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MC14099BCPG

Onsemi

MC14099BCPG by Onsemi

MC14099BCPG by Onsemi is a CMOS latch with a propagation delay of 400 ns and a load capacitance of 50 pF. It is commonly used in military applications due to its temperature grade and through-hole terminal form.

Median Price

$0.700

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DigiKey

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Digiode

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Nova Conductors

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Overview

Discover the MC14099BCPG by Onsemi, a top-quality latch and flip-flop that offers unparalleled performance and reliability. Manufactured by Onsemi, a renowned leader in the industry, this product showcases their commitment to excellence. With a wide range of applications, this versatile device is designed to meet the needs of various industries. Experience the value of its fast propagation delay, flexible power supplies, and high operating temperature. Its compact design and through-hole terminal form make it easy to integrate into any system. Upgrade your projects with the MC14099BCPG and enjoy the benefits of superior functionality and lasting durability.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

This product is made with a durable plastic/epoxy material, ensuring its resilience and longevity.

Propagation Delay At Nominal Supply: 400 ns

With a relatively low propagation delay of 400 ns, this latch/flip-flop allows for fast and efficient signal processing.

No. of Functions: 1

This latch/flip-flop has a single function, making it straightforward and easy to use for specific applications.

Package Shape: RECTANGULAR

The rectangular package shape of this product enables easy integration and space-efficient installation in various electronic systems.

No. of Bits: 1

With a single bit capacity, this latch/flip-flop is suitable for applications that require simple data storage and manipulation.

Nominal Supply Voltage / Vsup (V): 5

Operating at a standard nominal supply voltage of 5V, this latch/flip-flop is compatible with common power sources.

Load Capacitance (CL): 50 pF

Designed to handle a load capacitance of 50 pF, this latch/flip-flop maintains stability and reliability even in high-capacitance environments.

Power Supplies (V): 5/15

Supporting both 5V and 15V power supplies, this latch/flip-flop offers flexibility in various voltage scenarios.

No. of Terminals: 16

With 16 terminals, this product provides multiple connectivity options and facilitates versatile circuit designs.

Package Style (Meter): IN-LINE

The in-line package style of this latch/flip-flop provides efficient space utilization and ease of integration in circuit layouts.

Propagation Delay (tpd): 400 ns

This latch/flip-flop has a propagation delay of 400 ns, allowing for efficient data transfer and processing speed.

Maximum Operating Temperature: 125 °C

Capable of withstanding temperatures up to 125°C, this latch/flip-flop can operate reliably in demanding and high-temperature environments.

Trigger Type: LOW LEVEL

With a trigger type of "low level," this latch/flip-flop responds to signals with a low voltage level, making it suitable for specific applications.

Minimum Operating Temperature: -55 °C

This latch/flip-flop can function in extremely cold environments, with a minimum operating temperature of -55°C.

Terminal Finish: Tin (Sn)

The tin (Sn) terminal finish provides good electrical conductivity and resistance to corrosion, enhancing the reliability and lifespan of this product.

Terminal Position: DUAL

Featuring dual terminal positions, this latch/flip-flop offers flexibility in circuit board layout and connection configurations.

Maximum Seated Height: 4.44 mm

With a maximum seated height of 4.44 mm, this product can be seamlessly integrated into compact designs with low-profile requirements.

Width: 7.62 mm

With a width of 7.62 mm, this latch/flip-flop is compact and space-efficient, allowing for easy incorporation in tight electronic systems.

Output Polarity: TRUE

The output polarity of this latch/flip-flop is "true," meaning it accurately reflects the input data, making it reliable for logical operations.

Minimum Supply Voltage (Vsup): 3 V

This latch/flip-flop can operate reliably at a minimum supply voltage of 3V, accommodating low-power applications.

Maximum Time At Peak Reflow Temperature (s): 40

This product can withstand a peak reflow temperature for a maximum duration of 40 seconds, ensuring its resilience during manufacturing processes.

Peak Reflow Temperature °C: 260

Capable of withstanding a peak reflow temperature of 260°C, this latch/flip-flop can be soldered using standard reflow techniques.

Length: 19.175 mm

With a length of 19.175 mm, this latch/flip-flop is compact and space-efficient, enabling easy integration in various electronic designs.

Temperature Grade: MILITARY

Designed for military applications, this latch/flip-flop meets rigorous temperature specifications and ensures reliable operation in harsh environmental conditions.

Technology: CMOS

Utilizing complementary metal-oxide-semiconductor (CMOS) technology, this latch/flip-flop offers low power consumption, high noise immunity, and fast switching speeds.

Terminal Form: THROUGH-HOLE

Featuring a through-hole terminal form, this latch/flip-flop allows for secure soldering and robust mechanical connections.

Packing Method: RAIL

This product is packaged in a rail configuration, facilitating automatic and efficient assembly processes.

Terminal Pitch: 2.54 mm

With a terminal pitch of 2.54 mm, this latch/flip-flop is compatible with standard spacing on printed circuit boards, ensuring effortless integration.

Maximum Supply Voltage (Vsup): 18 V

This latch/flip-flop can handle a maximum supply voltage of 18V, making it suitable for applications with higher voltage requirements.

Technical Specifications

Latches & Flip-Flops MC14099BCPG attributes and parameters. Explore more Latches & Flip-Flops devices from Onsemi

Specs

Additional Features:

1:8 DMUX FOLLOWED BY LATCH

Family:

4000/14000/40000

JESD-30 Code:

R-PDIP-T16

JESD-609 Code:

e3

Length:

19.175 mm

Load Capacitance (CL):

50 pF

Logic IC Type:

No. of Bits:

1

No. of Functions:

1

No. of Terminals:

16

Maximum Operating Temperature:

125 Cel

Minimum Operating Temperature:

-55 Cel

Output Polarity:

TRUE

Package Body Material:

PLASTIC/EPOXY

Package Code:

DIP

Package Equivalence Code:

DIP16,.3

Package Shape:

Package Style (Meter):

IN-LINE

Packing Method:

RAIL

Peak Reflow Temperature (C):

260

Power Supplies (V):

5/15

Propagation Delay At Nominal Supply:

400 ns

Propagation Delay (tpd):

400 ns

Qualification:

Not Qualified

Maximum Seated Height:

4.44 mm

Sub-Category:

FF/Latches

Maximum Supply Voltage (Vsup):

18 V

Minimum Supply Voltage (Vsup):

3 V

Nominal Supply Voltage / Vsup (V):

5

Surface Mount:

NO

Technology:

CMOS

Temperature Grade:

Terminal Finish:

Tin (Sn)

Terminal Form:

Terminal Pitch:

2.54 mm

Terminal Position:

DUAL

Maximum Time At Peak Reflow Temperature (s):

40

Trigger Type:

LOW LEVEL

Width:

7.62 mm

Trade Compliance

MC14099BCPG Logic ICs trade compliance attributes, and parameters.

HTS

8542.39.00.01

SB

8542.39.00.00

PCN

Manufacturer Highlights

Onsemi

Established in 1999, Onsemi is a leading global provider of power and image-sensing technologies. They are dedicated to building a better future for the automotive, industrial, cloud, medical, and IoT markets. Onsemi's core technologies include analog, digital, and mixed-signal products that offer innovative solutions for advanced automotive systems; highly reliable power management products for industrial applications; low-cost imaging solutions for medical equipment and consumer electronics; and robust communication architectures for the Internet of Things (IoT).

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Management team

President, CEO

Hassane El-Khoury

Executive VP, CFO, Treasurer

Thad Trent

Senior VP

Ross F. Jatou

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

Aizu Fab

Fabrication

Fab Initiation

1995

Japan

Aizu Wakamatsu

Wafer Capacity

52,000

1995

52,000

Si/EPI Fab

Fabrication

Fab Initiation

2018

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

10,000

2018

10,000

Expansion Phase 1 for SiC / EPI

Fabrication

Fab Initiation

2019

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

14,500

2019

14,500

Expansion Phase 2 for SiC / EPI

Fabrication

Fab Initiation

2024

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

2024

SiC Fab

Fabrication

Fab Initiation

2022

USA

Hudson

Wafer Capacity

2022

Bucheon

Fabrication

Fab Initiation

2013

South Korea

Bucheon

Wafer Capacity

61,000

2013

61,000

ISMF - Malaysia

Fabrication

Fab Initiation

1990

Malaysia

Seremban

Wafer Capacity

95,000

1990

95,000

Roznov Device Fab

Fabrication

Fab Initiation

1987

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

80,000

1987

80,000

Fab 10

Fabrication

Fab Initiation

2002

USA

East Fishkill

Wafer Capacity

15,000

2002

15,000

Burlington

Fabrication

Fab Initiation

1986

Canada

Burlington

Wafer Capacity

1986

Gresham

Fabrication

Fab Initiation

1998

USA

Gresham

Wafer Capacity

45,000

1998

45,000

Bucheon 150mm

Fabrication

Fab Initiation

2000

South Korea

Bucheon

Wafer Capacity

50,000

2000

50,000

Rochester

Fabrication

Fab Initiation

1983

USA

Rochester

Wafer Capacity

10,000

1983

10,000

Nampa

Fabrication

Fab Initiation

1995

USA

Nampa

Wafer Capacity

1995

Pennsylvania

Fabrication

Fab Initiation

1997

USA

Mountain Top

Wafer Capacity

36,000

1997

36,000

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