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74AUP1G79GN,132

NXP Semiconductors

74AUP1G79GN,132 by NXP Semiconductors

74AUP1G79GN,132 by NXP Semiconductors is a latch with a propagation delay of 25.6 ns and operates at a nominal voltage of 1.1V. It is used in automotive applications due to its small outline package and positive edge trigger type, making it suitable for high-speed operations up to 510 MHz.

Median Price

$0.449

Lifecycle Status

Suppliers In-Stock

9

In-Stock Inventory

1k+

Distributors (Authorized)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Rochester

USA . 150,000 parts In-Stock

1+ parts

-

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$0.433

1k+ parts

$0.359

10k+ parts

$0.321

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-

$0.433

$0.359

$0.321

DigiKey

USA . 150,000 parts In-Stock

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$0.540

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$0.540

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Verical

USA . 150,000 parts In-Stock

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$0.449

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$0.401

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$0.449

$0.401

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Nova Conductors

Japan . 73 parts In-Stock

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$0.142

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Digiode

USA . 1,019 parts In-Stock

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$0.156

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Chip Stock

USA . 80,000 parts In-Stock

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Vyrian

USA . 3,775 parts In-Stock

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Anansix

USA . 2,080 parts In-Stock

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VNN

France . 661 parts In-Stock

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Distributors (Availability)

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Ampacity Inc.

Singapore . 149,721 parts In-Stock

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$0.139

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Argo Parts USA

USA . 2,471 parts In-Stock

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$0.142

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$0.138

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$0.138

Continental Prestige Electronics

USA . 914 parts In-Stock

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$0.142

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$0.139

914

$0.142

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$0.139

Netroflash

USA . 50 parts In-Stock

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$0.142

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$0.135

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$0.132

50

$0.142

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$0.135

$0.132

Corphita

USA . 1,697 parts In-Stock

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$0.148

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AZTECH Wire

Italy . 12,559 parts In-Stock

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QUARKTWIN TECHNOLOGY LTD

USA . 22,918 parts In-Stock

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Microchip USA

USA . 8,806 parts In-Stock

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UNI Independent Distributors

Spain . 8,381 parts In-Stock

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Supply Digital

USA . 2,846 parts In-Stock

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Overview

Unlock the power of reliable latches and flip-flops with the 74AUP1G79GN,132 by NXP Semiconductors. With a focus on quality and innovation, NXP Semiconductors delivers cutting-edge technology that meets the demands of various applications. This product offers customers exceptional value, benefits, and advantages, making it a top choice for those seeking high-performance components. Upgrade your projects with the 74AUP1G79GN,132 and experience superior functionality and efficiency like never before.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

This material provides durability and protection for the latch or flip-flop, making it suitable for various environments.

Propagation Delay At Nominal Supply: 25.6 ns

The fast propagation delay ensures quick and efficient operation of the latch or flip-flop, making it ideal for high-speed applications.

Surface Mount: YES

Surface mount capability allows for easy and convenient installation on PCBs, saving space and simplifying assembly processes.

Nominal Supply Voltage / Vsup (V): 1.1

The low nominal supply voltage of 1.1V makes this latch or flip-flop energy-efficient and suitable for low power applications.

Maximum Operating Temperature: 125 °C

With a high maximum operating temperature of 125°C, this latch or flip-flop can withstand elevated temperatures, making it suitable for industrial or automotive applications.

Trigger Type: POSITIVE EDGE

The positive edge trigger type ensures precise control over when the latch or flip-flop changes state, making it suitable for timing-critical applications.

Technology: CMOS

The CMOS technology used in this latch or flip-flop offers low power consumption and high noise immunity, making it reliable and efficient.

Technical Specifications

Latches & Flip-Flops 74AUP1G79GN,132 attributes and parameters. Explore more Latches & Flip-Flops devices from NXP Semiconductors

Specs

Family:

AUP/ULP/V

JESD-30 Code:

R-PDSO-N6

JESD-609 Code:

e3

Length:

1 mm

Load Capacitance (CL):

30 pF

Logic IC Type:

Maximum I (ol):

1.7 Amp

Moisture Sensitivity Level (MSL):

1

No. of Bits:

1

No. of Functions:

1

No. of Terminals:

6

Maximum Operating Temperature:

125 Cel

Minimum Operating Temperature:

-40 Cel

Output Polarity:

TRUE

Package Body Material:

PLASTIC/EPOXY

Package Code:

SON

Package Equivalence Code:

SOLCC6,.04,12

Package Shape:

Package Style (Meter):

SMALL OUTLINE

Packing Method:

TR

Peak Reflow Temperature (C):

260

Power Supplies (V):

1.2/3.3

Propagation Delay At Nominal Supply:

25.6 ns

Propagation Delay (tpd):

25.6 ns

Qualification:

Not Qualified

Maximum Seated Height:

.35 mm

Sub-Category:

FF/Latches

Maximum Supply Voltage (Vsup):

3.6 V

Minimum Supply Voltage (Vsup):

.8 V

Nominal Supply Voltage / Vsup (V):

1.1

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Finish:

TIN

Terminal Form:

Terminal Pitch:

.3 mm

Terminal Position:

DUAL

Maximum Time At Peak Reflow Temperature (s):

30

Trigger Type:

POSITIVE EDGE

Width:

.9 mm

Minimum fmax:

510 MHz

Trade Compliance

74AUP1G79GN,132 Logic ICs trade compliance attributes, and parameters.

HTS

8542.39.00.01

SB

8542.39.00.00

Manufacturer Highlights

NXP Semiconductors

NXP is a leading semiconductor company that creates cutting-edge technology to power secure connections in a smarter world. Founded in 2006, they have grown to become one of the top five global semiconductor companies and serve their customers in over 70 countries around the world.

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Management team

Executive Director, President, CEO

Kurt Sievers

Executive VP, CFO

Bill Betz

Executive VP, Chief Sales Officer

Ron Martino

Manufacturer fab locations 7

Fab name Location Fab Initiation Wafer Capacity

ICN8

Fabrication

Fab Initiation

1996

Netherlands

Nijmegen

Wafer Capacity

55,000

1996

55,000

ATMC (Austin Tech & Mfg Center)

Fabrication

Fab Initiation

1995

USA

Austin

Wafer Capacity

30,000

1995

30,000

N/A

Fabrication

Fab Initiation

1989

Germany

Boeblingen

Wafer Capacity

1989

CHD

Fabrication

Fab Initiation

1993

USA

Chandler

Wafer Capacity

30,000

1993

30,000

OHTC

Fabrication

Fab Initiation

1991

USA

Austin

Wafer Capacity

24,000

1991

24,000

New Expansion Fab

Fabrication

Fab Initiation

2026

USA

Austin

Wafer Capacity

2026

ECHO

Fabrication

Fab Initiation

2020

USA

Chandler

Wafer Capacity

10,000

2020

10,000

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