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SN74HC273DW

Texas Instruments

SN74HC273DW by Texas Instruments

SN74HC273DW by Texas Instruments is an 8-bit latch with a propagation delay of 200 ns at 5V. It operates in industrial temperatures, has a max frequency of 21 MHz, and uses CMOS technology. Ideal for applications requiring positive edge triggering and low power consumption.

Median Price

$0.779

Lifecycle Status

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Adafruit Industries

USA . 350 parts In-Stock

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Mouser Electronics

USA . 4 parts In-Stock

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$0.870

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$0.607

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$1.350

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DigiKey

USA . 16,929 parts In-Stock

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Rochester

USA . 16,374 parts In-Stock

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Verical

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Greenchips

USA . 492 parts In-Stock

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TEDSS.com

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Digiode

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Component Electronics Inc.

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Schukat

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SIE Connect GmbH - GreenChips

Germany . 492 parts In-Stock

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Semicontronic

India . 8,379 parts In-Stock

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$0.479

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$0.467

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$0.465

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Ampacity Inc.

Singapore . 8,306 parts In-Stock

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Corphita

USA . 4,492 parts In-Stock

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Component Stockers USA

USA . 24,366 parts In-Stock

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$0.480

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Aranea Global

USA . 2,000 parts In-Stock

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$0.589

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$0.565

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Continental Prestige Electronics

USA . 6,740 parts In-Stock

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$0.601

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Argo Parts USA

USA . 4,539 parts In-Stock

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$0.601

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$0.583

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Corohmni

South Africa . 678 parts In-Stock

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$0.614

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Advanced Electronics

New Zealand . 350 parts In-Stock

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$0.710

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$0.653

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$0.612

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Microchip USA

USA . 8,673 parts In-Stock

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Parana Technologies

USA . 1,041 parts In-Stock

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$23.928

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DigiPath Technology Company

USA . 2,064 parts In-Stock

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$25.645

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$23.593

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IDEA Electronic Components Group

UK . 2,104 parts In-Stock

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$26.168

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$24.860

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$23.551

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ChromeModa Solutions

Germany . 838 parts In-Stock

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$26.168

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$21.458

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Perfect Parts

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Overview

Unlock the power of seamless data storage and retrieval with the SN74HC273DW by Texas Instruments. Built with precision and expertise, this high-quality latch & flip-flop device guarantees reliability and efficiency in various applications. From industrial automation to consumer electronics, this product offers unmatched value and performance. Say goodbye to delays and errors with its fast propagation delay and true output polarity. Trust Texas Instruments for cutting-edge technology that delivers exceptional results. Upgrade your systems today with the SN74HC273DW.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

This material provides durability and reliability for the product.

Propagation Delay At Nominal Supply: 200 ns

Fast propagation delay ensures quick response time for signal processing.

Surface Mount: YES

Surface mount capability allows for easy installation and space-saving design.

Package Shape: RECTANGULAR

Rectangular shape allows for efficient use of board space.

No. of Bits: 8

8 bits provide enough capacity for handling complex operations.

Nominal Supply Voltage / Vsup (V): 5

5V supply voltage is common and widely available for easy integration.

Load Capacitance (CL): 50 pF

Low load capacitance ensures minimal interference with signal transmission.

Power Supplies (V): 2/6

Compatible with both 2V and 6V power supplies for versatility.

No. of Terminals: 20

Sufficient number of terminals for connecting to external components.

Package Style (Meter): SMALL OUTLINE

Small outline package style saves space on the PCB.

Maximum I (ol): 5.2 Amp

High output current allows for driving external loads.

Propagation Delay (tpd): 200 ns

Consistent propagation delay ensures reliable performance.

Maximum Operating Temperature: 85 °C

High operating temperature range for reliable operation in various environments.

Trigger Type: POSITIVE EDGE

Positive edge triggering for precise control of signals.

Minimum Operating Temperature: -40 °C

Low operating temperature limit for versatility in different applications.

Terminal Finish: Nickel/Palladium/Gold (Ni/Pd/Au)

High-quality terminal finish for corrosion resistance and reliability.

Terminal Position: DUAL

Dual terminal position for flexibility in PCB layout.

Maximum Seated Height: 2.65 mm

Low seated height for compact design requirements.

Width: 7.5 mm

Slim width for space-saving integration.

Output Polarity: TRUE

True output polarity ensures accurate signal processing.

Minimum Supply Voltage (Vsup): 2 V

Low minimum supply voltage for energy efficiency.

Peak Reflow Temperature °C: 260

High peak reflow temperature for robust soldering.

Length: 12.8 mm

Moderate length for balanced PCB layout.

Temperature Grade: INDUSTRIAL

Industrial-grade temperature range for reliable performance in harsh conditions.

Maximum Frequency At Nominal Supply: 21000000 Hz

High maximum frequency for fast signal processing.

Technology: CMOS

CMOS technology for low power consumption and high noise immunity.

Terminal Form: GULL WING

Gull wing terminal form for easy soldering and secure connection.

Packing Method: TUBE

Tube packaging for convenient storage and handling.

Terminal Pitch: 1.27 mm

Standard terminal pitch for compatibility with common components.

Minimum fmax: 25 MHz

High minimum fmax for versatile performance.

Maximum Supply Voltage (Vsup): 6 V

High maximum supply voltage for flexibility in power options.

Maximum Power Supply Current (ICC): 0.08 mA

Low power supply current for energy efficiency.

Technical Specifications

Latches & Flip-Flops SN74HC273DW attributes and parameters. Explore more Latches & Flip-Flops devices from Texas Instruments

Specs

Additional Features:

DUMMY VAL

Family:

HC/UH

JESD-30 Code:

R-PDSO-G20

JESD-609 Code:

e4

Length:

12.8 mm

Load Capacitance (CL):

50 pF

Logic IC Type:

Maximum Frequency At Nominal Supply:

21000000 Hz

Maximum I (ol):

5.2 Amp

Moisture Sensitivity Level (MSL):

1

No. of Bits:

8

No. of Functions:

1

No. of Terminals:

20

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

-40 Cel

Output Polarity:

TRUE

Package Body Material:

PLASTIC/EPOXY

Package Code:

SOP

Package Equivalence Code:

SOP20,.4

Package Shape:

Package Style (Meter):

SMALL OUTLINE

Packing Method:

TUBE

Peak Reflow Temperature (C):

260

Power Supplies (V):

2/6

Maximum Power Supply Current (ICC):

.08 mA

Propagation Delay At Nominal Supply:

200 ns

Propagation Delay (tpd):

200 ns

Qualification:

Not Qualified

Maximum Seated Height:

2.65 mm

Sub-Category:

FF/Latches

Maximum Supply Voltage (Vsup):

6 V

Minimum Supply Voltage (Vsup):

2 V

Nominal Supply Voltage / Vsup (V):

5

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Finish:

Nickel/Palladium/Gold (Ni/Pd/Au)

Terminal Form:

Terminal Pitch:

1.27 mm

Terminal Position:

DUAL

Maximum Time At Peak Reflow Temperature (s):

NOT SPECIFIED

Trigger Type:

POSITIVE EDGE

Width:

7.5 mm

Minimum fmax:

25 MHz

Trade Compliance

SN74HC273DW Logic ICs trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8542.39.00.01

SB

8542.39.00.00

NSN

5962-01-415-3694, 5962014153694

NIIN

014153694

PCN

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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