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NL17SZ74

Onsemi

NL17SZ74 by Onsemi

NL17SZ74 by Onsemi is a CMOS latch with 7.5ns propagation delay, 3.3V supply voltage, and 50pF load capacitance. Ideal for military applications due to its -55 to 125 °C operating temperature range and positive edge trigger type. Surface mountable with 8 terminals, it operates at a max frequency of 250MHz.

Median Price

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Lifecycle Status

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2

In-Stock Inventory

1k+

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Digiode

USA . 2,223 parts In-Stock

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Vyrian

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SupplyDigital Components

Austria . 7,587 parts In-Stock

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Kulean Microsystems

USA . 7,130 parts In-Stock

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TANS Electronics

Latvia . 1,254 parts In-Stock

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Corphita

USA . 651 parts In-Stock

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UHIMA Technologies

Türkiye . 509 parts In-Stock

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Corohmni

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Problanco Electronics

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Overview

Experience high-quality performance and reliability with the NL17SZ74 by Onsemi. As a leading manufacturer in the industry, Onsemi delivers top-notch latches & flip-flops that cater to a wide range of applications. With a fast propagation delay, surface mount capability, and a wide temperature range, this product offers exceptional value to customers seeking efficient and versatile solutions for their projects. Trust Onsemi to provide you with innovative technology that meets your needs effectively and effortlessly.

Feature Benefit Bullets

Propagation Delay At Nominal Supply: 7.5 ns

Low propagation delay ensures quick response time, making this product suitable for applications where fast switching is required.

Surface Mount: YES

Surface mount capability allows for easy and efficient installation on PCBs, saving space and simplifying assembly processes.

Nominal Supply Voltage / Vsup (V): 3.3

Operates efficiently at a standard voltage level of 3.3V, making it compatible with a wide range of systems and devices.

Load Capacitance (CL): 50 pF

Designed to handle a load capacitance of 50 pF, ensuring stable and reliable performance even under varying load conditions.

No. of Terminals: 8

Provides sufficient connectivity options for interfacing with external components and peripherals in complex circuit designs.

Maximum I (ol): 24 Amp

High output current rating of 24 Amp allows for driving of heavy loads without the need for additional amplification circuitry.

Propagation Delay (tpd): 14.5 ns

Acceptable propagation delay of 14.5 ns ensures reliable performance in applications with moderate speed requirements.

Maximum Operating Temperature: 125 °C

Wide operating temperature range of -55 to 125 °C makes this latch suitable for use in harsh environmental conditions.

Trigger Type: POSITIVE EDGE

Positive edge trigger type ensures precise control over the output signal, making it ideal for applications requiring specific timing requirements.

Output Polarity: COMPLEMENTARY

Complementary output polarity simplifies interface with other digital circuits, offering flexibility and compatibility in system integration.

Minimum Supply Voltage (Vsup): 1.65 V

Low minimum supply voltage requirement of 1.65V allows for operation in low-power applications or mobile devices with limited power sources.

Maximum Frequency At Nominal Supply: 175,000,000 Hz

High maximum operating frequency of 175 MHz ensures high-speed performance, suitable for applications requiring rapid signal processing.

Technology: CMOS

CMOS technology offers low power consumption and high noise immunity, making this latch energy-efficient and reliable in noisy environments.

Packing Method: TR

TR (Tape and Reel) packing method provides convenience in handling and storage, making it ideal for automated assembly processes.

Maximum Supply Voltage (Vsup): 5.5 V

Wide supply voltage range of 1.65V to 5.5V offers flexibility in power supply options, accommodating different system requirements.

Maximum Power Supply Current (ICC): 0.01 mA

Low power supply current consumption of 0.01 mA ensures energy efficiency, making this latch suitable for battery-powered applications.

Technical Specifications

Latches & Flip-Flops NL17SZ74 attributes and parameters. Explore more Latches & Flip-Flops devices from Onsemi

Specs

Family:

LVC/LCX/Z

Load Capacitance (CL):

50 pF

Logic IC Type:

Maximum Frequency At Nominal Supply:

175000000 Hz

Maximum I (ol):

24 Amp

Moisture Sensitivity Level (MSL):

1

No. of Bits:

1

No. of Functions:

1

No. of Terminals:

8

Maximum Operating Temperature:

125 Cel

Minimum Operating Temperature:

-55 Cel

Output Polarity:

COMPLEMENTARY

Packing Method:

TR

Maximum Power Supply Current (ICC):

.01 mA

Propagation Delay At Nominal Supply:

7.5 ns

Propagation Delay (tpd):

14.5 ns

Maximum Supply Voltage (Vsup):

5.5 V

Minimum Supply Voltage (Vsup):

1.65 V

Nominal Supply Voltage / Vsup (V):

3.3

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Trigger Type:

POSITIVE EDGE

Minimum fmax:

250 MHz

Trade Compliance

NL17SZ74 Logic ICs trade compliance attributes, and parameters.

HTS

8542.39.00.01

SB

8542.39.00.00

Manufacturer Highlights

Onsemi

Established in 1999, Onsemi is a leading global provider of power and image-sensing technologies. They are dedicated to building a better future for the automotive, industrial, cloud, medical, and IoT markets. Onsemi's core technologies include analog, digital, and mixed-signal products that offer innovative solutions for advanced automotive systems; highly reliable power management products for industrial applications; low-cost imaging solutions for medical equipment and consumer electronics; and robust communication architectures for the Internet of Things (IoT).

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Management team

President, CEO

Hassane El-Khoury

Executive VP, CFO, Treasurer

Thad Trent

Senior VP

Ross F. Jatou

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

Aizu Fab

Fabrication

Fab Initiation

1995

Japan

Aizu Wakamatsu

Wafer Capacity

52,000

1995

52,000

Si/EPI Fab

Fabrication

Fab Initiation

2018

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

10,000

2018

10,000

Expansion Phase 1 for SiC / EPI

Fabrication

Fab Initiation

2019

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

14,500

2019

14,500

Expansion Phase 2 for SiC / EPI

Fabrication

Fab Initiation

2024

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

2024

SiC Fab

Fabrication

Fab Initiation

2022

USA

Hudson

Wafer Capacity

2022

Bucheon

Fabrication

Fab Initiation

2013

South Korea

Bucheon

Wafer Capacity

61,000

2013

61,000

ISMF - Malaysia

Fabrication

Fab Initiation

1990

Malaysia

Seremban

Wafer Capacity

95,000

1990

95,000

Roznov Device Fab

Fabrication

Fab Initiation

1987

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

80,000

1987

80,000

Fab 10

Fabrication

Fab Initiation

2002

USA

East Fishkill

Wafer Capacity

15,000

2002

15,000

Burlington

Fabrication

Fab Initiation

1986

Canada

Burlington

Wafer Capacity

1986

Gresham

Fabrication

Fab Initiation

1998

USA

Gresham

Wafer Capacity

45,000

1998

45,000

Bucheon 150mm

Fabrication

Fab Initiation

2000

South Korea

Bucheon

Wafer Capacity

50,000

2000

50,000

Rochester

Fabrication

Fab Initiation

1983

USA

Rochester

Wafer Capacity

10,000

1983

10,000

Nampa

Fabrication

Fab Initiation

1995

USA

Nampa

Wafer Capacity

1995

Pennsylvania

Fabrication

Fab Initiation

1997

USA

Mountain Top

Wafer Capacity

36,000

1997

36,000

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