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SN74LS74AN3

Texas Instruments

SN74LS74AN3 by Texas Instruments

SN74LS74AN3 by Texas Instruments is a TTL technology latch with 2 functions, operating at 5V. It has a propagation delay of 40ns and operates b/w 0-70°C. Commonly used in applications requiring positive edge triggering, this IC comes in an IN-LINE package style ideal for various electronic circuits.

Median Price

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Lifecycle Status

Suppliers In-Stock

3

In-Stock Inventory

1k+

Distributors (In-Stock)

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Vyrian

USA . 8,424 parts In-Stock

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Digiode

USA . 933 parts In-Stock

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Nova Conductors

Japan . 84 parts In-Stock

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Distributors (Availability)

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AZTECH Wire

Italy . 405 parts In-Stock

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$9.767

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405

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Parana Technologies

USA . 1,500 parts In-Stock

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$25.260

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$25.894

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$25.260

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$25.894

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DigiPath Technology Company

USA . 1,785 parts In-Stock

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$27.814

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$27.814

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ChromeModa Solutions

Germany . 3,534 parts In-Stock

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$28.382

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$23.273

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$28.382

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IDEA Electronic Components Group

UK . 903 parts In-Stock

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$28.382

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$26.963

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$25.544

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903

$28.382

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Ampacity Inc.

Singapore . 773 parts In-Stock

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$43.000

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$43.000

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One Stop Electronics

USA . 1,422 parts In-Stock

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$46.000

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Continental Prestige Electronics

USA . 6,434 parts In-Stock

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Argo Parts USA

USA . 2,107 parts In-Stock

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Corphita

USA . 814 parts In-Stock

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Bastille Electronics

Australia . 300 parts In-Stock

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Overview

Unlock the power of reliable data storage with the SN74LS74AN3 by Texas Instruments. As a leading manufacturer in the industry, Texas Instruments delivers top-notch quality and performance in the category of Latches & Flip-Flops. This product offers customers seamless operation, fast propagation delay, and a wide range of applications. With a nominal supply voltage of 5V and dual functions in a compact rectangular package, the SN74LS74AN3 provides exceptional value and benefits for your electronic projects. Trust Texas Instruments for superior technology that meets your needs every time.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

The use of plastic/epoxy material makes the latch durable and lightweight, ensuring reliability and ease of handling.

No. of Functions: 2

Having 2 functions in one component increases the versatility and functionality of the latch, offering more options for different applications.

Nominal Supply Voltage / Vsup (V): 5

Operating at a nominal supply voltage of 5V makes the latch compatible with common power supplies, simplifying integration into existing systems.

Propagation Delay (tpd): 40 ns

With a fast propagation delay of 40ns, the latch provides rapid response times, ideal for high-speed applications that require quick switching.

Trigger Type: POSITIVE EDGE

The positive edge trigger type ensures precise timing control, making the latch suitable for applications that require accurate signal detection.

Technology: TTL

Utilizing TTL technology ensures compatibility with TTL logic systems, enhancing the latch's usability in various electronic circuits and designs.

Technical Specifications

Latches & Flip-Flops SN74LS74AN3 attributes and parameters. Explore more Latches & Flip-Flops devices from Texas Instruments

Specs

Family:

LS

JESD-30 Code:

R-PDIP-T14

Length:

19.305 mm

Logic IC Type:

No. of Bits:

1

No. of Functions:

2

No. of Terminals:

14

Maximum Operating Temperature:

70 Cel

Minimum Operating Temperature:

0 Cel

Output Polarity:

COMPLEMENTARY

Package Body Material:

PLASTIC/EPOXY

Package Code:

DIP

Package Equivalence Code:

DIP14,.3

Package Shape:

Package Style (Meter):

IN-LINE

Peak Reflow Temperature (C):

NOT SPECIFIED

Power Supplies (V):

5

Propagation Delay (tpd):

40 ns

Qualification:

Not Qualified

Maximum Seated Height:

5.08 mm

Sub-Category:

FF/Latches

Maximum Supply Voltage (Vsup):

5.25 V

Minimum Supply Voltage (Vsup):

4.75 V

Nominal Supply Voltage / Vsup (V):

5

Surface Mount:

NO

Technology:

TTL

Temperature Grade:

Terminal Form:

Terminal Pitch:

2.54 mm

Terminal Position:

DUAL

Maximum Time At Peak Reflow Temperature (s):

NOT SPECIFIED

Trigger Type:

POSITIVE EDGE

Width:

7.62 mm

Minimum fmax:

25 MHz

Trade Compliance

SN74LS74AN3 Logic ICs trade compliance attributes, and parameters.

HTS

8542.39.00.01

SB

8542.39.00.00

NSN

5962-01-058-1539, 5962010581539, 5962-99-738-9242, 5962997389242

NIIN

010581539, 997389242

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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