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NL17SZ74USG

Onsemi

NL17SZ74USG by Onsemi

NL17SZ74USG by Onsemi is a CMOS latches & flip-flops IC with 8ns propagation delay, 250MHz fmax, and 32A max I (ol). Ideal for industrial applications requiring positive edge trigger and complementary output polarity. Package style: small outline, very thin profile, shrink pitch.

Median Price

$0.118

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Arrow

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Chip1Stop

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Rochester

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Digiode

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TME

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Nova Conductors

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Maritex

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IBS Electronics

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Flip Electronics

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NAC Semi

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Ampacity Inc.

Singapore . 3,472 parts In-Stock

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Continental Prestige Electronics

USA . 6,673 parts In-Stock

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Argo Parts USA

USA . 2,220 parts In-Stock

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Vigor

Singapore . 673 parts In-Stock

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Benley Electronics

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USA . 2,887 parts In-Stock

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Advanced Electronics

New Zealand . 500 parts In-Stock

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Problanco Electronics

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SupplyDigital Components

Austria . 3,045 parts In-Stock

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Israel . 2,486 parts In-Stock

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Kulean Microsystems

USA . 1,444 parts In-Stock

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Brazil . 1,285 parts In-Stock

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Lucentia Tech

USA . 1,285 parts In-Stock

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$32.436

Authorized Procurement Solutions

USA . 922 parts In-Stock

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iodParts Technologies Inc.

India . 900 parts In-Stock

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USA . 658 parts In-Stock

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Australia . 450 parts In-Stock

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Türkiye . 448 parts In-Stock

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Microchip USA

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Overview

Discover the NL17SZ74USG by Onsemi, a top-quality latches & flip-flops component that offers exceptional value to customers. With a nominal supply voltage of 1.8V and a maximum operating temperature of 85°C, this product is perfect for industrial applications. Onsemi's reputation for reliability and innovation ensures that you are getting a superior product that will meet your needs. Upgrade your electronics with the NL17SZ74USG and experience the benefits of high performance and efficiency in your designs.

Feature Benefit Bullets

Package Body Material:

PLASTIC/EPOXY - The use of plastic/epoxy material makes the latch durable and lightweight.

Propagation Delay At Nominal Supply:

8 ns - With a fast propagation delay, this latch ensures quick data transfer.

Surface Mount:

YES - The surface mount capability allows for easy installation and space-saving design.

Package Shape:

RECTANGULAR - The rectangular shape of the package provides a compact and efficient layout.

Nominal Supply Voltage:

1.8V - Operating at a low supply voltage, this latch is energy-efficient.

Load Capacitance:

50 pF - The load capacitance of 50 pF ensures stable performance under varying load conditions.

Power Supplies:

3.3V - The latch operates effectively with a 3.3V power supply.

No. of Terminals:

8 - With 8 terminals, this latch offers flexibility in connection options.

Package Style:

SMALL OUTLINE, VERY THIN PROFILE, SHRINK PITCH - The compact package style saves space on the PCB.

Maximum I (ol):

32 Amp - The high maximum output current of 32 Amp allows for robust performance.

Propagation Delay:

13 ns - With a low propagation delay, this latch provides high-speed operation.

Maximum Operating Temperature:

85 °C - Operating at a maximum temperature of 85 °C ensures reliability in various environments.

Output Characteristics:

3-STATE - The 3-state output characteristics offer flexibility in controlling the output signal.

Trigger Type:

POSITIVE EDGE - Positive edge triggering ensures precise timing in data capture.

Minimum Operating Temperature:

40 °C - With a low minimum operating temperature, this latch can withstand cold environments.

Terminal Finish:

NICKEL SILVER GOLD PALLADIUM - The terminal finish provides durability and corrosion resistance.

Terminal Position:

DUAL - Dual terminal position allows for better PCB layout options.

Maximum Seated Height:

0.9 mm - The low seated height saves space in the overall system design.

Width:

2 mm - The compact width of 2 mm enables efficient placement on the PCB.

Output Polarity:

COMPLEMENTARY - Complementary output polarity enhances signal integrity.

Minimum Supply Voltage:

1.65V - With a low minimum supply voltage, this latch operates efficiently with minimal power.

Maximum Time At Peak Reflow Temperature:

30s - The latch can withstand peak reflow temperatures for up to 30 seconds during assembly.

Peak Reflow Temperature:

260C - The product can handle high peak reflow temperatures for soldering processes.

Length:

2.3 mm - The length of 2.3 mm provides a compact form factor for space-constrained applications.

Temperature Grade:

INDUSTRIAL - The latch is designed for industrial applications with reliable performance in harsh environments.

Technology:

CMOS - CMOS technology ensures low power consumption and high noise immunity.

Terminal Form:

GULL WING - The gull-wing terminal form offers easy soldering and robust mechanical properties.

Packing Method:

TR - The TR packing method provides protection during shipping and storage.

Terminal Pitch:

0.5 mm - The small terminal pitch of 0.5 mm allows for high-density mounting on the PCB.

Minimum fmax:

250 MHz - With a minimum operating frequency of 250 MHz, this latch supports high-speed applications.

Maximum Supply Voltage:

5.5V - Operating within a wide supply voltage range of 1.65V to 5.5V, this latch is versatile.

Maximum Power Supply Current:

100 mA - The latch can operate within a maximum power supply current of 100 mA for efficient power management.

Technical Specifications

Latches & Flip-Flops NL17SZ74USG attributes and parameters. Explore more Latches & Flip-Flops devices from Onsemi

Specs

Family:

17SZ

JESD-30 Code:

R-PDSO-G8

Length:

2.3 mm

Load Capacitance (CL):

50 pF

Logic IC Type:

Maximum I (ol):

32 Amp

Moisture Sensitivity Level (MSL):

1

No. of Bits:

1

No. of Functions:

1

No. of Terminals:

8

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

-40 Cel

Output Characteristics:

3-STATE

Output Polarity:

COMPLEMENTARY

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Equivalence Code:

TSSOP8,.12,20

Package Shape:

Package Style (Meter):

SMALL OUTLINE, VERY THIN PROFILE, SHRINK PITCH

Packing Method:

TR

Peak Reflow Temperature (C):

260

Power Supplies (V):

3.3

Maximum Power Supply Current (ICC):

100 mA

Propagation Delay At Nominal Supply:

8 ns

Propagation Delay (tpd):

13 ns

Qualification:

Not Qualified

Maximum Seated Height:

.9 mm

Sub-Category:

FF/Latches

Maximum Supply Voltage (Vsup):

5.5 V

Minimum Supply Voltage (Vsup):

1.65 V

Nominal Supply Voltage / Vsup (V):

1.8

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Finish:

NICKEL SILVER GOLD PALLADIUM

Terminal Form:

Terminal Pitch:

.5 mm

Terminal Position:

DUAL

Maximum Time At Peak Reflow Temperature (s):

30

Trigger Type:

POSITIVE EDGE

Width:

2 mm

Minimum fmax:

250 MHz

Trade Compliance

NL17SZ74USG Logic ICs trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8542.39.00.01

SB

8542.39.00.00

PCN

Manufacturer Highlights

Onsemi

Established in 1999, Onsemi is a leading global provider of power and image-sensing technologies. They are dedicated to building a better future for the automotive, industrial, cloud, medical, and IoT markets. Onsemi's core technologies include analog, digital, and mixed-signal products that offer innovative solutions for advanced automotive systems; highly reliable power management products for industrial applications; low-cost imaging solutions for medical equipment and consumer electronics; and robust communication architectures for the Internet of Things (IoT).

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The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

President, CEO

Hassane El-Khoury

Executive VP, CFO, Treasurer

Thad Trent

Senior VP

Ross F. Jatou

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

Aizu Fab

Fabrication

Fab Initiation

1995

Japan

Aizu Wakamatsu

Wafer Capacity

52,000

1995

52,000

Si/EPI Fab

Fabrication

Fab Initiation

2018

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

10,000

2018

10,000

Expansion Phase 1 for SiC / EPI

Fabrication

Fab Initiation

2019

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

14,500

2019

14,500

Expansion Phase 2 for SiC / EPI

Fabrication

Fab Initiation

2024

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

2024

SiC Fab

Fabrication

Fab Initiation

2022

USA

Hudson

Wafer Capacity

2022

Bucheon

Fabrication

Fab Initiation

2013

South Korea

Bucheon

Wafer Capacity

61,000

2013

61,000

ISMF - Malaysia

Fabrication

Fab Initiation

1990

Malaysia

Seremban

Wafer Capacity

95,000

1990

95,000

Roznov Device Fab

Fabrication

Fab Initiation

1987

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

80,000

1987

80,000

Fab 10

Fabrication

Fab Initiation

2002

USA

East Fishkill

Wafer Capacity

15,000

2002

15,000

Burlington

Fabrication

Fab Initiation

1986

Canada

Burlington

Wafer Capacity

1986

Gresham

Fabrication

Fab Initiation

1998

USA

Gresham

Wafer Capacity

45,000

1998

45,000

Bucheon 150mm

Fabrication

Fab Initiation

2000

South Korea

Bucheon

Wafer Capacity

50,000

2000

50,000

Rochester

Fabrication

Fab Initiation

1983

USA

Rochester

Wafer Capacity

10,000

1983

10,000

Nampa

Fabrication

Fab Initiation

1995

USA

Nampa

Wafer Capacity

1995

Pennsylvania

Fabrication

Fab Initiation

1997

USA

Mountain Top

Wafer Capacity

36,000

1997

36,000

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