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74AUP1G374GM,115

NXP Semiconductors

74AUP1G374GM,115 by NXP Semiconductors

NXP Semiconductors' 74AUP1G374GM,115 is a CMOS latch with 21.6 ns propagation delay and 1.7 Amp max I (ol). It operates at a nominal voltage of 1.2V/3.3V, suitable for automotive applications due to its low power consumption and small form factor.

Median Price

$0.190

Lifecycle Status

Suppliers In-Stock

9

In-Stock Inventory

1k+

Distributors (Authorized)

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Rochester

USA . 100,000 parts In-Stock

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$0.198

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$0.164

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$0.146

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Verical

USA . 100,000 parts In-Stock

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$0.183

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Distributors (In-Stock)

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Nova Conductors

Japan . 1,000 parts In-Stock

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$0.065

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Digiode

USA . 4,952 parts In-Stock

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Chip Stock

USA . 117,000 parts In-Stock

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DigiKey Marketplace

USA . 5,000 parts In-Stock

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Vyrian

USA . 2,029 parts In-Stock

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VNN

France . 1,635 parts In-Stock

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Anansix

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Aranea Global

USA . 2,000 parts In-Stock

1+ parts

$0.064

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$0.061

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$0.064

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Ampacity Inc.

Singapore . 99,638 parts In-Stock

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Argo Parts USA

USA . 2,618 parts In-Stock

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Continental Prestige Electronics

USA . 2,341 parts In-Stock

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Corphita

USA . 113 parts In-Stock

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AZTECH Wire

Italy . 6,888 parts In-Stock

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Microchip USA

USA . 5,525 parts In-Stock

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UNI Independent Distributors

Spain . 5,900 parts In-Stock

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Supply Digital

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Overview

Unlock a world of possibilities with the 74AUP1G374GM,115 by NXP Semiconductors. This high-quality latch and flip-flop component offers unmatched reliability and performance, perfect for a variety of applications. With a compact design and low power consumption, this product provides excellent value for customers seeking dependable and efficient solutions. Whether you're working on automotive electronics or industrial automation, trust NXP Semiconductors to deliver top-notch components that meet your needs. Elevate your projects with the 74AUP1G374GM,115 today!

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

Durable material that can withstand various environmental conditions.

Propagation Delay At Nominal Supply: 21.6 ns

Fast propagation delay ensures quick response time, making it suitable for high-speed applications.

Surface Mount: YES

Easy to integrate into PCBs for compact and space-saving designs.

Nominal Supply Voltage / Vsup (V): 1.2

Operates at a low supply voltage, making it energy efficient.

Trigger Type: POSITIVE EDGE

Positive edge trigger for precise timing control.

Maximum Frequency At Nominal Supply: 70000000 Hz

High operating frequency for rapid data processing.

Technical Specifications

Latches & Flip-Flops 74AUP1G374GM,115 attributes and parameters. Explore more Latches & Flip-Flops devices from NXP Semiconductors

Specs

Family:

AUP/ULP/V

JESD-30 Code:

R-PDSO-N6

JESD-609 Code:

e3

Length:

1.45 mm

Load Capacitance (CL):

30 pF

Logic IC Type:

Maximum Frequency At Nominal Supply:

70000000 Hz

Maximum I (ol):

1.7 Amp

Moisture Sensitivity Level (MSL):

1

No. of Bits:

1

No. of Functions:

1

No. of Terminals:

6

Maximum Operating Temperature:

125 Cel

Minimum Operating Temperature:

-40 Cel

Output Characteristics:

3-STATE

Output Polarity:

TRUE

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Equivalence Code:

SOLCC6,.04,20

Package Shape:

Package Style (Meter):

SMALL OUTLINE, VERY THIN PROFILE

Packing Method:

TR

Peak Reflow Temperature (C):

260

Power Supplies (V):

1.2/3.3

Propagation Delay At Nominal Supply:

21.6 ns

Propagation Delay (tpd):

21.6 ns

Qualification:

Not Qualified

Maximum Seated Height:

.5 mm

Sub-Category:

FF/Latches

Maximum Supply Voltage (Vsup):

3.6 V

Minimum Supply Voltage (Vsup):

.8 V

Nominal Supply Voltage / Vsup (V):

1.2

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Finish:

Tin (Sn)

Terminal Form:

Terminal Pitch:

.5 mm

Terminal Position:

DUAL

Maximum Time At Peak Reflow Temperature (s):

30

Trigger Type:

POSITIVE EDGE

Width:

1 mm

Minimum fmax:

360 MHz

Trade Compliance

74AUP1G374GM,115 Logic ICs trade compliance attributes, and parameters.

HTS

8542.39.00.01

SB

8542.39.00.00

PCN

Manufacturer Highlights

NXP Semiconductors

NXP is a leading semiconductor company that creates cutting-edge technology to power secure connections in a smarter world. Founded in 2006, they have grown to become one of the top five global semiconductor companies and serve their customers in over 70 countries around the world.

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Management team

Executive Director, President, CEO

Kurt Sievers

Executive VP, CFO

Bill Betz

Executive VP, Chief Sales Officer

Ron Martino

Manufacturer fab locations 7

Fab name Location Fab Initiation Wafer Capacity

ICN8

Fabrication

Fab Initiation

1996

Netherlands

Nijmegen

Wafer Capacity

55,000

1996

55,000

ATMC (Austin Tech & Mfg Center)

Fabrication

Fab Initiation

1995

USA

Austin

Wafer Capacity

30,000

1995

30,000

N/A

Fabrication

Fab Initiation

1989

Germany

Boeblingen

Wafer Capacity

1989

CHD

Fabrication

Fab Initiation

1993

USA

Chandler

Wafer Capacity

30,000

1993

30,000

OHTC

Fabrication

Fab Initiation

1991

USA

Austin

Wafer Capacity

24,000

1991

24,000

New Expansion Fab

Fabrication

Fab Initiation

2026

USA

Austin

Wafer Capacity

2026

ECHO

Fabrication

Fab Initiation

2020

USA

Chandler

Wafer Capacity

10,000

2020

10,000

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