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NL17SZ175DBVT1G

Onsemi

NL17SZ175DBVT1G by Onsemi

D FLIP-FLOP; Temperature Grade: MILITARY; Terminal Form: GULL WING; No. of Terminals: 6; Package Code: TSOP; Package Shape: RECTANGULAR;

Median Price

$0.046

Lifecycle Status

Suppliers In-Stock

9

In-Stock Inventory

1k+

Distributors (Authorized)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Mouser Electronics

USA . 10,222 parts In-Stock

1+ parts

$0.110

100+ parts

$0.056

1k+ parts

$0.045

10k+ parts

$0.043

10,222

$0.110

$0.056

$0.045

$0.043

DigiKey

USA . 5,438 parts In-Stock

1+ parts

$0.110

100+ parts

$0.055

1k+ parts

$0.045

10k+ parts

$0.039

5,438

$0.110

$0.055

$0.045

$0.039

Rochester

USA . 114,000 parts In-Stock

1+ parts

-

100+ parts

$0.046

1k+ parts

$0.038

10k+ parts

$0.034

114,000

-

$0.046

$0.038

$0.034

Arrow

USA . 30,000 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

$0.033

30,000

-

-

-

$0.033

Verical

USA . 30,000 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

$0.033

30,000

-

-

-

$0.033

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Digiode

USA . 692 parts In-Stock

1+ parts

$0.036

100+ parts

-

1k+ parts

-

10k+ parts

-

692

$0.036

-

-

-

Vyrian

USA . 2,135 parts In-Stock

1+ parts

$0.038

100+ parts

-

1k+ parts

-

10k+ parts

-

2,135

$0.038

-

-

-

Flip Electronics

USA . 132,000 parts In-Stock

1+ parts

-

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132,000

-

-

-

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Sensible Micro Corp

USA . 885 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

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885

-

-

-

-

Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Corphita

USA . 856 parts In-Stock

1+ parts

$0.034

100+ parts

-

1k+ parts

-

10k+ parts

-

856

$0.034

-

-

-

Corohmni

South Africa . 416 parts In-Stock

1+ parts

$0.038

100+ parts

-

1k+ parts

-

10k+ parts

-

416

$0.038

-

-

-

Vigor

Singapore . 336 parts In-Stock

1+ parts

$0.050

100+ parts

-

1k+ parts

-

10k+ parts

-

336

$0.050

-

-

-

Authorized Procurement Solutions

USA . 10,000 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

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10,000

-

-

-

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Problanco Electronics

Mexico . 7,323 parts In-Stock

1+ parts

-

100+ parts

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1k+ parts

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7,323

-

-

-

-

TANS Electronics

Latvia . 5,499 parts In-Stock

1+ parts

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100+ parts

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5,499

-

-

-

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QUARKTWIN TECHNOLOGY LTD

USA . 3,457 parts In-Stock

1+ parts

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100+ parts

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3,457

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SupplyDigital Components

Austria . 2,877 parts In-Stock

1+ parts

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2,877

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Microchip USA

USA . 2,701 parts In-Stock

1+ parts

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2,701

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Kulean Microsystems

USA . 2,498 parts In-Stock

1+ parts

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2,498

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-

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iodParts Technologies Inc.

India . 900 parts In-Stock

1+ parts

-

100+ parts

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900

-

-

-

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UHIMA Technologies

Türkiye . 125 parts In-Stock

1+ parts

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100+ parts

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1k+ parts

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125

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-

-

Technical Specifications

Latches & Flip-Flops NL17SZ175DBVT1G attributes and parameters. Explore more Latches & Flip-Flops devices from Onsemi

Specs

Family:

LVC/LCX/Z

JESD-30 Code:

R-PDSO-G6

JESD-609 Code:

e3

Length:

3 mm

Load Capacitance (CL):

50 pF

Logic IC Type:

Maximum Frequency At Nominal Supply:

150000000 Hz

Maximum I (ol):

24 Amp

Moisture Sensitivity Level (MSL):

1

No. of Bits:

1

No. of Functions:

1

No. of Terminals:

6

Maximum Operating Temperature:

125 Cel

Minimum Operating Temperature:

-55 Cel

Output Polarity:

TRUE

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Equivalence Code:

TSOP6,.11,37

Package Shape:

Package Style (Meter):

SMALL OUTLINE, THIN PROFILE

Packing Method:

TR

Peak Reflow Temperature (C):

260

Maximum Power Supply Current (ICC):

.01 mA

Propagation Delay At Nominal Supply:

6.2 ns

Propagation Delay (tpd):

16.5 ns

Maximum Seated Height:

1.1 mm

Maximum Supply Voltage (Vsup):

5.5 V

Minimum Supply Voltage (Vsup):

1.65 V

Nominal Supply Voltage / Vsup (V):

3.3

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Finish:

MATTE TIN

Terminal Form:

Terminal Pitch:

.95 mm

Terminal Position:

DUAL

Maximum Time At Peak Reflow Temperature (s):

30

Trigger Type:

POSITIVE EDGE

Width:

1.5 mm

Minimum fmax:

175 MHz

Trade Compliance

NL17SZ175DBVT1G Logic ICs trade compliance attributes, and parameters.

HTS

8542.39.00.01

SB

8542.39.00.00

PCN

Manufacturer Highlights

Onsemi

Established in 1999, Onsemi is a leading global provider of power and image-sensing technologies. They are dedicated to building a better future for the automotive, industrial, cloud, medical, and IoT markets. Onsemi's core technologies include analog, digital, and mixed-signal products that offer innovative solutions for advanced automotive systems; highly reliable power management products for industrial applications; low-cost imaging solutions for medical equipment and consumer electronics; and robust communication architectures for the Internet of Things (IoT).

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Management team

President, CEO

Hassane El-Khoury

Executive VP, CFO, Treasurer

Thad Trent

Senior VP

Ross F. Jatou

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

Aizu Fab

Fabrication

Fab Initiation

1995

Japan

Aizu Wakamatsu

Wafer Capacity

52,000

1995

52,000

Si/EPI Fab

Fabrication

Fab Initiation

2018

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

10,000

2018

10,000

Expansion Phase 1 for SiC / EPI

Fabrication

Fab Initiation

2019

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

14,500

2019

14,500

Expansion Phase 2 for SiC / EPI

Fabrication

Fab Initiation

2024

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

2024

SiC Fab

Fabrication

Fab Initiation

2022

USA

Hudson

Wafer Capacity

2022

Bucheon

Fabrication

Fab Initiation

2013

South Korea

Bucheon

Wafer Capacity

61,000

2013

61,000

ISMF - Malaysia

Fabrication

Fab Initiation

1990

Malaysia

Seremban

Wafer Capacity

95,000

1990

95,000

Roznov Device Fab

Fabrication

Fab Initiation

1987

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

80,000

1987

80,000

Fab 10

Fabrication

Fab Initiation

2002

USA

East Fishkill

Wafer Capacity

15,000

2002

15,000

Burlington

Fabrication

Fab Initiation

1986

Canada

Burlington

Wafer Capacity

1986

Gresham

Fabrication

Fab Initiation

1998

USA

Gresham

Wafer Capacity

45,000

1998

45,000

Bucheon 150mm

Fabrication

Fab Initiation

2000

South Korea

Bucheon

Wafer Capacity

50,000

2000

50,000

Rochester

Fabrication

Fab Initiation

1983

USA

Rochester

Wafer Capacity

10,000

1983

10,000

Nampa

Fabrication

Fab Initiation

1995

USA

Nampa

Wafer Capacity

1995

Pennsylvania

Fabrication

Fab Initiation

1997

USA

Mountain Top

Wafer Capacity

36,000

1997

36,000

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