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NL17SZ74MQ1TCG

Onsemi

NL17SZ74MQ1TCG by Onsemi

NL17SZ74MQ1TCG by Onsemi is a CMOS latches & flip-flops chip with 8ns propagation delay, 2.3V nominal voltage, and 50pF load capacitance. Ideal for military-grade applications requiring positive edge trigger type and 250MHz min fmax in a compact square package.

Median Price

$0.252

Lifecycle Status

Suppliers In-Stock

5

In-Stock Inventory

1k+

Distributors (Authorized)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Mouser Electronics

USA . 4,237 parts In-Stock

1+ parts

$0.450

100+ parts

$0.169

1k+ parts

$0.109

10k+ parts

$0.072

4,237

$0.450

$0.169

$0.109

$0.072

Avnet

USA . 2,980 parts In-Stock

1+ parts

-

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$0.055

2,980

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$0.055

Distributors (In-Stock)

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Flip Electronics

USA . 63,000 parts In-Stock

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Vyrian

USA . 7,969 parts In-Stock

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7,969

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Digiode

USA . 1,680 parts In-Stock

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1,680

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Distributors (Availability)

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AZTECH Wire

Italy . 635 parts In-Stock

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$15.020

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635

$15.020

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Ampacity Inc.

Singapore . 140 parts In-Stock

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$21.000

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140

$21.000

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QUARKTWIN TECHNOLOGY LTD

USA . 19,154 parts In-Stock

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SupplyDigital Components

Austria . 8,115 parts In-Stock

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Kulean Microsystems

USA . 6,330 parts In-Stock

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Problanco Electronics

Mexico . 3,910 parts In-Stock

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TANS Electronics

Latvia . 3,815 parts In-Stock

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UHIMA Technologies

Türkiye . 296 parts In-Stock

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Corphita

USA . 286 parts In-Stock

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Microchip USA

USA . 250 parts In-Stock

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Corohmni

South Africa . 152 parts In-Stock

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Overview

Elevate your electronic designs with the NL17SZ74MQ1TCG by Onsemi. Crafted with precision and reliability in mind, this latches & flip-flops component offers a seamless transition between logic states, ensuring optimal performance in a variety of applications. With a lightning-fast propagation delay and versatile 3-state output characteristics, this chip carrier boasts maximum quality in a compact package. Trust Onsemi's cutting-edge technology to deliver unparalleled results, making the NL17SZ74MQ1TCG the go-to choice for your next project. Upgrade your circuits today and experience the difference firsthand.

Feature Benefit Bullets

Propagation Delay At Nominal Supply: 8 ns

Low propagation delay ensures quick response time and efficient operation.

Surface Mount: YES

Easy mounting on PCB boards for simplified integration.

Package Shape: SQUARE

Compact and space-saving design for efficient use of PCB space.

Nominal Supply Voltage / Vsup (V): 2.3

Optimal supply voltage for stable and reliable operation.

Load Capacitance (CL): 50 pF

Suitable for handling moderate load capacitance for various applications.

Output Characteristics: 3-STATE

3-state outputs provide flexibility in controlling the output signal.

Technology: CMOS

CMOS technology ensures low power consumption and high noise immunity.

Maximum Operating Temperature: 125 °C

Wide operating temperature range for versatile use in different environments.

Technical Specifications

Latches & Flip-Flops NL17SZ74MQ1TCG attributes and parameters. Explore more Latches & Flip-Flops devices from Onsemi

Specs

Family:

LVC/LCX/Z

JESD-30 Code:

S-XQCC-N8

Length:

1.6 mm

Load Capacitance (CL):

50 pF

Logic IC Type:

Maximum I (ol):

32 Amp

Moisture Sensitivity Level (MSL):

1

No. of Bits:

1

No. of Functions:

1

No. of Terminals:

8

Maximum Operating Temperature:

125 Cel

Minimum Operating Temperature:

-55 Cel

Output Characteristics:

3-STATE

Output Polarity:

COMPLEMENTARY

Package Body Material:

UNSPECIFIED

Package Code:

Package Equivalence Code:

LCC8,.06SQ,20

Package Shape:

Package Style (Meter):

CHIP CARRIER, VERY THIN PROFILE

Packing Method:

TR

Maximum Power Supply Current (ICC):

100 mA

Propagation Delay At Nominal Supply:

8 ns

Propagation Delay (tpd):

13 ns

Maximum Seated Height:

.6 mm

Maximum Supply Voltage (Vsup):

5.5 V

Minimum Supply Voltage (Vsup):

1.65 V

Nominal Supply Voltage / Vsup (V):

2.3

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Form:

Terminal Pitch:

.5 mm

Terminal Position:

QUAD

Trigger Type:

POSITIVE EDGE

Width:

1.6 mm

Minimum fmax:

250 MHz

Trade Compliance

NL17SZ74MQ1TCG Logic ICs trade compliance attributes, and parameters.

HTS

8542.39.00.01

SB

8542.39.00.00

PCN

Manufacturer Highlights

Onsemi

Established in 1999, Onsemi is a leading global provider of power and image-sensing technologies. They are dedicated to building a better future for the automotive, industrial, cloud, medical, and IoT markets. Onsemi's core technologies include analog, digital, and mixed-signal products that offer innovative solutions for advanced automotive systems; highly reliable power management products for industrial applications; low-cost imaging solutions for medical equipment and consumer electronics; and robust communication architectures for the Internet of Things (IoT).

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Management team

President, CEO

Hassane El-Khoury

Executive VP, CFO, Treasurer

Thad Trent

Senior VP

Ross F. Jatou

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

Aizu Fab

Fabrication

Fab Initiation

1995

Japan

Aizu Wakamatsu

Wafer Capacity

52,000

1995

52,000

Si/EPI Fab

Fabrication

Fab Initiation

2018

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

10,000

2018

10,000

Expansion Phase 1 for SiC / EPI

Fabrication

Fab Initiation

2019

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

14,500

2019

14,500

Expansion Phase 2 for SiC / EPI

Fabrication

Fab Initiation

2024

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

2024

SiC Fab

Fabrication

Fab Initiation

2022

USA

Hudson

Wafer Capacity

2022

Bucheon

Fabrication

Fab Initiation

2013

South Korea

Bucheon

Wafer Capacity

61,000

2013

61,000

ISMF - Malaysia

Fabrication

Fab Initiation

1990

Malaysia

Seremban

Wafer Capacity

95,000

1990

95,000

Roznov Device Fab

Fabrication

Fab Initiation

1987

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

80,000

1987

80,000

Fab 10

Fabrication

Fab Initiation

2002

USA

East Fishkill

Wafer Capacity

15,000

2002

15,000

Burlington

Fabrication

Fab Initiation

1986

Canada

Burlington

Wafer Capacity

1986

Gresham

Fabrication

Fab Initiation

1998

USA

Gresham

Wafer Capacity

45,000

1998

45,000

Bucheon 150mm

Fabrication

Fab Initiation

2000

South Korea

Bucheon

Wafer Capacity

50,000

2000

50,000

Rochester

Fabrication

Fab Initiation

1983

USA

Rochester

Wafer Capacity

10,000

1983

10,000

Nampa

Fabrication

Fab Initiation

1995

USA

Nampa

Wafer Capacity

1995

Pennsylvania

Fabrication

Fab Initiation

1997

USA

Mountain Top

Wafer Capacity

36,000

1997

36,000

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