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SN74LS273NS

Texas Instruments

SN74LS273NS by Texas Instruments

SN74LS273NS by Texas Instruments is an 8-bit latch with a propagation delay of 27ns, ideal for applications requiring fast data storage. Operating b/w 0-70°C, it has a supply voltage range of 4.75-5.25V and supports a max frequency of 30MHz. This small outline package with gull wing terminals is suitable for commercial-grade TTL technology projects.

Median Price

$0.396

Lifecycle Status

Suppliers In-Stock

9

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Nova Conductors

Japan . 450 parts In-Stock

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$0.396

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Chip Stock

USA . 7,500 parts In-Stock

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Digiode

USA . 2,691 parts In-Stock

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Vyrian

USA . 1,416 parts In-Stock

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PC Components Company LLC

USA . 350 parts In-Stock

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350

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Bristol Electronics

USA . 350 parts In-Stock

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350

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Cyclops Electronics Ltd

UK . 20 parts In-Stock

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Electronic Expediters

USA . 17 parts In-Stock

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LWI Electronics Inc

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Distributors (Availability)

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Continental Prestige Electronics

USA . 6,675 parts In-Stock

1+ parts

$0.396

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$0.388

6,675

$0.396

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Netroflash

USA . 2,000 parts In-Stock

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$0.396

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$0.376

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$0.368

2,000

$0.396

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$0.368

Argo Parts USA

USA . 1,789 parts In-Stock

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$0.396

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$0.384

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$0.384

Microchip USA

USA . 2,885 parts In-Stock

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$2.795

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AZTECH Wire

Italy . 441 parts In-Stock

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$6.744

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Parana Technologies

USA . 393 parts In-Stock

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$8.863

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$9.547

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$8.863

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ChromeModa Solutions

Germany . 3,401 parts In-Stock

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$9.958

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$8.166

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$9.958

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IDEA Electronic Components Group

UK . 98 parts In-Stock

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$9.958

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$9.460

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$8.962

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Corohmni

South Africa . 134 parts In-Stock

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$26.326

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Ampacity Inc.

Singapore . 617 parts In-Stock

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$36.000

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One Stop Electronics

USA . 1,159 parts In-Stock

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$44.000

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Corphita

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DigiPath Technology Company

USA . 1,079 parts In-Stock

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$8.978

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A-Z Elektronik GmbH

Germany . 245 parts In-Stock

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Overview

Enhance your electronic projects with the SN74LS273NS by Texas Instruments, a high-quality latch & flip-flop component that offers reliability and precision. Manufactured by the trusted brand Texas Instruments, this versatile product is perfect for a wide range of applications in the electronics industry. With a nominal supply voltage of 5V and a fast propagation delay of 27ns, this component ensures seamless performance and efficiency. Experience the value and benefits that this small outline package provides, offering true output polarity and positive edge trigger type for smooth operation. Upgrade your projects with the SN74LS273NS and unlock endless possibilities in electronics design.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

The use of plastic/epoxy material makes this latch/flip-flop lightweight and durable, ideal for a variety of applications.

Surface Mount: YES

This latch/flip-flop is designed for surface mount installation, allowing for easy and space-saving integration into circuit boards.

Package Shape: RECTANGULAR

The rectangular package shape of this latch/flip-flop is convenient for placement and organization within electronic assemblies.

No. of Bits: 8

With 8 bits, this latch/flip-flop offers sufficient capacity for processing and storing data in digital systems.

Nominal Supply Voltage: 5V

Operating at a nominal supply voltage of 5V, this latch/flip-flop is compatible with standard power sources.

No. of Terminals: 20

With 20 terminals, this latch/flip-flop offers extensive connectivity options for interfacing with other components.

Package Style: SMALL OUTLINE

The small outline package style of this latch/flip-flop ensures efficient use of space on circuit boards.

Propagation Delay: 27ns

With a low propagation delay of 27ns, this latch/flip-flop is capable of fast and efficient data processing.

Maximum Operating Temperature: 70 °C

Operating reliably at temperatures up to 70 °C, this latch/flip-flop is suitable for a range of environmental conditions.

Trigger Type: POSITIVE EDGE

The positive edge trigger type of this latch/flip-flop enables precise timing and control of data inputs and outputs.

Minimum Operating Temperature: 0 °C

Designed to operate effectively at temperatures as low as 0 °C, this latch/flip-flop is versatile in various settings.

Terminal Finish: NICKEL PALLADIUM GOLD

The nickel palladium gold terminal finish ensures high conductivity and corrosion resistance for reliable performance.

Terminal Position: DUAL

With dual terminal positions, this latch/flip-flop offers flexibility in circuit board layout and connectivity options.

Maximum Seated Height: 2mm

The maximum seated height of 2mm makes this latch/flip-flop suitable for compact electronic designs.

Width: 5.3mm

The 5.3mm width of this latch/flip-flop allows for efficient placement and organization within electronic assemblies.

Output Polarity: TRUE

The true output polarity of this latch/flip-flop ensures accurate signal transmission and compatibility with digital systems.

Minimum Supply Voltage: 4.75V

With a minimum supply voltage of 4.75V, this latch/flip-flop has a wide operating range for versatile applications.

Maximum Time At Peak Reflow Temperature: 30s

The maximum time at peak reflow temperature of 30s ensures proper soldering and mounting of this latch/flip-flop.

Peak Reflow Temperature: 260 °C

Capable of withstanding peak reflow temperatures of 260 °C, this latch/flip-flop is durable and reliable during assembly processes.

Length: 12.6mm

The 12.6mm length of this latch/flip-flop is suitable for compact electronic designs and efficient use of space.

Temperature Grade: COMMERCIAL

Designed for commercial temperature ranges, this latch/flip-flop is suitable for a wide range of applications.

Technology: TTL

Based on TTL technology, this latch/flip-flop offers reliable and efficient digital signal processing capabilities.

Terminal Form: GULL WING

The gull wing terminal form of this latch/flip-flop ensures secure mounting and connectivity within electronic systems.

Terminal Pitch: 1.27mm

With a terminal pitch of 1.27mm, this latch/flip-flop allows for precise and compact arrangement of terminals on circuit boards.

Minimum fmax: 30MHz

With a minimum fmax of 30MHz, this latch/flip-flop is capable of high-speed data processing and transmission.

Maximum Supply Voltage: 5.25V

Operating within a maximum supply voltage of 5.25V, this latch/flip-flop is compatible with various power sources.

Technical Specifications

Latches & Flip-Flops SN74LS273NS attributes and parameters. Explore more Latches & Flip-Flops devices from Texas Instruments

Specs

Family:

LS

JESD-30 Code:

R-PDSO-G20

JESD-609 Code:

e4

Length:

12.6 mm

Logic IC Type:

Moisture Sensitivity Level (MSL):

1

No. of Bits:

8

No. of Functions:

1

No. of Terminals:

20

Maximum Operating Temperature:

70 Cel

Minimum Operating Temperature:

0 Cel

Output Polarity:

TRUE

Package Body Material:

PLASTIC/EPOXY

Package Code:

SOP

Package Shape:

Package Style (Meter):

SMALL OUTLINE

Peak Reflow Temperature (C):

260

Propagation Delay (tpd):

27 ns

Qualification:

Not Qualified

Maximum Seated Height:

2 mm

Maximum Supply Voltage (Vsup):

5.25 V

Minimum Supply Voltage (Vsup):

4.75 V

Nominal Supply Voltage / Vsup (V):

5

Surface Mount:

YES

Technology:

TTL

Temperature Grade:

Terminal Finish:

NICKEL PALLADIUM GOLD

Terminal Form:

Terminal Pitch:

1.27 mm

Terminal Position:

DUAL

Maximum Time At Peak Reflow Temperature (s):

30

Trigger Type:

POSITIVE EDGE

Width:

5.3 mm

Minimum fmax:

30 MHz

Trade Compliance

SN74LS273NS Logic ICs trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8542.39.00.01

SB

8542.39.00.00

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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