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SN74HCT74DR

Texas Instruments

SN74HCT74DR by Texas Instruments

SN74HCT74DR by Texas Instruments is a dual-function latch with 35ns propagation delay, ideal for industrial applications. It operates at a supply voltage of 5V and has a load capacitance of 50pF. With a max frequency of 22MHz, this CMOS technology flip-flop is suitable for high-speed circuit designs.

Median Price

$0.416

Lifecycle Status

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45

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1k+

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Chip1Stop

Japan . 2,110 parts In-Stock

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Arrow

USA . 1,554 parts In-Stock

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Mouser Electronics

USA . 2,819 parts In-Stock

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Rochester

USA . 378,392 parts In-Stock

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DigiKey

USA . 378,392 parts In-Stock

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Verical

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Digiode

USA . 3,719 parts In-Stock

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Nova Conductors

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Greenchips

USA . 1,796 parts In-Stock

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American Microsemiconductor Inc.

USA . 2,500 parts In-Stock

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Component Electronics Inc.

Canada . 113 parts In-Stock

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Forefront Electronics and Design

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DigiKey Marketplace

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Vyrian

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Chip Stock

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Atlantic Semiconductor

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Semicontronic

India . 176,561 parts In-Stock

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Ampacity Inc.

Singapore . 157,850 parts In-Stock

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Corphita

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Corohmni

South Africa . 313 parts In-Stock

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Argo Parts USA

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Continental Prestige Electronics

USA . 1,071 parts In-Stock

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Microchip USA

USA . 6,163 parts In-Stock

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Parana Technologies

USA . 567 parts In-Stock

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DigiPath Technology Company

USA . 1,061 parts In-Stock

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ChromeModa Solutions

Germany . 6,021 parts In-Stock

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IDEA Electronic Components Group

UK . 946 parts In-Stock

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Perfect Parts

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Kepictronics

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ChipTracer

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Speed Components Ltd (Excess)

Israel . 46 parts In-Stock

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Overview

Enhance your electronic projects with the SN74HCT74DR by Texas Instruments, a top-quality latches & flip-flops component that offers reliable performance and exceptional functionality. Manufactured by Texas Instruments, a renowned leader in the industry, this product guarantees superior quality and durability. Ideal for a wide range of applications, this versatile component provides customers with unmatched value, benefits, and advantages. Upgrade your projects today with the SN74HCT74DR and experience the difference it makes in your designs.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

Plastic and epoxy materials are durable and lightweight, making the latch and flip-flop product easy to handle and install.

Propagation Delay At Nominal Supply: 35 ns

The short propagation delay ensures fast operation and response time, making this latch and flip-flop ideal for high-speed applications.

Surface Mount: YES

Surface mount capability allows for easy and secure mounting on PCBs, saving space and facilitating automated assembly processes.

No. of Functions: 2

Having multiple functions in a single component increases efficiency and saves space in circuit design.

Nominal Supply Voltage / Vsup (V): 5

The product operates at a common 5V supply voltage, compatible with many standard electronic systems.

Load Capacitance (CL): 50 pF

The low load capacitance helps reduce power consumption and signal distortion, improving overall performance.

Power Supplies (V): 5

The product can be powered by a single 5V supply, simplifying the power management for the system.

No. of Terminals: 14

Having multiple terminals allows for versatile connectivity options and integration with other components in the circuit.

Maximum I (ol): 4 Amp

The high output current capability supports driving larger loads, expanding the range of applications for the latch and flip-flop.

Trigger Type: POSITIVE EDGE

Positive edge triggering ensures reliable operation and precise timing control, critical for sequential logic operations.

Technology: CMOS

CMOS technology offers low power consumption, high noise immunity, and compatibility with a wide range of digital systems.

Technical Specifications

Latches & Flip-Flops SN74HCT74DR attributes and parameters. Explore more Latches & Flip-Flops devices from Texas Instruments

Specs

Family:

HCT

JESD-30 Code:

R-PDSO-G14

JESD-609 Code:

e4

Length:

8.65 mm

Load Capacitance (CL):

50 pF

Logic IC Type:

Maximum Frequency At Nominal Supply:

22000000 Hz

Maximum I (ol):

4 Amp

Moisture Sensitivity Level (MSL):

1

No. of Bits:

1

No. of Functions:

2

No. of Terminals:

14

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

-40 Cel

Output Polarity:

COMPLEMENTARY

Package Body Material:

PLASTIC/EPOXY

Package Code:

SOP

Package Equivalence Code:

SOP14,.25

Package Shape:

Package Style (Meter):

SMALL OUTLINE

Packing Method:

TR

Peak Reflow Temperature (C):

260

Power Supplies (V):

5

Maximum Power Supply Current (ICC):

.04 mA

Propagation Delay At Nominal Supply:

35 ns

Propagation Delay (tpd):

35 ns

Qualification:

Not Qualified

Maximum Seated Height:

1.75 mm

Sub-Category:

FF/Latches

Maximum Supply Voltage (Vsup):

5.5 V

Minimum Supply Voltage (Vsup):

4.5 V

Nominal Supply Voltage / Vsup (V):

5

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Finish:

NICKEL PALLADIUM GOLD

Terminal Form:

Terminal Pitch:

1.27 mm

Terminal Position:

DUAL

Maximum Time At Peak Reflow Temperature (s):

30

Trigger Type:

POSITIVE EDGE

Width:

3.91 mm

Minimum fmax:

24 MHz

Trade Compliance

SN74HCT74DR Logic ICs trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8542.39.00.01

SB

8542.39.00.00

PCN

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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