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MC14175BDG

Onsemi

MC14175BDG by Onsemi

MC14175BDG by Onsemi is a 4-bit latch with 400 ns propagation delay, operating at -55 to 125 °C. It has a supply voltage of 5V, load capacitance of 50 pF, and can handle up to 2MHz frequency. Ideal for military-grade applications requiring positive edge triggering in small outline packages.

Median Price

$0.314

Lifecycle Status

Suppliers In-Stock

17

In-Stock Inventory

1k+

Distributors (Authorized)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Farnell

UK . 26,798 parts In-Stock

1+ parts

$0.240

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$0.110

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26,798

$0.240

$0.110

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DigiKey

USA . 898 parts In-Stock

1+ parts

$0.590

100+ parts

$0.349

1k+ parts

$0.289

10k+ parts

$0.259

898

$0.590

$0.349

$0.289

$0.259

Mouser Electronics

USA . 201 parts In-Stock

1+ parts

$0.590

100+ parts

$0.316

1k+ parts

$0.288

10k+ parts

$0.264

201

$0.590

$0.316

$0.288

$0.264

Rochester

USA . 26,798 parts In-Stock

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-

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$0.314

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$0.260

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$0.232

26,798

-

$0.314

$0.260

$0.232

Verical

USA . 23,904 parts In-Stock

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$0.290

23,904

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$0.290

Avnet

USA . 4,320 parts In-Stock

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4,320

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Flip Electronics (Authorized)

USA . 288 parts In-Stock

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288

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Distributors (In-Stock)

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Digiode

USA . 1,370 parts In-Stock

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$0.228

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1,370

$0.228

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Nova Conductors

Japan . 50 parts In-Stock

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$0.310

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50

$0.310

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TME

Poland . 372 parts In-Stock

1+ parts

$0.560

100+ parts

$0.335

1k+ parts

$0.287

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372

$0.560

$0.335

$0.287

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NAC Semi

USA . 13,824 parts In-Stock

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$0.421

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13,824

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Vyrian

USA . 13,067 parts In-Stock

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Prism Electronics

USA . 2,144 parts In-Stock

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ACDS - Activité Composants Distribution Service

France . 1,936 parts In-Stock

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Flip Electronics

USA . 288 parts In-Stock

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288

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Pegasus Components GmbH

Germany . 192 parts In-Stock

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LittleDiode

UK . 45 parts In-Stock

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Distributors (Availability)

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Semicontronic

India . 12,842 parts In-Stock

1+ parts

$0.204

100+ parts

$0.199

1k+ parts

$0.198

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12,842

$0.204

$0.199

$0.198

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Corphita

USA . 1,982 parts In-Stock

1+ parts

$0.216

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1,982

$0.216

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Corohmni

South Africa . 368 parts In-Stock

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$0.240

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368

$0.240

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Continental Prestige Electronics

USA . 6,216 parts In-Stock

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$0.310

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$0.304

6,216

$0.310

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$0.304

Argo Parts USA

USA . 4,285 parts In-Stock

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$0.310

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$0.301

4,285

$0.310

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$0.301

Ampacity Inc.

Singapore . 12,821 parts In-Stock

1+ parts

$0.444

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12,821

$0.444

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Aztec Data Supply Inc.

USA . 2,137 parts In-Stock

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$9.180

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Perfect Parts

USA . 6,676 parts In-Stock

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SupplyDigital Components

Austria . 5,648 parts In-Stock

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Problanco Electronics

Mexico . 5,278 parts In-Stock

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Kulean Microsystems

USA . 4,912 parts In-Stock

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Kepictronics

USA . 3,764 parts In-Stock

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TANS Electronics

Latvia . 3,299 parts In-Stock

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Authorized Procurement Solutions

USA . 2,538 parts In-Stock

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Robosynatics

Brazil . 350 parts In-Stock

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Lucentia Tech

USA . 350 parts In-Stock

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UHIMA Technologies

Türkiye . 15 parts In-Stock

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Overview

Discover the MC14175BDG by Onsemi, a high-quality latch & flip-flop device that boasts superior performance and reliability. Manufactured by Onsemi, a trusted name in the industry, this product offers unmatched value and benefits to customers. Perfect for a wide range of applications, this versatile component provides seamless operation and efficiency. Upgrade your systems with the MC14175BDG and experience advanced technology at its finest.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

Durable and lightweight material, ideal for electronic components

Surface Mount: YES

Easy to install and saves space on PCB

No. of Bits: 4

Suitable for applications requiring 4-bit operation

Nominal Supply Voltage / Vsup (V): 5

Standard operating voltage for many electronic devices

Load Capacitance (CL): 50 pF

Helps in maintaining stable and accurate signal transmission

Propagation Delay (tpd): 400 ns

Fast response time for efficient operation

Trigger Type: POSITIVE EDGE

Ensures reliable activation of the latch or flip-flop

Technology: CMOS

Low power consumption and high noise immunity

Maximum Operating Temperature: 125 °C

Suitable for a wide range of operating environments

Minimum Operating Temperature: -55 °C

Can withstand extreme cold temperatures

Technical Specifications

Latches & Flip-Flops MC14175BDG attributes and parameters. Explore more Latches & Flip-Flops devices from Onsemi

Specs

Family:

4000/14000/40000

JESD-30 Code:

R-PDSO-G16

JESD-609 Code:

e3

Length:

9.9 mm

Load Capacitance (CL):

50 pF

Logic IC Type:

Maximum Frequency At Nominal Supply:

2000000 Hz

Moisture Sensitivity Level (MSL):

1

No. of Bits:

4

No. of Functions:

1

No. of Terminals:

16

Maximum Operating Temperature:

125 Cel

Minimum Operating Temperature:

-55 Cel

Output Polarity:

COMPLEMENTARY

Package Body Material:

PLASTIC/EPOXY

Package Code:

SOP

Package Equivalence Code:

SOP16,.25

Package Shape:

Package Style (Meter):

SMALL OUTLINE

Peak Reflow Temperature (C):

260

Power Supplies (V):

5/15

Propagation Delay (tpd):

400 ns

Qualification:

Not Qualified

Maximum Seated Height:

1.75 mm

Sub-Category:

FF/Latches

Maximum Supply Voltage (Vsup):

18 V

Minimum Supply Voltage (Vsup):

3 V

Nominal Supply Voltage / Vsup (V):

5

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Finish:

MATTE TIN

Terminal Form:

Terminal Pitch:

1.27 mm

Terminal Position:

DUAL

Maximum Time At Peak Reflow Temperature (s):

30

Trigger Type:

POSITIVE EDGE

Width:

3.9 mm

Minimum fmax:

6.5 MHz

Trade Compliance

MC14175BDG Logic ICs trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8542.39.00.01

SB

8542.39.00.00

Manufacturer Highlights

Onsemi

Established in 1999, Onsemi is a leading global provider of power and image-sensing technologies. They are dedicated to building a better future for the automotive, industrial, cloud, medical, and IoT markets. Onsemi's core technologies include analog, digital, and mixed-signal products that offer innovative solutions for advanced automotive systems; highly reliable power management products for industrial applications; low-cost imaging solutions for medical equipment and consumer electronics; and robust communication architectures for the Internet of Things (IoT).

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Management team

President, CEO

Hassane El-Khoury

Executive VP, CFO, Treasurer

Thad Trent

Senior VP

Ross F. Jatou

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

Aizu Fab

Fabrication

Fab Initiation

1995

Japan

Aizu Wakamatsu

Wafer Capacity

52,000

1995

52,000

Si/EPI Fab

Fabrication

Fab Initiation

2018

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

10,000

2018

10,000

Expansion Phase 1 for SiC / EPI

Fabrication

Fab Initiation

2019

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

14,500

2019

14,500

Expansion Phase 2 for SiC / EPI

Fabrication

Fab Initiation

2024

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

2024

SiC Fab

Fabrication

Fab Initiation

2022

USA

Hudson

Wafer Capacity

2022

Bucheon

Fabrication

Fab Initiation

2013

South Korea

Bucheon

Wafer Capacity

61,000

2013

61,000

ISMF - Malaysia

Fabrication

Fab Initiation

1990

Malaysia

Seremban

Wafer Capacity

95,000

1990

95,000

Roznov Device Fab

Fabrication

Fab Initiation

1987

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

80,000

1987

80,000

Fab 10

Fabrication

Fab Initiation

2002

USA

East Fishkill

Wafer Capacity

15,000

2002

15,000

Burlington

Fabrication

Fab Initiation

1986

Canada

Burlington

Wafer Capacity

1986

Gresham

Fabrication

Fab Initiation

1998

USA

Gresham

Wafer Capacity

45,000

1998

45,000

Bucheon 150mm

Fabrication

Fab Initiation

2000

South Korea

Bucheon

Wafer Capacity

50,000

2000

50,000

Rochester

Fabrication

Fab Initiation

1983

USA

Rochester

Wafer Capacity

10,000

1983

10,000

Nampa

Fabrication

Fab Initiation

1995

USA

Nampa

Wafer Capacity

1995

Pennsylvania

Fabrication

Fab Initiation

1997

USA

Mountain Top

Wafer Capacity

36,000

1997

36,000

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