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CD74AC112M96

Texas Instruments

CD74AC112M96 by Texas Instruments

CD74AC112M96 by Texas Instruments is a dual-function latches & flip-flops IC with 11.1 ns propagation delay, suitable for military-grade applications. It operates at a nominal voltage of 3.3V, has a max frequency of 71MHz, and features negative edge trigger type for precise timing control.

Median Price

$0.419

Lifecycle Status

Suppliers In-Stock

9

In-Stock Inventory

1k+

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Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Mouser Electronics

USA . 3,721 parts In-Stock

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$0.740

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$0.414

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$0.740

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Rochester

USA . 23,822 parts In-Stock

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$0.404

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$0.335

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$0.299

23,822

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$0.404

$0.335

$0.299

DigiKey

USA . 23,822 parts In-Stock

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$0.510

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Verical

USA . 23,822 parts In-Stock

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$0.419

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$0.374

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$0.374

Chip1Stop

Japan . 2,500 parts In-Stock

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$0.215

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Distributors (In-Stock)

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Digiode

USA . 2,467 parts In-Stock

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$0.273

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$0.273

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Nova Conductors

Japan . 50 parts In-Stock

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$0.276

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Vyrian

USA . 14,332 parts In-Stock

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ComSIT Distribution GmbH

Germany . 1,122 parts In-Stock

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Distributors (Availability)

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Ampacity Inc.

Singapore . 15,034 parts In-Stock

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$0.183

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Component Stockers USA

USA . 54,811 parts In-Stock

1+ parts

$0.250

100+ parts

$0.240

1k+ parts

$0.190

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$0.220

54,811

$0.250

$0.240

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$0.220

Corphita

USA . 2,908 parts In-Stock

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$0.258

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Argo Parts USA

USA . 3,262 parts In-Stock

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$0.276

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$0.268

3,262

$0.276

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$0.268

Continental Prestige Electronics

USA . 2,730 parts In-Stock

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$0.276

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$0.271

2,730

$0.276

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$0.271

Netroflash

USA . 1,000 parts In-Stock

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$0.276

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$0.271

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Microchip USA

USA . 3,841 parts In-Stock

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$1.747

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$1.747

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Parana Technologies

USA . 1,039 parts In-Stock

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$15.199

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$15.595

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DigiPath Technology Company

USA . 1,028 parts In-Stock

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$16.735

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$15.397

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$16.735

$15.397

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ChromeModa Solutions

Germany . 2,397 parts In-Stock

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$17.077

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$14.003

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$17.077

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IDEA Electronic Components Group

UK . 1,017 parts In-Stock

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$17.077

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$16.223

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$15.369

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QUARKTWIN TECHNOLOGY LTD

USA . 27,359 parts In-Stock

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Lixinc

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A-Z Elektronik GmbH

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Alle Elektronik GmbH

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Authorized Procurement Solutions

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Kepictronics

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Supply Digital

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Overview

Elevate your electronic projects with the CD74AC112M96 by Texas Instruments. Crafted with precision and expertise, this latches & flip-flops category gem boasts unparalleled quality and reliability. With a sleek rectangular package body material, this component offers lightning-fast 11.1 ns propagation delay at nominal supply for seamless performance. Perfect for various applications, this product delivers exceptional value and benefits to customers seeking top-notch solutions for their projects. Trust in Texas Instruments for cutting-edge technology that pushes boundaries and exceeds expectations.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

The use of plastic/epoxy material makes this latch durable and lightweight, ideal for various applications.

Propagation Delay At Nominal Supply: 11.1 ns

With a fast propagation delay, this latch ensures quick response times, making it suitable for high-speed applications.

Surface Mount: YES

Being surface mountable allows for easy and secure installation, making this latch convenient to use in compact circuit designs.

No. of Functions: 2

The two functions in this latch offer versatility and flexibility in circuit configurations, making it a versatile choice for different applications.

Package Shape: RECTANGULAR

The rectangular shape of the package provides a compact design, saving space in circuit layouts.

No. of Bits: 2

With two bits, this latch can store a range of binary data, enhancing its applicability in digital electronics.

Nominal Supply Voltage / Vsup (V): 3.3

Operating at 3.3V makes this latch compatible with a wide range of electronic systems, ensuring compatibility and ease of integration.

Load Capacitance (CL): 50 pF

The 50 pF load capacitance allows for efficient operation and signal transmission in the circuit, contributing to optimal performance.

Power Supplies (V): 3.3/5

Supporting both 3.3V and 5V power supplies, this latch offers flexibility and compatibility with various electronic systems.

No. of Terminals: 16

With 16 terminals, this latch provides multiple connection points, enabling complex circuit configurations and enhancing functionality.

Technical Specifications

Latches & Flip-Flops CD74AC112M96 attributes and parameters. Explore more Latches & Flip-Flops devices from Texas Instruments

Specs

Family:

AC

JESD-30 Code:

R-PDSO-G16

JESD-609 Code:

e4

Length:

9.9 mm

Load Capacitance (CL):

50 pF

Logic IC Type:

Maximum Frequency At Nominal Supply:

71000000 Hz

Maximum I (ol):

24 Amp

Moisture Sensitivity Level (MSL):

1

No. of Bits:

2

No. of Functions:

2

No. of Terminals:

16

Maximum Operating Temperature:

125 Cel

Minimum Operating Temperature:

-55 Cel

Output Polarity:

COMPLEMENTARY

Package Body Material:

PLASTIC/EPOXY

Package Code:

SOP

Package Equivalence Code:

SOP16,.25

Package Shape:

Package Style (Meter):

SMALL OUTLINE

Packing Method:

TR

Peak Reflow Temperature (C):

260

Power Supplies (V):

3.3/5

Maximum Power Supply Current (ICC):

.08 mA

Propagation Delay At Nominal Supply:

11.1 ns

Propagation Delay (tpd):

129 ns

Qualification:

Not Qualified

Schmitt Trigger:

NO

Maximum Seated Height:

1.75 mm

Sub-Category:

FF/Latches

Maximum Supply Voltage (Vsup):

5.5 V

Minimum Supply Voltage (Vsup):

1.5 V

Nominal Supply Voltage / Vsup (V):

3.3

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Finish:

NICKEL PALLADIUM GOLD

Terminal Form:

Terminal Pitch:

1.27 mm

Terminal Position:

DUAL

Maximum Time At Peak Reflow Temperature (s):

30

Trigger Type:

NEGATIVE EDGE

Width:

3.91 mm

Minimum fmax:

100 MHz

Trade Compliance

CD74AC112M96 Logic ICs trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8542.39.00.01

SB

8542.39.00.00

PCN

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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