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74LCX74MTC

Onsemi

74LCX74MTC by Onsemi

74LCX74MTC by Onsemi is a dual-function latches & flip-flops IC with 7ns propagation delay at 2.5V. It operates at a max frequency of 150MHz, suitable for industrial applications requiring positive edge triggering and complementary output polarity. This CMOS technology device comes in a small outline package with surface mount capability.

Median Price

$0.255

Lifecycle Status

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37

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1k+

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Arrow

USA . 1,610 parts In-Stock

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DigiKey

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Verical

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Chip1Stop

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Digiode

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Component Electronics Inc.

Canada . 137 parts In-Stock

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DigiKey Marketplace

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Flip Electronics

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Semi Source

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Speed Components Ltd

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J & M Industries LLC

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PC Components Company LLC

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LIBRA Elektronik GmbH

Germany . 132 parts In-Stock

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Ampacity Inc.

Singapore . 15,927 parts In-Stock

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Semicontronic

India . 15,784 parts In-Stock

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Corohmni

South Africa . 84 parts In-Stock

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Corphita

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Component Stockers USA

USA . 1,203 parts In-Stock

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Aztec Data Supply Inc.

USA . 5,486 parts In-Stock

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Continental Prestige Electronics

USA . 25,510 parts In-Stock

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Authorized Procurement Solutions

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Perfect Parts

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Kulean Microsystems

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TANS Electronics

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Problanco Electronics

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A-Z Elektronik GmbH

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Microchip USA

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Argo Parts USA

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Supply Digital

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Bastille Electronics

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UHIMA Technologies

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SupplyDigital Components

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Speed Components Ltd (Excess)

Israel . 188 parts In-Stock

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Cyclops Electronics Ltd (Excess)

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Glotronic Ltd.

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iodParts Technologies Inc.

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GreenTree Electronics

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Overview

Unlock the power of innovation with the 74LCX74MTC by Onsemi. As a leading manufacturer in the industry, Onsemi delivers top-quality latches & flip-flops that offer unparalleled performance and reliability. Ideal for a wide range of applications, this product provides customers with exceptional value and benefits. With a compact design and advanced technology, the 74LCX74MTC is the perfect solution for all your circuit needs. Experience the difference with Onsemi today!

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

The use of plastic/epoxy material makes the latch & flip-flop durable and resistant to environmental factors, ensuring a longer lifespan.

Propagation Delay At Nominal Supply: 7 ns

The low propagation delay of 7 ns ensures fast operation and response times in the latch & flip-flop, making it suitable for high-speed applications.

Surface Mount: YES

Surface mount capability allows for easy and convenient installation on circuit boards, saving space and simplifying the overall design.

No. of Functions: 2

Having multiple functions in a single component increases efficiency and reduces the need for additional components, saving costs and simplifying the circuit design.

Nominal Supply Voltage / Vsup (V): 2.5

The low nominal supply voltage of 2.5V makes the latch & flip-flop energy-efficient and suitable for low-power applications.

Load Capacitance (CL): 50 pF

The load capacitance of 50 pF ensures compatibility with various external circuitry and devices, providing versatility in application.

Maximum I (ol): 24 Amp

The maximum output current of 24 Amp allows the latch & flip-flop to drive high-power loads without the need for external amplification, increasing functionality.

Propagation Delay (tpd): 8.4 ns

The propagation delay of 8.4 ns further enhances the speed and responsiveness of the latch & flip-flop, making it ideal for time-critical applications.

Minimum Operating Temperature: -40 °C

The wide minimum operating temperature range of -40°C ensures reliable performance in harsh environmental conditions, making it suitable for industrial applications.

Maximum Operating Temperature: 85 °C

The high maximum operating temperature of 85°C allows the latch & flip-flop to operate in elevated temperatures without performance degradation, increasing reliability.

Technical Specifications

Latches & Flip-Flops 74LCX74MTC attributes and parameters. Explore more Latches & Flip-Flops devices from Onsemi

Specs

Family:

LVC/LCX/Z

JESD-30 Code:

R-PDSO-G14

JESD-609 Code:

e4

Length:

5 mm

Load Capacitance (CL):

50 pF

Logic IC Type:

Maximum Frequency At Nominal Supply:

150000000 Hz

Maximum I (ol):

24 Amp

Moisture Sensitivity Level (MSL):

1

No. of Bits:

1

No. of Functions:

2

No. of Terminals:

14

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

-40 Cel

Output Polarity:

COMPLEMENTARY

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Equivalence Code:

TSSOP14,.25

Package Shape:

Package Style (Meter):

SMALL OUTLINE, THIN PROFILE, SHRINK PITCH

Packing Method:

RAIL

Peak Reflow Temperature (C):

260

Power Supplies (V):

3.3

Propagation Delay At Nominal Supply:

7 ns

Propagation Delay (tpd):

8.4 ns

Qualification:

Not Qualified

Maximum Seated Height:

1.2 mm

Sub-Category:

FF/Latches

Maximum Supply Voltage (Vsup):

3.6 V

Minimum Supply Voltage (Vsup):

2 V

Nominal Supply Voltage / Vsup (V):

2.5

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Finish:

NICKEL PALLADIUM GOLD

Terminal Form:

Terminal Pitch:

.65 mm

Terminal Position:

DUAL

Maximum Time At Peak Reflow Temperature (s):

30

Trigger Type:

POSITIVE EDGE

Width:

4.4 mm

Minimum fmax:

150 MHz

Trade Compliance

74LCX74MTC Logic ICs trade compliance attributes, and parameters.

HTS

8542.39.00.01

SB

8542.39.00.00

NSN

5962-01-534-2025, 5962015342025

NIIN

015342025

Manufacturer Highlights

Onsemi

Established in 1999, Onsemi is a leading global provider of power and image-sensing technologies. They are dedicated to building a better future for the automotive, industrial, cloud, medical, and IoT markets. Onsemi's core technologies include analog, digital, and mixed-signal products that offer innovative solutions for advanced automotive systems; highly reliable power management products for industrial applications; low-cost imaging solutions for medical equipment and consumer electronics; and robust communication architectures for the Internet of Things (IoT).

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Management team

President, CEO

Hassane El-Khoury

Executive VP, CFO, Treasurer

Thad Trent

Senior VP

Ross F. Jatou

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

Aizu Fab

Fabrication

Fab Initiation

1995

Japan

Aizu Wakamatsu

Wafer Capacity

52,000

1995

52,000

Si/EPI Fab

Fabrication

Fab Initiation

2018

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

10,000

2018

10,000

Expansion Phase 1 for SiC / EPI

Fabrication

Fab Initiation

2019

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

14,500

2019

14,500

Expansion Phase 2 for SiC / EPI

Fabrication

Fab Initiation

2024

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

2024

SiC Fab

Fabrication

Fab Initiation

2022

USA

Hudson

Wafer Capacity

2022

Bucheon

Fabrication

Fab Initiation

2013

South Korea

Bucheon

Wafer Capacity

61,000

2013

61,000

ISMF - Malaysia

Fabrication

Fab Initiation

1990

Malaysia

Seremban

Wafer Capacity

95,000

1990

95,000

Roznov Device Fab

Fabrication

Fab Initiation

1987

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

80,000

1987

80,000

Fab 10

Fabrication

Fab Initiation

2002

USA

East Fishkill

Wafer Capacity

15,000

2002

15,000

Burlington

Fabrication

Fab Initiation

1986

Canada

Burlington

Wafer Capacity

1986

Gresham

Fabrication

Fab Initiation

1998

USA

Gresham

Wafer Capacity

45,000

1998

45,000

Bucheon 150mm

Fabrication

Fab Initiation

2000

South Korea

Bucheon

Wafer Capacity

50,000

2000

50,000

Rochester

Fabrication

Fab Initiation

1983

USA

Rochester

Wafer Capacity

10,000

1983

10,000

Nampa

Fabrication

Fab Initiation

1995

USA

Nampa

Wafer Capacity

1995

Pennsylvania

Fabrication

Fab Initiation

1997

USA

Mountain Top

Wafer Capacity

36,000

1997

36,000

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