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SN74AS175BNSRE4

Texas Instruments

SN74AS175BNSRE4 by Texas Instruments

SN74AS175BNSRE4 by Texas Instruments is a 4-bit latch with a propagation delay of 10 ns, operating at a voltage range of 4.5V to 5.5V. It features positive edge triggering and complementary output polarity, suitable for commercial applications requiring fast data storage and retrieval in small outline packages.

Median Price

-

Lifecycle Status

Suppliers In-Stock

3

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Vyrian

USA . 8,699 parts In-Stock

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8,699

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Digiode

USA . 3,360 parts In-Stock

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3,360

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Nova Conductors

Japan . 59 parts In-Stock

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59

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Distributors (Availability)

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One Stop Electronics

USA . 423 parts In-Stock

1+ parts

$11.000

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423

$11.000

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Corohmni

South Africa . 580 parts In-Stock

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$13.835

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580

$13.835

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AZTECH Wire

Italy . 429 parts In-Stock

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$13.933

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429

$13.933

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Parana Technologies

USA . 676 parts In-Stock

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$18.025

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$18.175

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676

$18.025

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$18.175

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DigiPath Technology Company

USA . 541 parts In-Stock

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$19.848

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$18.260

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541

$19.848

$18.260

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IDEA Electronic Components Group

UK . 1,465 parts In-Stock

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$20.253

100+ parts

$19.240

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$18.228

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1,465

$20.253

$19.240

$18.228

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ChromeModa Solutions

Germany . 1,293 parts In-Stock

1+ parts

$20.253

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$16.607

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1,293

$20.253

$16.607

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Ampacity Inc.

Singapore . 319 parts In-Stock

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$29.000

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319

$29.000

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Semicontronic

India . 1,447 parts In-Stock

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$32.000

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$31.200

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$31.040

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1,447

$32.000

$31.200

$31.040

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Argo Parts USA

USA . 3,346 parts In-Stock

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3,346

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Continental Prestige Electronics

USA . 1,094 parts In-Stock

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Corphita

USA . 1,049 parts In-Stock

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1,049

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Bastille Electronics

Australia . 900 parts In-Stock

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900

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Advanced Electronics

New Zealand . 174 parts In-Stock

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174

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Overview

Unlock the potential of your electronics with the SN74AS175BNSRE4 by Texas Instruments. Crafted with precision and reliability, this high-quality latch & flip-flop device offers seamless integration and efficient operation for a wide range of applications. From consumer electronics to industrial automation, this versatile component delivers unmatched performance and value. Trust in Texas Instruments for cutting-edge technology that exceeds expectations.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

The plastic/epoxy material provides durability and protection to the internal components of the latch or flip-flop, ensuring long-term reliability.

Surface Mount: YES

The surface mount feature makes it easy to integrate the latch or flip-flop onto a PCB, saving space and simplifying the assembly process.

Nominal Supply Voltage / Vsup (V): 5

Having a nominal supply voltage of 5V makes it compatible with standard voltage levels in many electronic systems, providing easy integration.

Propagation Delay (tpd): 10 ns

With a low propagation delay of 10 ns, this latch or flip-flop allows for fast switching and response times in digital circuits.

Maximum Operating Temperature: 70 °C

The high maximum operating temperature of 70°C allows the latch or flip-flop to function reliably even in elevated temperature environments.

Technology: TTL

The TTL technology utilized in this product ensures compatibility with a wide range of digital systems, making it a versatile choice for various applications.

Technical Specifications

Latches & Flip-Flops SN74AS175BNSRE4 attributes and parameters. Explore more Latches & Flip-Flops devices from Texas Instruments

Specs

Family:

AS

JESD-30 Code:

R-PDSO-G16

JESD-609 Code:

e4

Length:

10.2 mm

Logic IC Type:

Moisture Sensitivity Level (MSL):

1

No. of Bits:

4

No. of Functions:

1

No. of Terminals:

16

Maximum Operating Temperature:

70 Cel

Minimum Operating Temperature:

0 Cel

Output Polarity:

COMPLEMENTARY

Package Body Material:

PLASTIC/EPOXY

Package Code:

SOP

Package Equivalence Code:

SOP16,.3

Package Shape:

Package Style (Meter):

SMALL OUTLINE

Packing Method:

TR

Peak Reflow Temperature (C):

260

Power Supplies (V):

5

Propagation Delay (tpd):

10 ns

Qualification:

Not Qualified

Maximum Seated Height:

2 mm

Sub-Category:

FF/Latches

Maximum Supply Voltage (Vsup):

5.5 V

Minimum Supply Voltage (Vsup):

4.5 V

Nominal Supply Voltage / Vsup (V):

5

Surface Mount:

YES

Technology:

TTL

Temperature Grade:

Terminal Finish:

NICKEL PALLADIUM GOLD

Terminal Form:

Terminal Pitch:

1.27 mm

Terminal Position:

DUAL

Maximum Time At Peak Reflow Temperature (s):

30

Trigger Type:

POSITIVE EDGE

Width:

5.3 mm

Minimum fmax:

100 MHz

Trade Compliance

SN74AS175BNSRE4 Logic ICs trade compliance attributes, and parameters.

HTS

8542.39.00.01

SB

8542.39.00.00

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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