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74AUP2G79GS

NXP Semiconductors

74AUP2G79GS by NXP Semiconductors

The NXP Semiconductors 74AUP2G79GS is a CMOS latch with 2 functions, operating at a supply voltage range of 0.8V to 3.6V. It features a propagation delay of 25.6ns and can handle temperatures from -40°C to 125°C, making it suitable for automotive applications requiring fast response times in compact designs.

Median Price

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Lifecycle Status

Suppliers In-Stock

5

In-Stock Inventory

1k+

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Vyrian

USA . 7,161 parts In-Stock

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Digiode

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VNN

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Anansix

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Nova Conductors

Japan . 53 parts In-Stock

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AZTECH Wire

Italy . 9,897 parts In-Stock

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Ampacity Inc.

Singapore . 1,401 parts In-Stock

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One Stop Electronics

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Continental Prestige Electronics

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Corphita

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Supply Digital

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Argo Parts USA

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Bastille Electronics

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Perfect Parts

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Overview

Unlock endless possibilities with the 74AUP2G79GS by NXP Semiconductors, a top-tier manufacturer in the industry. Ideal for latches & flip-flops applications, this product offers exceptional quality and reliability. With a nominal supply voltage of 1.1V and a compact package style, it provides seamless integration and superior performance. Experience fast propagation delay, positive edge triggering, and true output polarity, making it perfect for automotive-grade projects. Elevate your designs with the unparalleled value and benefits that this cutting-edge product brings to the table.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

Plastic/Epoxy material provides durability and resistance to environmental conditions, making the product suitable for various applications.

Surface Mount: YES

Surface mount design allows for easy installation on circuit boards, saving space and simplifying assembly processes.

No. of Functions: 2

Having two functions in one component increases versatility and functionality in circuit design.

Propagation Delay (tpd): 25.6 ns

Low propagation delay ensures fast and efficient operation, making the latch or flip-flop responsive to input signals.

Trigger Type: POSITIVE EDGE

Positive edge triggering allows for precise control and synchronization of data input, enhancing performance in digital systems.

Technology: CMOS

CMOS technology offers low power consumption and high noise immunity, making the product energy-efficient and reliable.

Maximum Operating Temperature: 125 °C

High maximum operating temperature range ensures reliability and stability in harsh environmental conditions.

Technical Specifications

Latches & Flip-Flops 74AUP2G79GS attributes and parameters. Explore more Latches & Flip-Flops devices from NXP Semiconductors

Specs

Family:

AUP/ULP/V

JESD-30 Code:

R-PDSO-N8

JESD-609 Code:

e3

Length:

1.35 mm

Logic IC Type:

Moisture Sensitivity Level (MSL):

1

No. of Bits:

1

No. of Functions:

2

No. of Terminals:

8

Maximum Operating Temperature:

125 Cel

Minimum Operating Temperature:

-40 Cel

Output Polarity:

TRUE

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Shape:

Package Style (Meter):

SMALL OUTLINE, VERY THIN PROFILE

Propagation Delay (tpd):

25.6 ns

Qualification:

Not Qualified

Maximum Seated Height:

.35 mm

Maximum Supply Voltage (Vsup):

3.6 V

Minimum Supply Voltage (Vsup):

.8 V

Nominal Supply Voltage / Vsup (V):

1.1

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Finish:

TIN

Terminal Form:

Terminal Pitch:

.35 mm

Terminal Position:

DUAL

Trigger Type:

POSITIVE EDGE

Width:

1 mm

Minimum fmax:

510 MHz

Trade Compliance

74AUP2G79GS Logic ICs trade compliance attributes, and parameters.

HTS

8542.39.00.01

SB

8542.39.00.00

Manufacturer Highlights

NXP Semiconductors

NXP is a leading semiconductor company that creates cutting-edge technology to power secure connections in a smarter world. Founded in 2006, they have grown to become one of the top five global semiconductor companies and serve their customers in over 70 countries around the world.

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Management team

Executive Director, President, CEO

Kurt Sievers

Executive VP, CFO

Bill Betz

Executive VP, Chief Sales Officer

Ron Martino

Manufacturer fab locations 7

Fab name Location Fab Initiation Wafer Capacity

ICN8

Fabrication

Fab Initiation

1996

Netherlands

Nijmegen

Wafer Capacity

55,000

1996

55,000

ATMC (Austin Tech & Mfg Center)

Fabrication

Fab Initiation

1995

USA

Austin

Wafer Capacity

30,000

1995

30,000

N/A

Fabrication

Fab Initiation

1989

Germany

Boeblingen

Wafer Capacity

1989

CHD

Fabrication

Fab Initiation

1993

USA

Chandler

Wafer Capacity

30,000

1993

30,000

OHTC

Fabrication

Fab Initiation

1991

USA

Austin

Wafer Capacity

24,000

1991

24,000

New Expansion Fab

Fabrication

Fab Initiation

2026

USA

Austin

Wafer Capacity

2026

ECHO

Fabrication

Fab Initiation

2020

USA

Chandler

Wafer Capacity

10,000

2020

10,000

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