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74AUP1G374GW

NXP Semiconductors

74AUP1G374GW by NXP Semiconductors

NXP Semiconductors' 74AUP1G374GW is a CMOS latch with 21.6 ns propagation delay, operating at 1.1V. It features a small outline package and can handle up to 30 pF load capacitance. Ideal for automotive applications due to its wide temperature range and low power consumption.

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5

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Digiode

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One Stop Electronics

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Ampacity Inc.

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Overview

Upgrade your electronic designs with the reliable 74AUP1G374GW from NXP Semiconductors. With a proven track record of excellence, NXP Semiconductors delivers high-quality latches & flip-flops that guarantee superior performance and durability. Ideal for a wide range of applications, this product offers customers unmatched value, benefits, and advantages. Trust NXP Semiconductors to provide you with innovative solutions that exceed expectations.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

Provides durability and resistance to moisture and static electricity, ensuring a reliable performance in various environments.

Propagation Delay At Nominal Supply: 21.6 ns

Low propagation delay ensures quick response times, making it suitable for applications requiring high-speed operation.

Surface Mount: YES

Surface mount design makes it easy to integrate into PCBs, saving space and facilitating automated assembly processes.

Nominal Supply Voltage / Vsup (V): 1.1

Operates efficiently at a low voltage, reducing power consumption and making it ideal for battery-powered devices.

Load Capacitance (CL): 30 pF

Optimized load capacitance for reliable signal transmission and reduced interference in communication systems.

Power Supplies (V): 1.2/3.3

Flexible power supply options for compatibility with a range of systems and voltage requirements.

No. of Terminals: 6

Provides necessary connectivity for input and output signals, allowing for versatile integration into circuit designs.

Maximum I (ol): 1.7 Amp

High output current capability for driving loads or interfacing with other components without overheating or damage.

Technical Specifications

Latches & Flip-Flops 74AUP1G374GW attributes and parameters. Explore more Latches & Flip-Flops devices from NXP Semiconductors

Specs

Family:

AUP/ULP/V

JESD-30 Code:

R-PDSO-G6

JESD-609 Code:

e3

Length:

2 mm

Load Capacitance (CL):

30 pF

Logic IC Type:

Maximum Frequency At Nominal Supply:

70000000 Hz

Maximum I (ol):

1.7 Amp

Moisture Sensitivity Level (MSL):

1

No. of Bits:

1

No. of Functions:

1

No. of Terminals:

6

Maximum Operating Temperature:

125 Cel

Minimum Operating Temperature:

-40 Cel

Output Characteristics:

3-STATE

Output Polarity:

TRUE

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Equivalence Code:

TSSOP6,.08

Package Shape:

Package Style (Meter):

SMALL OUTLINE, THIN PROFILE, SHRINK PITCH

Packing Method:

TR

Peak Reflow Temperature (C):

260

Power Supplies (V):

1.2/3.3

Propagation Delay At Nominal Supply:

21.6 ns

Propagation Delay (tpd):

21.6 ns

Qualification:

Not Qualified

Maximum Seated Height:

1.1 mm

Sub-Category:

FF/Latches

Maximum Supply Voltage (Vsup):

3.6 V

Minimum Supply Voltage (Vsup):

.8 V

Nominal Supply Voltage / Vsup (V):

1.1

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Finish:

Tin (Sn)

Terminal Form:

Terminal Pitch:

.65 mm

Terminal Position:

DUAL

Maximum Time At Peak Reflow Temperature (s):

30

Trigger Type:

POSITIVE EDGE

Width:

1.25 mm

Minimum fmax:

360 MHz

Trade Compliance

74AUP1G374GW Logic ICs trade compliance attributes, and parameters.

HTS

8542.39.00.01

SB

8542.39.00.00

Manufacturer Highlights

NXP Semiconductors

NXP is a leading semiconductor company that creates cutting-edge technology to power secure connections in a smarter world. Founded in 2006, they have grown to become one of the top five global semiconductor companies and serve their customers in over 70 countries around the world.

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Management team

Executive Director, President, CEO

Kurt Sievers

Executive VP, CFO

Bill Betz

Executive VP, Chief Sales Officer

Ron Martino

Manufacturer fab locations 7

Fab name Location Fab Initiation Wafer Capacity

ICN8

Fabrication

Fab Initiation

1996

Netherlands

Nijmegen

Wafer Capacity

55,000

1996

55,000

ATMC (Austin Tech & Mfg Center)

Fabrication

Fab Initiation

1995

USA

Austin

Wafer Capacity

30,000

1995

30,000

N/A

Fabrication

Fab Initiation

1989

Germany

Boeblingen

Wafer Capacity

1989

CHD

Fabrication

Fab Initiation

1993

USA

Chandler

Wafer Capacity

30,000

1993

30,000

OHTC

Fabrication

Fab Initiation

1991

USA

Austin

Wafer Capacity

24,000

1991

24,000

New Expansion Fab

Fabrication

Fab Initiation

2026

USA

Austin

Wafer Capacity

2026

ECHO

Fabrication

Fab Initiation

2020

USA

Chandler

Wafer Capacity

10,000

2020

10,000

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