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SN74AHC74PWE4

Texas Instruments

SN74AHC74PWE4 by Texas Instruments

SN74AHC74PWE4 by Texas Instruments is a dual-function latches & flip-flops IC with 10.5 ns propagation delay at 3.3V, suitable for industrial applications. It operates b/w -40 to 85°C, has a max frequency of 75MHz, and features complementary output polarity. This CMOS technology chip comes in a small outline package with surface mount capability.

Median Price

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Lifecycle Status

Suppliers In-Stock

3

In-Stock Inventory

1k+

Distributors (In-Stock)

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Vyrian

USA . 2,508 parts In-Stock

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Digiode

USA . 303 parts In-Stock

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Nova Conductors

Japan . 55 parts In-Stock

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Distributors (Availability)

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Corohmni

South Africa . 539 parts In-Stock

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$12.788

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AZTECH Wire

Italy . 631 parts In-Stock

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$15.765

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Parana Technologies

USA . 1,343 parts In-Stock

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$26.205

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$26.797

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Ampacity Inc.

Singapore . 266 parts In-Stock

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$27.000

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ChromeModa Solutions

Germany . 5,733 parts In-Stock

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$29.444

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$24.144

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IDEA Electronic Components Group

UK . 2,032 parts In-Stock

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$29.444

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$27.972

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$26.500

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$29.444

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Semicontronic

India . 181 parts In-Stock

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$30.000

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$29.250

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$29.100

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One Stop Electronics

USA . 552 parts In-Stock

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Argo Parts USA

USA . 4,971 parts In-Stock

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Continental Prestige Electronics

USA . 3,030 parts In-Stock

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Corphita

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DigiPath Technology Company

USA . 234 parts In-Stock

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Bastille Electronics

Australia . 10 parts In-Stock

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Overview

Discover the superior performance and reliability of the SN74AHC74PWE4 by Texas Instruments, a leading manufacturer in the industry. As part of the Latches & Flip-Flops category, this product offers seamless operation and versatility across various applications. With a focus on quality and innovation, Texas Instruments ensures that customers receive top-notch products that deliver exceptional value and benefits. Experience the difference with the SN74AHC74PWE4 and unlock a world of possibilities with its advanced features and cutting-edge technology.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

Plastic material is lightweight and durable, making the product suitable for various applications.

Propagation Delay At Nominal Supply: 10.5 ns

Low propagation delay ensures fast operation and response times.

Surface Mount: YES

Easy to integrate onto circuit boards, saving space and improving design flexibility.

No. of Functions: 2

Ability to perform multiple functions in a single component reduces overall system complexity.

Nominal Supply Voltage / Vsup (V): 3.3

Operates efficiently at a standard voltage level, ensuring compatibility with various systems.

Load Capacitance (CL): 50 pF

Designed to handle a moderate load capacitance for reliable performance.

Power Supplies (V): 2/5.5

Supports a wide range of power supply voltages for versatility in different applications.

Maximum I (ol): 8 Amp

High maximum output current capability allows for driving multiple loads without external buffering.

Trigger Type: POSITIVE EDGE

Positive edge trigger ensures precise timing control for triggering operations.

Maximum Operating Temperature: 85 °C

Can withstand high operating temperatures, making it suitable for industrial environments.

Technical Specifications

Latches & Flip-Flops SN74AHC74PWE4 attributes and parameters. Explore more Latches & Flip-Flops devices from Texas Instruments

Specs

Family:

AHC/VHC/H/U/V

JESD-30 Code:

R-PDSO-G14

JESD-609 Code:

e4

Length:

5 mm

Load Capacitance (CL):

50 pF

Logic IC Type:

Maximum Frequency At Nominal Supply:

75000000 Hz

Maximum I (ol):

8 Amp

Moisture Sensitivity Level (MSL):

1

No. of Bits:

1

No. of Functions:

2

No. of Terminals:

14

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

-40 Cel

Output Polarity:

COMPLEMENTARY

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Equivalence Code:

TSSOP14,.25

Package Shape:

Package Style (Meter):

SMALL OUTLINE, THIN PROFILE, SHRINK PITCH

Peak Reflow Temperature (C):

260

Power Supplies (V):

2/5.5

Propagation Delay At Nominal Supply:

10.5 ns

Propagation Delay (tpd):

17.5 ns

Qualification:

Not Qualified

Maximum Seated Height:

1.2 mm

Sub-Category:

FF/Latches

Maximum Supply Voltage (Vsup):

5.5 V

Minimum Supply Voltage (Vsup):

2 V

Nominal Supply Voltage / Vsup (V):

3.3

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Finish:

NICKEL PALLADIUM GOLD

Terminal Form:

Terminal Pitch:

.65 mm

Terminal Position:

DUAL

Maximum Time At Peak Reflow Temperature (s):

30

Trigger Type:

POSITIVE EDGE

Width:

4.4 mm

Minimum fmax:

110 MHz

Trade Compliance

SN74AHC74PWE4 Logic ICs trade compliance attributes, and parameters.

HTS

8542.39.00.01

SB

8542.39.00.00

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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