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MC14043BDR2G

Onsemi

MC14043BDR2G by Onsemi

MC14043BDR2G by Onsemi is a 4-bit latch with 350 ns propagation delay at 5V. It operates in a temperature range of -55 to 125 °C and has a load capacitance of 50 pF. Ideal for military applications due to its CMOS technology and small outline package style.

Median Price

$0.360

Lifecycle Status

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17

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1k+

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Arrow

USA . 30 parts In-Stock

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$0.379

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$0.240

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DigiKey

USA . 9,096 parts In-Stock

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$0.600

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$0.330

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$0.287

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$0.262

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$0.330

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Mouser Electronics

USA . 163 parts In-Stock

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$0.600

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$0.331

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$0.284

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$0.262

163

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Adafruit Industries

USA . 5,000 parts In-Stock

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$13.461

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$12.788

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$13.461

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Avnet

USA . 12,500 parts In-Stock

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EBV Elektronik

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Verical

USA . 2,400 parts In-Stock

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$0.340

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Master Electronics

USA . 2,400 parts In-Stock

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$0.329

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$0.289

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$0.249

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Rochester

USA . 383 parts In-Stock

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$0.318

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$0.264

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Chip1Stop

Japan . 223 parts In-Stock

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Digiode

USA . 987 parts In-Stock

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Nova Conductors

Japan . 450 parts In-Stock

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Flip Electronics

USA . 4,999 parts In-Stock

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NAC Semi

USA . 2,500 parts In-Stock

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$0.810

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Vyrian

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IBS Electronics

USA . 2,400 parts In-Stock

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$0.461

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$0.405

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$0.349

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Prism Electronics

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Ampacity Inc.

Singapore . 2,216 parts In-Stock

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$0.161

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Corohmni

South Africa . 431 parts In-Stock

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$0.189

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431

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Corphita

USA . 1,221 parts In-Stock

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Argo Parts USA

USA . 1,365 parts In-Stock

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Netroflash

USA . 100 parts In-Stock

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Semicontronic

India . 1,769 parts In-Stock

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Component Stockers USA

USA . 15 parts In-Stock

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$0.280

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$0.220

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Advanced Electronics

New Zealand . 5,000 parts In-Stock

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$13.461

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$12.788

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Aztec Data Supply Inc.

USA . 2,384 parts In-Stock

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$16.471

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Perfect Parts

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QUARKTWIN TECHNOLOGY LTD

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SupplyDigital Components

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Kulean Microsystems

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Continental Prestige Electronics

USA . 2,895 parts In-Stock

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Authorized Procurement Solutions

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TANS Electronics

Latvia . 2,170 parts In-Stock

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Problanco Electronics

Mexico . 1,038 parts In-Stock

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Metaverse IC Inc.

Canada . 565 parts In-Stock

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UHIMA Technologies

Türkiye . 277 parts In-Stock

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S.R.D Solutions

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Overview

Enhance your electronic design projects with the MC14043BDR2G by Onsemi, a top-tier manufacturer known for their superior quality and reliability. This versatile latch and flip-flop component offers seamless integration into various applications, providing customers with unmatched value and performance. With a compact package body and fast propagation delay, this product is perfect for those seeking efficiency and precision in their circuits. Trust Onsemi to deliver cutting-edge technology that exceeds expectations every time.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

The use of plastic/epoxy material for the package body provides durability and protection to the internal components of the latches & flip-flops.

Propagation Delay At Nominal Supply: 350 ns

The low propagation delay of 350 ns ensures fast response times for the latches & flip-flops, making them suitable for high-speed applications.

Surface Mount: YES

Being surface mountable makes installation of these latches & flip-flops convenient and suitable for compact circuit designs.

Nominal Supply Voltage / Vsup (V): 5

Operating at a nominal supply voltage of 5V ensures compatibility with standard voltage levels in electronic circuits.

Trigger Type: HIGH LEVEL

The high-level trigger type ensures reliable and stable operation of the latches & flip-flops, reducing the chances of false triggering.

Technology: CMOS

The use of CMOS technology provides low power consumption and high noise immunity, making these latches & flip-flops efficient and reliable.

Technical Specifications

Latches & Flip-Flops MC14043BDR2G attributes and parameters. Explore more Latches & Flip-Flops devices from Onsemi

Specs

Family:

4000/14000/40000

JESD-30 Code:

R-PDSO-G16

JESD-609 Code:

e3

Length:

9.9 mm

Load Capacitance (CL):

50 pF

Logic IC Type:

Moisture Sensitivity Level (MSL):

1

No. of Bits:

4

No. of Functions:

1

No. of Terminals:

16

Maximum Operating Temperature:

125 Cel

Minimum Operating Temperature:

-55 Cel

Output Characteristics:

3-STATE

Output Polarity:

TRUE

Package Body Material:

PLASTIC/EPOXY

Package Code:

SOP

Package Equivalence Code:

SOP16,.25

Package Shape:

Package Style (Meter):

SMALL OUTLINE

Packing Method:

TR

Peak Reflow Temperature (C):

260

Power Supplies (V):

5/15

Propagation Delay At Nominal Supply:

350 ns

Propagation Delay (tpd):

350 ns

Qualification:

Not Qualified

Maximum Seated Height:

1.75 mm

Sub-Category:

FF/Latches

Maximum Supply Voltage (Vsup):

18 V

Minimum Supply Voltage (Vsup):

3 V

Nominal Supply Voltage / Vsup (V):

5

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Finish:

MATTE TIN

Terminal Form:

Terminal Pitch:

1.27 mm

Terminal Position:

DUAL

Maximum Time At Peak Reflow Temperature (s):

30

Trigger Type:

HIGH LEVEL

Width:

3.9 mm

Trade Compliance

MC14043BDR2G Logic ICs trade compliance attributes, and parameters.

HTS

8542.39.00.01

SB

8542.39.00.00

PCN

Manufacturer Highlights

Onsemi

Established in 1999, Onsemi is a leading global provider of power and image-sensing technologies. They are dedicated to building a better future for the automotive, industrial, cloud, medical, and IoT markets. Onsemi's core technologies include analog, digital, and mixed-signal products that offer innovative solutions for advanced automotive systems; highly reliable power management products for industrial applications; low-cost imaging solutions for medical equipment and consumer electronics; and robust communication architectures for the Internet of Things (IoT).

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Management team

President, CEO

Hassane El-Khoury

Executive VP, CFO, Treasurer

Thad Trent

Senior VP

Ross F. Jatou

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

Aizu Fab

Fabrication

Fab Initiation

1995

Japan

Aizu Wakamatsu

Wafer Capacity

52,000

1995

52,000

Si/EPI Fab

Fabrication

Fab Initiation

2018

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

10,000

2018

10,000

Expansion Phase 1 for SiC / EPI

Fabrication

Fab Initiation

2019

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

14,500

2019

14,500

Expansion Phase 2 for SiC / EPI

Fabrication

Fab Initiation

2024

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

2024

SiC Fab

Fabrication

Fab Initiation

2022

USA

Hudson

Wafer Capacity

2022

Bucheon

Fabrication

Fab Initiation

2013

South Korea

Bucheon

Wafer Capacity

61,000

2013

61,000

ISMF - Malaysia

Fabrication

Fab Initiation

1990

Malaysia

Seremban

Wafer Capacity

95,000

1990

95,000

Roznov Device Fab

Fabrication

Fab Initiation

1987

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

80,000

1987

80,000

Fab 10

Fabrication

Fab Initiation

2002

USA

East Fishkill

Wafer Capacity

15,000

2002

15,000

Burlington

Fabrication

Fab Initiation

1986

Canada

Burlington

Wafer Capacity

1986

Gresham

Fabrication

Fab Initiation

1998

USA

Gresham

Wafer Capacity

45,000

1998

45,000

Bucheon 150mm

Fabrication

Fab Initiation

2000

South Korea

Bucheon

Wafer Capacity

50,000

2000

50,000

Rochester

Fabrication

Fab Initiation

1983

USA

Rochester

Wafer Capacity

10,000

1983

10,000

Nampa

Fabrication

Fab Initiation

1995

USA

Nampa

Wafer Capacity

1995

Pennsylvania

Fabrication

Fab Initiation

1997

USA

Mountain Top

Wafer Capacity

36,000

1997

36,000

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