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74AUP1G374GN

NXP Semiconductors

74AUP1G374GN by NXP Semiconductors

NXP Semiconductors' 74AUP1G374GN is a CMOS latch with 6 terminals, operating at a supply voltage range of 0.8V to 3.6V. It features a propagation delay of 21.6ns, positive edge trigger type, and output polarity as TRUE. Widely used in automotive applications due to its small outline package and high max operating temperature of 125°C.

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Digiode

USA . 4,682 parts In-Stock

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AZTECH Wire

Italy . 13,807 parts In-Stock

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Ampacity Inc.

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One Stop Electronics

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Argo Parts USA

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Overview

Unlock a world of possibilities with the 74AUP1G374GN by NXP Semiconductors, a high-quality latch & flip-flop device that offers unparalleled performance and reliability. Manufactured by the trusted name in semiconductor technology, this product is perfect for a wide range of applications. With a compact design and advanced features, this versatile component guarantees seamless operation and superior results. Experience the value and benefits of cutting-edge technology with the 74AUP1G374GN - your key to innovation and success.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

Durable and reliable material for long-lasting use

Surface Mount: YES

Easy to mount on printed circuit boards

Nominal Supply Voltage / Vsup (V): 1.1

Matches common supply voltages for compatibility

Propagation Delay (tpd): 21.6 ns

Fast response time for efficient operation

Output Characteristics: 3-STATE

Provides flexibility in output options

Trigger Type: POSITIVE EDGE

Allows for precise triggering of the latch or flip-flop

Maximum Operating Temperature: 125 °C

Suitable for a wide range of operating environments

Technology: CMOS

Low power consumption and high noise immunity

Technical Specifications

Latches & Flip-Flops 74AUP1G374GN attributes and parameters. Explore more Latches & Flip-Flops devices from NXP Semiconductors

Specs

Family:

AUP/ULP/V

JESD-30 Code:

R-PDSO-N6

JESD-609 Code:

e3

Length:

1 mm

Logic IC Type:

Moisture Sensitivity Level (MSL):

1

No. of Bits:

1

No. of Functions:

1

No. of Terminals:

6

Maximum Operating Temperature:

125 Cel

Minimum Operating Temperature:

-40 Cel

Output Characteristics:

3-STATE

Output Polarity:

TRUE

Package Body Material:

PLASTIC/EPOXY

Package Code:

SON

Package Shape:

Package Style (Meter):

SMALL OUTLINE

Propagation Delay (tpd):

21.6 ns

Qualification:

Not Qualified

Maximum Seated Height:

.35 mm

Maximum Supply Voltage (Vsup):

3.6 V

Minimum Supply Voltage (Vsup):

.8 V

Nominal Supply Voltage / Vsup (V):

1.1

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Finish:

TIN

Terminal Form:

Terminal Pitch:

.3 mm

Terminal Position:

DUAL

Trigger Type:

POSITIVE EDGE

Width:

.9 mm

Minimum fmax:

360 MHz

Trade Compliance

74AUP1G374GN Logic ICs trade compliance attributes, and parameters.

HTS

8542.39.00.01

SB

8542.39.00.00

Manufacturer Highlights

NXP Semiconductors

NXP is a leading semiconductor company that creates cutting-edge technology to power secure connections in a smarter world. Founded in 2006, they have grown to become one of the top five global semiconductor companies and serve their customers in over 70 countries around the world.

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Management team

Executive Director, President, CEO

Kurt Sievers

Executive VP, CFO

Bill Betz

Executive VP, Chief Sales Officer

Ron Martino

Manufacturer fab locations 7

Fab name Location Fab Initiation Wafer Capacity

ICN8

Fabrication

Fab Initiation

1996

Netherlands

Nijmegen

Wafer Capacity

55,000

1996

55,000

ATMC (Austin Tech & Mfg Center)

Fabrication

Fab Initiation

1995

USA

Austin

Wafer Capacity

30,000

1995

30,000

N/A

Fabrication

Fab Initiation

1989

Germany

Boeblingen

Wafer Capacity

1989

CHD

Fabrication

Fab Initiation

1993

USA

Chandler

Wafer Capacity

30,000

1993

30,000

OHTC

Fabrication

Fab Initiation

1991

USA

Austin

Wafer Capacity

24,000

1991

24,000

New Expansion Fab

Fabrication

Fab Initiation

2026

USA

Austin

Wafer Capacity

2026

ECHO

Fabrication

Fab Initiation

2020

USA

Chandler

Wafer Capacity

10,000

2020

10,000

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