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NL17SZ74USG-L22190

Onsemi

NL17SZ74USG-L22190 by Onsemi

NL17SZ74USG-L22190 by Onsemi is a 3-STATE latch with 8ns propagation delay and 32A max I (ol). It operates at -55 to 125 °C, with a supply voltage range of 1.65V to 5.5V. Ideal for applications requiring fast response time and low power consumption in compact designs.

Median Price

$0.118

Lifecycle Status

Suppliers In-Stock

6

In-Stock Inventory

1k+

Distributors (Authorized)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Rochester

USA . 3,000 parts In-Stock

1+ parts

-

100+ parts

$0.123

1k+ parts

$0.102

10k+ parts

$0.091

3,000

-

$0.123

$0.102

$0.091

Verical

USA . 3,000 parts In-Stock

1+ parts

-

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$0.114

3,000

-

-

-

$0.114

Distributors (In-Stock)

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Nova Conductors

Japan . 10 parts In-Stock

1+ parts

$0.140

100+ parts

-

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10

$0.140

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Flip Electronics

USA . 30,000 parts In-Stock

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Vyrian

USA . 7,341 parts In-Stock

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7,341

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Digiode

USA . 2,496 parts In-Stock

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2,496

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Distributors (Availability)

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Argo Parts USA

USA . 4,295 parts In-Stock

1+ parts

$0.132

100+ parts

-

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-

10k+ parts

$0.128

4,295

$0.132

-

-

$0.128

Continental Prestige Electronics

USA . 1,998 parts In-Stock

1+ parts

$0.132

100+ parts

-

1k+ parts

-

10k+ parts

$0.129

1,998

$0.132

-

-

$0.129

Corohmni

South Africa . 337 parts In-Stock

1+ parts

$0.137

100+ parts

-

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337

$0.137

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Netroflash

USA . 2,000 parts In-Stock

1+ parts

$0.140

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$0.140

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Microchip USA

USA . 4,401 parts In-Stock

1+ parts

$2.925

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4,401

$2.925

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AZTECH Wire

Italy . 878 parts In-Stock

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$12.545

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878

$12.545

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Aztec Data Supply Inc.

USA . 3,665 parts In-Stock

1+ parts

$12.870

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3,665

$12.870

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Ampacity Inc.

Singapore . 1,421 parts In-Stock

1+ parts

$15.000

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$15.000

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Advanced Electronics

New Zealand . 58 parts In-Stock

1+ parts

$26.410

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$25.090

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$25.090

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58

$26.410

$25.090

$25.090

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Semicontronic

India . 547 parts In-Stock

1+ parts

$38.000

100+ parts

$37.050

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$36.860

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547

$38.000

$37.050

$36.860

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iodParts Technologies Inc.

India . 24,000 parts In-Stock

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Problanco Electronics

Mexico . 6,265 parts In-Stock

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SupplyDigital Components

Austria . 5,620 parts In-Stock

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Kulean Microsystems

USA . 4,904 parts In-Stock

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TANS Electronics

Latvia . 2,462 parts In-Stock

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UHIMA Technologies

Türkiye . 985 parts In-Stock

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Robosynatics

Brazil . 950 parts In-Stock

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Lucentia Tech

USA . 950 parts In-Stock

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Corphita

USA . 502 parts In-Stock

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Overview

Experience seamless performance and reliability with the NL17SZ74USG-L22190 by Onsemi. As a leading manufacturer in the industry, Onsemi delivers top-quality latches & flip-flops that are perfect for a wide range of applications. With a fast propagation delay of 8 ns and a low nominal supply voltage of 2.3V, this product offers unparalleled efficiency and precision. Whether you're working on consumer electronics or industrial automation, this versatile component ensures smooth operation and robust output characteristics. Upgrade your projects today and unlock the full potential of your designs with the NL17SZ74USG-L22190.

Feature Benefit Bullets

Propagation Delay At Nominal Supply: 8 ns

Low propagation delay ensures fast response time in the latch or flip-flop, making it suitable for high-speed applications.

Surface Mount: YES

Surface mount technology allows for easy installation on PCBs, saving space and reducing assembly time.

Package Shape: RECTANGULAR

Rectangular package shape is industry-standard and easy to handle during assembly.

Nominal Supply Voltage: 2.3 V

Operates at a low voltage, making it energy-efficient and suitable for battery-powered devices.

Load Capacitance: 50 pF

Low load capacitance ensures minimal power consumption and fast switching times.

No. of Terminals: 8

Sufficient number of terminals for connecting to external circuits and components.

Package Style: SMALL OUTLINE, VERY THIN PROFILE, SHRINK PITCH

Compact package style saves space on the PCB and allows for high-density mounting.

Maximum I (ol): 32 Amp

High output current capability for driving heavier loads.

Maximum Operating Temperature: 125 °C

Wide operating temperature range for reliable performance in varying environmental conditions.

Output Characteristics: 3-STATE

3-state output allows for high impedance state, expanding the flexibility of the device in bus systems.

Trigger Type: POSITIVE EDGE

Positive edge trigger ensures stable and synchronized operation in digital systems.

Minimum Operating Temperature: -55 °C

Extreme low temperature tolerance for operation in harsh environments.

Terminal Finish: MATTE TIN

Matte tin finish provides good solderability and corrosion resistance.

Minimum Supply Voltage: 1.65 V

Low minimum supply voltage requirement allows operation in low-power applications.

Technology: CMOS

CMOS technology offers low power consumption and high noise immunity for reliable digital circuits.

Maximum Supply Voltage: 5.5 V

Wide supply voltage range for compatibility with various system designs.

Technical Specifications

Latches & Flip-Flops NL17SZ74USG-L22190 attributes and parameters. Explore more Latches & Flip-Flops devices from Onsemi

Specs

Family:

LVC/LCX/Z

JESD-30 Code:

R-XDSO-G8

JESD-609 Code:

e3

Length:

2.3 mm

Load Capacitance (CL):

50 pF

Logic IC Type:

Maximum I (ol):

32 Amp

Moisture Sensitivity Level (MSL):

1

No. of Bits:

1

No. of Functions:

1

No. of Terminals:

8

Maximum Operating Temperature:

125 Cel

Minimum Operating Temperature:

-55 Cel

Output Characteristics:

3-STATE

Output Polarity:

COMPLEMENTARY

Package Body Material:

UNSPECIFIED

Package Code:

Package Equivalence Code:

TSSOP8,.12,20

Package Shape:

Package Style (Meter):

SMALL OUTLINE, VERY THIN PROFILE, SHRINK PITCH

Packing Method:

TR

Peak Reflow Temperature (C):

260

Maximum Power Supply Current (ICC):

100 mA

Propagation Delay At Nominal Supply:

8 ns

Propagation Delay (tpd):

13 ns

Maximum Seated Height:

.9 mm

Maximum Supply Voltage (Vsup):

5.5 V

Minimum Supply Voltage (Vsup):

1.65 V

Nominal Supply Voltage / Vsup (V):

2.3

Surface Mount:

YES

Technology:

CMOS

Terminal Finish:

MATTE TIN

Terminal Form:

Terminal Pitch:

.5 mm

Terminal Position:

DUAL

Maximum Time At Peak Reflow Temperature (s):

30

Trigger Type:

POSITIVE EDGE

Width:

2 mm

Minimum fmax:

250 MHz

Trade Compliance

NL17SZ74USG-L22190 Logic ICs trade compliance attributes, and parameters.

HTS

8542.39.00.01

SB

8542.39.00.00

PCN

Manufacturer Highlights

Onsemi

Established in 1999, Onsemi is a leading global provider of power and image-sensing technologies. They are dedicated to building a better future for the automotive, industrial, cloud, medical, and IoT markets. Onsemi's core technologies include analog, digital, and mixed-signal products that offer innovative solutions for advanced automotive systems; highly reliable power management products for industrial applications; low-cost imaging solutions for medical equipment and consumer electronics; and robust communication architectures for the Internet of Things (IoT).

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Management team

President, CEO

Hassane El-Khoury

Executive VP, CFO, Treasurer

Thad Trent

Senior VP

Ross F. Jatou

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

Aizu Fab

Fabrication

Fab Initiation

1995

Japan

Aizu Wakamatsu

Wafer Capacity

52,000

1995

52,000

Si/EPI Fab

Fabrication

Fab Initiation

2018

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

10,000

2018

10,000

Expansion Phase 1 for SiC / EPI

Fabrication

Fab Initiation

2019

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

14,500

2019

14,500

Expansion Phase 2 for SiC / EPI

Fabrication

Fab Initiation

2024

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

2024

SiC Fab

Fabrication

Fab Initiation

2022

USA

Hudson

Wafer Capacity

2022

Bucheon

Fabrication

Fab Initiation

2013

South Korea

Bucheon

Wafer Capacity

61,000

2013

61,000

ISMF - Malaysia

Fabrication

Fab Initiation

1990

Malaysia

Seremban

Wafer Capacity

95,000

1990

95,000

Roznov Device Fab

Fabrication

Fab Initiation

1987

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

80,000

1987

80,000

Fab 10

Fabrication

Fab Initiation

2002

USA

East Fishkill

Wafer Capacity

15,000

2002

15,000

Burlington

Fabrication

Fab Initiation

1986

Canada

Burlington

Wafer Capacity

1986

Gresham

Fabrication

Fab Initiation

1998

USA

Gresham

Wafer Capacity

45,000

1998

45,000

Bucheon 150mm

Fabrication

Fab Initiation

2000

South Korea

Bucheon

Wafer Capacity

50,000

2000

50,000

Rochester

Fabrication

Fab Initiation

1983

USA

Rochester

Wafer Capacity

10,000

1983

10,000

Nampa

Fabrication

Fab Initiation

1995

USA

Nampa

Wafer Capacity

1995

Pennsylvania

Fabrication

Fab Initiation

1997

USA

Mountain Top

Wafer Capacity

36,000

1997

36,000

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