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CD4044BPWRG4

Texas Instruments

CD4044BPWRG4 by Texas Instruments

CD4044BPWRG4 by Texas Instruments is a 4-bit latch with 300 ns propagation delay at 5V. It features a small outline package, -55 to 125 °C operating temperature range, and true output polarity. Ideal for military applications requiring low-level trigger type and 3-state output characteristics.

Median Price

-

Lifecycle Status

Suppliers In-Stock

3

In-Stock Inventory

1k+

Distributors (In-Stock)

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Vyrian

USA . 4,053 parts In-Stock

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Digiode

USA . 1,727 parts In-Stock

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Nova Conductors

Japan . 65 parts In-Stock

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One Stop Electronics

USA . 1,299 parts In-Stock

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$4.000

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$4.000

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Semicontronic

India . 1,523 parts In-Stock

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$7.000

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$6.825

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$6.790

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$7.000

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$6.790

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Parana Technologies

USA . 839 parts In-Stock

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$9.526

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$10.125

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839

$9.526

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AZTECH Wire

Italy . 404 parts In-Stock

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$9.870

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404

$9.870

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DigiPath Technology Company

USA . 901 parts In-Stock

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$10.489

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901

$10.489

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ChromeModa Solutions

Germany . 6,318 parts In-Stock

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$10.703

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$8.776

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IDEA Electronic Components Group

UK . 855 parts In-Stock

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$10.703

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$10.168

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$9.633

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Corohmni

South Africa . 143 parts In-Stock

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$32.357

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Ampacity Inc.

Singapore . 731 parts In-Stock

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Corphita

USA . 3,744 parts In-Stock

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Argo Parts USA

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Continental Prestige Electronics

USA . 943 parts In-Stock

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Robosynatics

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Lucentia Tech

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Bastille Electronics

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Overview

Experience the superior quality and reliability of Texas Instruments with the CD4044BPWRG4, a versatile latches & flip-flops device perfect for a variety of applications. This innovative product offers customers unparalleled value, benefits, and advantages, providing fast propagation delay and high output characteristics. With a compact design and military-grade temperature grade, this CD4044BPWRG4 is ideal for both professional and DIY projects. Trust Texas Instruments to deliver cutting-edge technology that exceeds your expectations.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

Plastic/Epoxy material provides durability and protection for the internal components of the latch or flip-flop, ensuring longevity and reliable performance.

Propagation Delay At Nominal Supply: 300 ns

Fast propagation delay of 300 ns ensures quick response time for switching operations, making this latch or flip-flop efficient in time-critical applications.

Surface Mount: YES

Surface mount capability makes installation and integration of this latch or flip-flop easy and convenient, saving space on the PCB.

No. of Bits: 4

4 bits of information can be stored in this latch or flip-flop, providing versatility in data processing and storage applications.

Nominal Supply Voltage / Vsup (V): 5

Operating at a nominal supply voltage of 5V makes this latch or flip-flop compatible with standard electronic systems, ensuring easy integration.

Load Capacitance (CL): 50 pF

Suitable load capacitance of 50 pF ensures stable and reliable operation of this latch or flip-flop in various circuit configurations.

Power Supplies (V): 5/15

Support for power supplies of 5V and 15V makes this latch or flip-flop versatile and compatible with a range of electronic systems.

No. of Terminals: 16

16 terminals provide ample connectivity options for interfacing with other components and peripherals, enhancing the functionality of this latch or flip-flop.

Package Style (Meter): SMALL OUTLINE, THIN PROFILE, SHRINK PITCH

Small outline, thin profile, and shrink pitch package style offer space-saving and compact design for efficient PCB layout and integration.

Output Characteristics: 3-STATE

3-state output characteristics allow this latch or flip-flop to have high impedance state, adding flexibility in signal transmission and sharing.

Trigger Type: LOW LEVEL

Low-level trigger type ensures reliable and accurate triggering of the latch or flip-flop, preventing false switching and maintaining signal integrity.

Minimum Operating Temperature: -55 °C

Wide operating temperature range of -55°C ensures this latch or flip-flop can function in harsh environmental conditions, making it suitable for diverse applications.

Maximum Seated Height: 1.2 mm

Low maximum seated height of 1.2 mm allows for compact and slim PCB design, minimizing space requirements and enabling versatile system integration.

Output Polarity: TRUE

True output polarity ensures accurate signal representation, enabling clear distinction between logic states in the latch or flip-flop operation.

Temperature Grade: MILITARY

Military-grade temperature range of -55°C to 125°C ensures high reliability and performance of this latch or flip-flop in demanding applications and environments.

Technology: CMOS

CMOS technology offers low power consumption and high noise immunity, making this latch or flip-flop energy-efficient and robust against external interference.

Technical Specifications

Latches & Flip-Flops CD4044BPWRG4 attributes and parameters. Explore more Latches & Flip-Flops devices from Texas Instruments

Specs

Family:

4000/14000/40000

JESD-30 Code:

R-PDSO-G16

JESD-609 Code:

e4

Length:

5 mm

Load Capacitance (CL):

50 pF

Logic IC Type:

Moisture Sensitivity Level (MSL):

1

No. of Bits:

4

No. of Functions:

1

No. of Terminals:

16

Maximum Operating Temperature:

125 Cel

Minimum Operating Temperature:

-55 Cel

Output Characteristics:

3-STATE

Output Polarity:

TRUE

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Equivalence Code:

TSSOP16,.25

Package Shape:

Package Style (Meter):

SMALL OUTLINE, THIN PROFILE, SHRINK PITCH

Packing Method:

TR

Peak Reflow Temperature (C):

260

Power Supplies (V):

5/15

Propagation Delay At Nominal Supply:

300 ns

Propagation Delay (tpd):

300 ns

Qualification:

Not Qualified

Maximum Seated Height:

1.2 mm

Sub-Category:

FF/Latches

Maximum Supply Voltage (Vsup):

18 V

Minimum Supply Voltage (Vsup):

3 V

Nominal Supply Voltage / Vsup (V):

5

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Finish:

NICKEL PALLADIUM GOLD

Terminal Form:

Terminal Pitch:

.65 mm

Terminal Position:

DUAL

Maximum Time At Peak Reflow Temperature (s):

30

Trigger Type:

LOW LEVEL

Width:

4.4 mm

Trade Compliance

CD4044BPWRG4 Logic ICs trade compliance attributes, and parameters.

HTS

8542.39.00.01

SB

8542.39.00.00

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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