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NL17SZ74US

Onsemi

NL17SZ74US by Onsemi

NL17SZ74US by Onsemi is a CMOS latch/flip-flop with a propagation delay of 7.5 ns and a max frequency of 175 MHz. It is commonly used in industrial applications requiring positive edge triggering and operates within a temperature range of -40 to 85°C.

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NAC Semi

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Classic Components Corporation

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AZTECH Wire

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Aztec Data Supply Inc.

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Overview

Discover the NL17SZ74US by Onsemi, a top-quality latch and flip-flop in the industry. With its small outline and thin profile package, this versatile product is designed for various applications. Onsemi, renowned for their innovative manufacturing, ensures reliability and performance. Experience the benefits of this product's low propagation delay and positive edge trigger type. Its complementary output polarity and wide temperature range make it ideal for industrial use. Gain the competitive advantage with the NL17SZ74US and unlock endless possibilities for your projects.

Feature Benefit Bullets

Package Body Material:

PLASTIC/EPOXY - This material provides durability and protection for the internal components, making it suitable for various environments.

Propagation Delay At Nominal Supply:

7.5 ns - The fast propagation delay ensures efficient performance and quick response times.

Surface Mount:

YES - This product can be easily mounted on the surface of the circuit board, saving space and facilitating assembly.

Package Shape:

RECTANGULAR - The rectangular shape allows for easy integration and placement within circuit designs.

Nominal Supply Voltage / Vsup (V):

1.8 - With a low supply voltage, this product offers power efficiency and compatibility with low-power systems.

Power Supplies (V):

3.3 - This product operates efficiently with a 3.3V power supply, making it suitable for a range of applications.

No. of Terminals:

8 - The availability of 8 terminals allows for versatile connectivity, enhancing the product's compatibility with different circuit layouts.

Package Style (Meter):

SMALL OUTLINE, VERY THIN PROFILE, SHRINK PITCH - The compact and thin profile of this package makes it ideal for space-constrained designs, while the shrink pitch improves overall performance and reliability.

Maximum I (ol):

24 Amp - The high maximum output current ensures robust operation and the ability to drive larger loads.

Propagation Delay (tpd):

13 ns - This low propagation delay guarantees fast and precise signal processing, enabling real-time applications.

Maximum Operating Temperature:

85 °C - With a high maximum operating temperature, this product can withstand challenging thermal conditions, enhancing its reliability.

Trigger Type:

POSITIVE EDGE - The positive edge trigger enables synchronized operations and precise control in digital systems.

Minimum Operating Temperature:

40 °C - The low minimum operating temperature allows this product to function reliably even in cold environments.

Terminal Finish:

Tin/Lead (Sn80Pb20) - The tin/lead terminal finish ensures good solderability and compatibility with various assembly processes.

Terminal Position:

DUAL - The dual terminal position provides flexibility in circuit connection and supports different wiring configurations.

Maximum Seated Height:

0.9 mm - The low maximum seated height contributes to a compact and space-efficient design.

Width:

2 mm - The compact width of this product allows for efficient space utilization on the circuit board.

Output Polarity:

COMPLEMENTARY - The complementary output polarity enhances signal integrity and facilitates interfacing with other circuit components.

Minimum Supply Voltage (Vsup):

1.65 V - With a low minimum supply voltage, this product can be used in low-power applications while maintaining optimal performance.

Maximum Time At Peak Reflow Temperature (s):

30 - This product can withstand high reflow temperatures for extended periods, ensuring reliable solder joints during assembly.

Peak Reflow Temperature °C:

235 - The high peak reflow temperature contributes to a reliable and robust soldering process during assembly.

Length:

2.3 mm - The compact length of this product allows for efficient space utilization on the circuit board.

Temperature Grade:

INDUSTRIAL - The industrial temperature grade ensures reliable operation in a wide range of temperature conditions, making it suitable for industrial applications.

Maximum Frequency At Nominal Supply:

175000000 Hz - With a high maximum frequency, this product can handle high-speed applications and data processing.

Technology:

CMOS - The CMOS technology used in this product provides low power consumption, high noise immunity, and compatibility with a wide range of systems.

Terminal Form:

GULL WING - The gull wing terminal form facilitates surface mounting and ensures secure and reliable solder connections.

Terminal Pitch:

0.5 mm - The small terminal pitch allows for high-density wiring and supports compact circuit designs.

Minimum fmax:

250 MHz - This product offers a minimum maximum operating frequency of 250 MHz, making it suitable for high-performance applications.

Maximum Supply Voltage (Vsup):

5.5 V - With a high maximum supply voltage, this product can support a wide range of power input levels, increasing its versatility.

Technical Specifications

Latches & Flip-Flops NL17SZ74US attributes and parameters. Explore more Latches & Flip-Flops devices from Onsemi

Specs

Family:

17SZ

JESD-30 Code:

R-PDSO-G8

JESD-609 Code:

e0

Length:

2.3 mm

Logic IC Type:

Maximum Frequency At Nominal Supply:

175000000 Hz

Maximum I (ol):

24 Amp

Moisture Sensitivity Level (MSL):

1

No. of Bits:

1

No. of Functions:

1

No. of Terminals:

8

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

-40 Cel

Output Polarity:

COMPLEMENTARY

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Equivalence Code:

TSSOP8,.12,20

Package Shape:

Package Style (Meter):

SMALL OUTLINE, VERY THIN PROFILE, SHRINK PITCH

Peak Reflow Temperature (C):

235

Power Supplies (V):

3.3

Propagation Delay At Nominal Supply:

7.5 ns

Propagation Delay (tpd):

13 ns

Qualification:

Not Qualified

Maximum Seated Height:

.9 mm

Sub-Category:

FF/Latches

Maximum Supply Voltage (Vsup):

5.5 V

Minimum Supply Voltage (Vsup):

1.65 V

Nominal Supply Voltage / Vsup (V):

1.8

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Finish:

Tin/Lead (Sn80Pb20)

Terminal Form:

Terminal Pitch:

.5 mm

Terminal Position:

DUAL

Maximum Time At Peak Reflow Temperature (s):

30

Trigger Type:

POSITIVE EDGE

Width:

2 mm

Minimum fmax:

250 MHz

Trade Compliance

NL17SZ74US Logic ICs trade compliance attributes, and parameters.

HTS

8542.39.00.01

SB

8542.39.00.00

Manufacturer Highlights

Onsemi

Established in 1999, Onsemi is a leading global provider of power and image-sensing technologies. They are dedicated to building a better future for the automotive, industrial, cloud, medical, and IoT markets. Onsemi's core technologies include analog, digital, and mixed-signal products that offer innovative solutions for advanced automotive systems; highly reliable power management products for industrial applications; low-cost imaging solutions for medical equipment and consumer electronics; and robust communication architectures for the Internet of Things (IoT).

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Management team

President, CEO

Hassane El-Khoury

Executive VP, CFO, Treasurer

Thad Trent

Senior VP

Ross F. Jatou

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

Aizu Fab

Fabrication

Fab Initiation

1995

Japan

Aizu Wakamatsu

Wafer Capacity

52,000

1995

52,000

Si/EPI Fab

Fabrication

Fab Initiation

2018

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

10,000

2018

10,000

Expansion Phase 1 for SiC / EPI

Fabrication

Fab Initiation

2019

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

14,500

2019

14,500

Expansion Phase 2 for SiC / EPI

Fabrication

Fab Initiation

2024

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

2024

SiC Fab

Fabrication

Fab Initiation

2022

USA

Hudson

Wafer Capacity

2022

Bucheon

Fabrication

Fab Initiation

2013

South Korea

Bucheon

Wafer Capacity

61,000

2013

61,000

ISMF - Malaysia

Fabrication

Fab Initiation

1990

Malaysia

Seremban

Wafer Capacity

95,000

1990

95,000

Roznov Device Fab

Fabrication

Fab Initiation

1987

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

80,000

1987

80,000

Fab 10

Fabrication

Fab Initiation

2002

USA

East Fishkill

Wafer Capacity

15,000

2002

15,000

Burlington

Fabrication

Fab Initiation

1986

Canada

Burlington

Wafer Capacity

1986

Gresham

Fabrication

Fab Initiation

1998

USA

Gresham

Wafer Capacity

45,000

1998

45,000

Bucheon 150mm

Fabrication

Fab Initiation

2000

South Korea

Bucheon

Wafer Capacity

50,000

2000

50,000

Rochester

Fabrication

Fab Initiation

1983

USA

Rochester

Wafer Capacity

10,000

1983

10,000

Nampa

Fabrication

Fab Initiation

1995

USA

Nampa

Wafer Capacity

1995

Pennsylvania

Fabrication

Fab Initiation

1997

USA

Mountain Top

Wafer Capacity

36,000

1997

36,000

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