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SN74LVC2G74DCURE4

Texas Instruments

SN74LVC2G74DCURE4 by Texas Instruments

SN74LVC2G74DCURE4 by Texas Instruments is a latches & flip-flops IC with 5.9ns propagation delay, 1.8V nominal voltage, and 32A max I (ol). It is used in automotive applications due to its positive edge trigger type and 175MHz max frequency at nominal supply.

Median Price

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Lifecycle Status

Suppliers In-Stock

6

In-Stock Inventory

1k+

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Chip Stock

USA . 34,500 parts In-Stock

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Digiode

USA . 4,296 parts In-Stock

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Vyrian

USA . 3,739 parts In-Stock

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Bristol Electronics

USA . 1,442 parts In-Stock

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Netsource Technology, Inc.

USA . 1,407 parts In-Stock

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Nova Conductors

Japan . 200 parts In-Stock

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200

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AZTECH Wire

Italy . 686 parts In-Stock

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$11.208

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Parana Technologies

USA . 2,013 parts In-Stock

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$11.757

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$12.156

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DigiPath Technology Company

USA . 590 parts In-Stock

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$12.946

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ChromeModa Solutions

Germany . 1,571 parts In-Stock

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$13.210

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$10.832

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IDEA Electronic Components Group

UK . 466 parts In-Stock

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$12.550

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Corohmni

South Africa . 180 parts In-Stock

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One Stop Electronics

USA . 689 parts In-Stock

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Advanced Electronics

New Zealand . 52 parts In-Stock

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Ampacity Inc.

Singapore . 903 parts In-Stock

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Semicontronic

India . 1,503 parts In-Stock

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Continental Prestige Electronics

USA . 4,712 parts In-Stock

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Argo Parts USA

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Microchip USA

USA . 3,720 parts In-Stock

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Perfect Parts

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Corphita

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Bastille Electronics

Australia . 550 parts In-Stock

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Overview

Discover the cutting-edge SN74LVC2G74DCURE4 by Texas Instruments, a top-tier manufacturer renowned for quality and innovation. This latch & flip-flop device offers high performance and reliability, making it ideal for a wide range of applications. With a nominal supply voltage of 1.8V and a propagation delay of only 5.9ns, this product delivers exceptional speed and efficiency. Experience seamless operation and superior output characteristics with the SN74LVC2G74DCURE4, designed to exceed customer expectations and provide unmatched value. Elevate your projects to the next level with this advanced technology solution.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

This material provides durability and protection to the internal components of the latch or flip-flop, ensuring a longer lifespan.

Propagation Delay At Nominal Supply: 5.9 ns

The low propagation delay ensures fast response times, making this latch or flip-flop suitable for high-speed applications.

Surface Mount: YES

Surface mount capability makes the installation process easier and allows for efficient use of PCB space.

Nominal Supply Voltage / Vsup (V): 1.8

Operates at a low supply voltage, making it energy efficient and suitable for battery-powered devices.

Output Characteristics: 3-STATE

The 3-STATE output allows for tristate logic implementation, providing flexibility and control in a circuit.

Technical Specifications

Latches & Flip-Flops SN74LVC2G74DCURE4 attributes and parameters. Explore more Latches & Flip-Flops devices from Texas Instruments

Specs

Family:

LVC/LCX/Z

JESD-30 Code:

R-PDSO-G8

JESD-609 Code:

e4

Length:

2.3 mm

Logic IC Type:

Maximum Frequency At Nominal Supply:

175000000 Hz

Maximum I (ol):

32 Amp

Moisture Sensitivity Level (MSL):

1

No. of Bits:

1

No. of Functions:

1

No. of Terminals:

8

Maximum Operating Temperature:

125 Cel

Minimum Operating Temperature:

-40 Cel

Output Characteristics:

3-STATE

Output Polarity:

COMPLEMENTARY

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Equivalence Code:

TSSOP8,.12,20

Package Shape:

Package Style (Meter):

SMALL OUTLINE, VERY THIN PROFILE, SHRINK PITCH

Packing Method:

TR

Peak Reflow Temperature (C):

260

Power Supplies (V):

3.3

Maximum Power Supply Current (ICC):

.01 mA

Propagation Delay At Nominal Supply:

5.9 ns

Propagation Delay (tpd):

14.4 ns

Qualification:

Not Qualified

Maximum Seated Height:

.9 mm

Sub-Category:

FF/Latches

Maximum Supply Voltage (Vsup):

5.5 V

Minimum Supply Voltage (Vsup):

1.65 V

Nominal Supply Voltage / Vsup (V):

1.8

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Finish:

Nickel/Palladium/Gold (Ni/Pd/Au)

Terminal Form:

Terminal Pitch:

.5 mm

Terminal Position:

DUAL

Maximum Time At Peak Reflow Temperature (s):

NOT SPECIFIED

Trigger Type:

POSITIVE EDGE

Width:

2 mm

Minimum fmax:

200 MHz

Trade Compliance

SN74LVC2G74DCURE4 Logic ICs trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8542.39.00.01

SB

8542.39.00.00

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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