock

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Digiode

USA . 1,555 parts In-Stock

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Bristol Electronics

USA . 29 parts In-Stock

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Continental Prestige Electronics

USA . 6,872 parts In-Stock

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$0.265

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$0.260

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$0.265

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$0.260

Argo Parts USA

USA . 2,977 parts In-Stock

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$0.265

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$0.257

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$0.257

Ampacity Inc.

Singapore . 1,163 parts In-Stock

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$3.000

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AZTECH Wire

Italy . 269 parts In-Stock

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$6.780

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Aztec Data Supply Inc.

USA . 1,512 parts In-Stock

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$32.286

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Kulean Microsystems

USA . 8,386 parts In-Stock

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TANS Electronics

Latvia . 7,686 parts In-Stock

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A-Z Elektronik GmbH

Germany . 7,568 parts In-Stock

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Problanco Electronics

Mexico . 6,028 parts In-Stock

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Kepictronics

USA . 4,200 parts In-Stock

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SupplyDigital Components

Austria . 3,648 parts In-Stock

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Lixinc

USA . 3,127 parts In-Stock

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Corphita

USA . 646 parts In-Stock

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Netroflash

USA . 500 parts In-Stock

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$0.363

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$0.352

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$0.345

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$0.363

$0.352

$0.345

Corohmni

South Africa . 317 parts In-Stock

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UHIMA Technologies

Türkiye . 307 parts In-Stock

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Microchip USA

USA . 228 parts In-Stock

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Overview

Unlock the power of seamless data processing with the MC14043BCPG by Onsemi. Crafted with precision and reliability in mind, this versatile latches & flip-flops device offers unparalleled performance for a wide range of applications. From military-grade technology to high-level trigger capabilities, this product combines quality craftsmanship with innovative features to ensure optimal functionality. Elevate your projects with the trusted expertise of Onsemi and experience the difference firsthand.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

This material is durable and resistant to wear and tear, ensuring the latch or flip-flop will last a long time.

Propagation Delay At Nominal Supply: 350 ns

Fast propagation delay ensures quick response time for the latch or flip-flop, making it suitable for time-sensitive applications.

Package Shape: RECTANGULAR

Rectangular shape allows for easy integration into circuit boards or systems, saving space and making installation straightforward.

Nominal Supply Voltage / Vsup (V): 5

Operates at a common and easily available supply voltage, making it convenient to use in various projects.

Load Capacitance (CL): 50 pF

The low load capacitance ensures efficient performance and minimal power consumption for the latch or flip-flop.

Power Supplies (V): 5/15

Can be powered by multiple voltage sources, offering flexibility in different applications and environments.

Technology: CMOS

CMOS technology provides low power consumption and high noise immunity, making the latch or flip-flop energy-efficient and reliable.

Technical Specifications

Latches & Flip-Flops MC14043BCPG attributes and parameters. Explore more Latches & Flip-Flops devices from Onsemi

Specs

Family:

4000/14000/40000

JESD-30 Code:

R-PDIP-T16

JESD-609 Code:

e3

Length:

19.175 mm

Load Capacitance (CL):

50 pF

Logic IC Type:

No. of Bits:

4

No. of Functions:

1

No. of Terminals:

16

Maximum Operating Temperature:

125 Cel

Minimum Operating Temperature:

-55 Cel

Output Characteristics:

3-STATE

Output Polarity:

TRUE

Package Body Material:

PLASTIC/EPOXY

Package Code:

DIP

Package Equivalence Code:

DIP16,.3

Package Shape:

Package Style (Meter):

IN-LINE

Packing Method:

RAIL

Power Supplies (V):

5/15

Propagation Delay At Nominal Supply:

350 ns

Propagation Delay (tpd):

350 ns

Qualification:

Not Qualified

Maximum Seated Height:

4.44 mm

Sub-Category:

FF/Latches

Maximum Supply Voltage (Vsup):

18 V

Minimum Supply Voltage (Vsup):

3 V

Nominal Supply Voltage / Vsup (V):

5

Surface Mount:

NO

Technology:

CMOS

Temperature Grade:

Terminal Finish:

Tin (Sn)

Terminal Form:

Terminal Pitch:

2.54 mm

Terminal Position:

DUAL

Trigger Type:

HIGH LEVEL

Width:

7.62 mm

Trade Compliance

MC14043BCPG Logic ICs trade compliance attributes, and parameters.

HTS

8542.39.00.01

SB

8542.39.00.00

PCN

Manufacturer Highlights

Onsemi

Established in 1999, Onsemi is a leading global provider of power and image-sensing technologies. They are dedicated to building a better future for the automotive, industrial, cloud, medical, and IoT markets. Onsemi's core technologies include analog, digital, and mixed-signal products that offer innovative solutions for advanced automotive systems; highly reliable power management products for industrial applications; low-cost imaging solutions for medical equipment and consumer electronics; and robust communication architectures for the Internet of Things (IoT).

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Management team

President, CEO

Hassane El-Khoury

Executive VP, CFO, Treasurer

Thad Trent

Senior VP

Ross F. Jatou

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

Aizu Fab

Fabrication

Fab Initiation

1995

Japan

Aizu Wakamatsu

Wafer Capacity

52,000

1995

52,000

Si/EPI Fab

Fabrication

Fab Initiation

2018

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

10,000

2018

10,000

Expansion Phase 1 for SiC / EPI

Fabrication

Fab Initiation

2019

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

14,500

2019

14,500

Expansion Phase 2 for SiC / EPI

Fabrication

Fab Initiation

2024

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

2024

SiC Fab

Fabrication

Fab Initiation

2022

USA

Hudson

Wafer Capacity

2022

Bucheon

Fabrication

Fab Initiation

2013

South Korea

Bucheon

Wafer Capacity

61,000

2013

61,000

ISMF - Malaysia

Fabrication

Fab Initiation

1990

Malaysia

Seremban

Wafer Capacity

95,000

1990

95,000

Roznov Device Fab

Fabrication

Fab Initiation

1987

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

80,000

1987

80,000

Fab 10

Fabrication

Fab Initiation

2002

USA

East Fishkill

Wafer Capacity

15,000

2002

15,000

Burlington

Fabrication

Fab Initiation

1986

Canada

Burlington

Wafer Capacity

1986

Gresham

Fabrication

Fab Initiation

1998

USA

Gresham

Wafer Capacity

45,000

1998

45,000

Bucheon 150mm

Fabrication

Fab Initiation

2000

South Korea

Bucheon

Wafer Capacity

50,000

2000

50,000

Rochester

Fabrication

Fab Initiation

1983

USA

Rochester

Wafer Capacity

10,000

1983

10,000

Nampa

Fabrication

Fab Initiation

1995

USA

Nampa

Wafer Capacity

1995

Pennsylvania

Fabrication

Fab Initiation

1997

USA

Mountain Top

Wafer Capacity

36,000

1997

36,000

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