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CD74AC112M96G4

Texas Instruments

CD74AC112M96G4 by Texas Instruments

CD74AC112M96G4 by Texas Instruments is a dual-function latches & flip-flops IC with 2 bits, operating at a nominal voltage of 3.3V and max frequency of 71MHz. It features negative edge trigger type, propagation delay of 129ns, and complementary output polarity. Ideal for military-grade applications requiring high-speed data processing in compact electronic systems.

Median Price

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Lifecycle Status

Suppliers In-Stock

3

In-Stock Inventory

1k+

Distributors (In-Stock)

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Digiode

USA . 2,445 parts In-Stock

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Vyrian

USA . 2,241 parts In-Stock

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Nova Conductors

Japan . 900 parts In-Stock

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900

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Distributors (Availability)

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AZTECH Wire

Italy . 585 parts In-Stock

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$16.379

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585

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One Stop Electronics

USA . 1,524 parts In-Stock

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$23.000

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Ampacity Inc.

Singapore . 1,418 parts In-Stock

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$23.000

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Parana Technologies

USA . 1,136 parts In-Stock

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$26.478

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$27.057

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$26.478

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DigiPath Technology Company

USA . 1,698 parts In-Stock

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$29.155

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$26.823

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$29.155

$26.823

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ChromeModa Solutions

Germany . 3,969 parts In-Stock

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$29.750

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$24.395

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$29.750

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IDEA Electronic Components Group

UK . 1,872 parts In-Stock

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$29.750

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$28.262

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$26.775

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QUARKTWIN TECHNOLOGY LTD

USA . 21,010 parts In-Stock

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Continental Prestige Electronics

USA . 5,238 parts In-Stock

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Argo Parts USA

USA . 4,144 parts In-Stock

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Glotronic Ltd.

UK . 3,790 parts In-Stock

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Corphita

USA . 3,636 parts In-Stock

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Microchip USA

USA . 2,973 parts In-Stock

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Perfect Parts

USA . 2,800 parts In-Stock

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Bastille Electronics

Australia . 800 parts In-Stock

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Overview

Elevate your electronic projects with the CD74AC112M96G4 by Texas Instruments, a top-quality latch & flip-flop component that boasts unparalleled reliability and precision engineering. As a leading manufacturer in the industry, Texas Instruments ensures that this product delivers exceptional performance in various applications. From its efficient design to its versatile functions, this small outline package offers customers incredible value with complementary output polarity and a wide operating temperature range. Trust Texas Instruments to provide you with the tools you need for success in your projects.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

The plastic/epoxy material used in the package body provides durability and protection for the internal components of the latch or flip-flop.

Surface Mount: YES

Being surface mountable makes it easier to integrate this latch or flip-flop into electronic circuit boards, saving space and simplifying assembly.

No. of Functions: 2

Having 2 functions allows for more versatility and functionality in the circuit design.

Nominal Supply Voltage / Vsup (V): 3.3

The 3.3V supply voltage is a common voltage level in many electronic systems, making this latch or flip-flop compatible with various applications.

Propagation Delay (tpd): 129 ns

With a low propagation delay, this latch or flip-flop can quickly respond to input changes, ensuring efficient operation in high-speed circuitry.

Maximum Operating Temperature: 125 °C

The high operating temperature range of 125°C makes this latch or flip-flop suitable for use in industrial and automotive applications where temperature fluctuations are common.

Technology: CMOS

CMOS technology offers low power consumption and high noise immunity, making this latch or flip-flop energy-efficient and reliable in noise-sensitive environments.

Technical Specifications

Latches & Flip-Flops CD74AC112M96G4 attributes and parameters. Explore more Latches & Flip-Flops devices from Texas Instruments

Specs

Family:

AC

JESD-30 Code:

R-PDSO-G16

JESD-609 Code:

e4

Length:

9.9 mm

Load Capacitance (CL):

50 pF

Logic IC Type:

Maximum Frequency At Nominal Supply:

71000000 Hz

Maximum I (ol):

24 Amp

Moisture Sensitivity Level (MSL):

1

No. of Bits:

2

No. of Functions:

2

No. of Terminals:

16

Maximum Operating Temperature:

125 Cel

Minimum Operating Temperature:

-55 Cel

Output Polarity:

COMPLEMENTARY

Package Body Material:

PLASTIC/EPOXY

Package Code:

SOP

Package Equivalence Code:

SOP16,.25

Package Shape:

Package Style (Meter):

SMALL OUTLINE

Packing Method:

TR

Peak Reflow Temperature (C):

260

Power Supplies (V):

3.3/5

Propagation Delay (tpd):

129 ns

Qualification:

Not Qualified

Maximum Seated Height:

1.75 mm

Sub-Category:

FF/Latches

Maximum Supply Voltage (Vsup):

5.5 V

Minimum Supply Voltage (Vsup):

1.5 V

Nominal Supply Voltage / Vsup (V):

3.3

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Finish:

NICKEL PALLADIUM GOLD

Terminal Form:

Terminal Pitch:

1.27 mm

Terminal Position:

DUAL

Maximum Time At Peak Reflow Temperature (s):

30

Trigger Type:

NEGATIVE EDGE

Width:

3.9 mm

Minimum fmax:

100 MHz

Trade Compliance

CD74AC112M96G4 Logic ICs trade compliance attributes, and parameters.

HTS

8542.39.00.01

SB

8542.39.00.00

PCN

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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