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74LCX74MX

Onsemi

74LCX74MX by Onsemi

74LCX74MX by Onsemi is a dual-function latch with 7ns propagation delay, ideal for industrial applications. Operating at 2.5V to 3.6V, it offers a max frequency of 150MHz and features positive edge triggering. With a compact design and surface-mount capability, this CMOS technology device is suitable for high-speed digital systems.

Median Price

$0.280

Lifecycle Status

Suppliers In-Stock

38

In-Stock Inventory

1k+

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Rochester

USA . 61,162 parts In-Stock

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$0.280

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DigiKey

USA . 61,162 parts In-Stock

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Verical

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Flip Electronics (Authorized)

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Digiode

USA . 1,515 parts In-Stock

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Bristol Electronics

USA . 28,044 parts In-Stock

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DigiKey Marketplace

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Dan-Mar Components

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Vyrian

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Sea View Technologies

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PC Components Company LLC

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Cyclops Electronics Ltd

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Semi Source

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Prism Electronics

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Diverse Electronics

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Flip Electronics

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Classic Components Corporation

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Sensible Micro Corp

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ACDS - Activité Composants Distribution Service

France . 329 parts In-Stock

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LWI Electronics Inc

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Semicontronic

India . 45,353 parts In-Stock

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$0.206

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Ampacity Inc.

Singapore . 45,335 parts In-Stock

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Corphita

USA . 1,762 parts In-Stock

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Corohmni

South Africa . 80 parts In-Stock

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Aztec Data Supply Inc.

USA . 425 parts In-Stock

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$8.225

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Perfect Parts

USA . 16,616 parts In-Stock

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Lixinc

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A-Z Elektronik GmbH

Germany . 7,194 parts In-Stock

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TANS Electronics

Latvia . 6,696 parts In-Stock

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SupplyDigital Components

Austria . 5,516 parts In-Stock

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Authorized Procurement Solutions

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Problanco Electronics

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Argo Parts USA

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Continental Prestige Electronics

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Supply Digital

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iodParts Technologies Inc.

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GreenTree Electronics

Israel . 1,184 parts In-Stock

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Computer Components Inc. - USA

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Bastille Electronics

Australia . 500 parts In-Stock

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Microchip USA

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Kulean Microsystems

USA . 124 parts In-Stock

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UHIMA Technologies

Türkiye . 113 parts In-Stock

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Overview

Unlock the potential of your projects with the 74LCX74MX by Onsemi. This high-quality latch/flip-flop offers fast propagation delay and precise functionality, making it a top choice for industrial applications. With Onsemi's reputation for excellence in manufacturing, you can trust that this product will deliver reliable performance. Whether you're designing cutting-edge technology or enhancing existing systems, the 74LCX74MX provides value, efficiency, and peace of mind. Elevate your work with this versatile component from a trusted industry leader.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

Provides durability and protection to the internal components, ensuring a longer lifespan for the product.

Propagation Delay At Nominal Supply: 7 ns

Low propagation delay allows for fast response times, making this product suitable for applications requiring quick switching.

Surface Mount: YES

Easily mountable on PCBs, simplifying the manufacturing process and saving space in the final product design.

Nominal Supply Voltage / Vsup (V): 2.5

Optimal supply voltage for efficient performance, ensuring the product operates within safe voltage limits.

Maximum Operating Temperature: 85 °C

Can withstand higher temperatures, making it suitable for industrial applications where heat resistance is crucial.

Trigger Type: POSITIVE EDGE

Positive-edge triggering ensures reliable operation in applications where precise timing is required.

Maximum Frequency At Nominal Supply: 150000000 Hz

High maximum frequency allows for high-speed operation, making this product ideal for applications demanding quick signal processing.

Technology: CMOS

CMOS technology offers low power consumption, making the product energy-efficient and suitable for battery-powered devices.

Technical Specifications

Latches & Flip-Flops 74LCX74MX attributes and parameters. Explore more Latches & Flip-Flops devices from Onsemi

Specs

Family:

LVC/LCX/Z

JESD-30 Code:

R-PDSO-G14

JESD-609 Code:

e4

Length:

8.625 mm

Load Capacitance (CL):

50 pF

Logic IC Type:

Maximum Frequency At Nominal Supply:

150000000 Hz

Maximum I (ol):

24 Amp

Moisture Sensitivity Level (MSL):

1

No. of Bits:

1

No. of Functions:

2

No. of Terminals:

14

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

-40 Cel

Output Polarity:

COMPLEMENTARY

Package Body Material:

PLASTIC/EPOXY

Package Code:

SOP

Package Equivalence Code:

SOP14,.25

Package Shape:

Package Style (Meter):

SMALL OUTLINE

Packing Method:

TR

Peak Reflow Temperature (C):

260

Power Supplies (V):

3.3

Propagation Delay At Nominal Supply:

7 ns

Propagation Delay (tpd):

8.4 ns

Qualification:

Not Qualified

Maximum Seated Height:

1.75 mm

Sub-Category:

FF/Latches

Maximum Supply Voltage (Vsup):

3.6 V

Minimum Supply Voltage (Vsup):

2 V

Nominal Supply Voltage / Vsup (V):

2.5

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Finish:

NICKEL PALLADIUM GOLD

Terminal Form:

Terminal Pitch:

1.27 mm

Terminal Position:

DUAL

Maximum Time At Peak Reflow Temperature (s):

30

Trigger Type:

POSITIVE EDGE

Width:

3.9 mm

Minimum fmax:

150 MHz

Trade Compliance

74LCX74MX Logic ICs trade compliance attributes, and parameters.

HTS

8542.39.00.01

SB

8542.39.00.00

Manufacturer Highlights

Onsemi

Established in 1999, Onsemi is a leading global provider of power and image-sensing technologies. They are dedicated to building a better future for the automotive, industrial, cloud, medical, and IoT markets. Onsemi's core technologies include analog, digital, and mixed-signal products that offer innovative solutions for advanced automotive systems; highly reliable power management products for industrial applications; low-cost imaging solutions for medical equipment and consumer electronics; and robust communication architectures for the Internet of Things (IoT).

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Management team

President, CEO

Hassane El-Khoury

Executive VP, CFO, Treasurer

Thad Trent

Senior VP

Ross F. Jatou

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

Aizu Fab

Fabrication

Fab Initiation

1995

Japan

Aizu Wakamatsu

Wafer Capacity

52,000

1995

52,000

Si/EPI Fab

Fabrication

Fab Initiation

2018

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

10,000

2018

10,000

Expansion Phase 1 for SiC / EPI

Fabrication

Fab Initiation

2019

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

14,500

2019

14,500

Expansion Phase 2 for SiC / EPI

Fabrication

Fab Initiation

2024

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

2024

SiC Fab

Fabrication

Fab Initiation

2022

USA

Hudson

Wafer Capacity

2022

Bucheon

Fabrication

Fab Initiation

2013

South Korea

Bucheon

Wafer Capacity

61,000

2013

61,000

ISMF - Malaysia

Fabrication

Fab Initiation

1990

Malaysia

Seremban

Wafer Capacity

95,000

1990

95,000

Roznov Device Fab

Fabrication

Fab Initiation

1987

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

80,000

1987

80,000

Fab 10

Fabrication

Fab Initiation

2002

USA

East Fishkill

Wafer Capacity

15,000

2002

15,000

Burlington

Fabrication

Fab Initiation

1986

Canada

Burlington

Wafer Capacity

1986

Gresham

Fabrication

Fab Initiation

1998

USA

Gresham

Wafer Capacity

45,000

1998

45,000

Bucheon 150mm

Fabrication

Fab Initiation

2000

South Korea

Bucheon

Wafer Capacity

50,000

2000

50,000

Rochester

Fabrication

Fab Initiation

1983

USA

Rochester

Wafer Capacity

10,000

1983

10,000

Nampa

Fabrication

Fab Initiation

1995

USA

Nampa

Wafer Capacity

1995

Pennsylvania

Fabrication

Fab Initiation

1997

USA

Mountain Top

Wafer Capacity

36,000

1997

36,000

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