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NL17SZ74MQ2TCG

Onsemi

NL17SZ74MQ2TCG by Onsemi

NL17SZ74MQ2TCG by Onsemi is a CMOS Latch with 8ns Propagation Delay, 13ns tpd, and 32A Max I (ol). It operates b/w -55 to 125 °C and has a supply voltage range of 1.65V to 5.5V. Ideal for military-grade applications requiring fast signal processing in compact spaces.

Median Price

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Lifecycle Status

Suppliers In-Stock

2

In-Stock Inventory

1k+

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Digiode

USA . 2,194 parts In-Stock

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Vyrian

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TANS Electronics

Latvia . 5,331 parts In-Stock

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Problanco Electronics

Mexico . 3,067 parts In-Stock

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Kulean Microsystems

USA . 1,958 parts In-Stock

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SupplyDigital Components

Austria . 1,799 parts In-Stock

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Corphita

USA . 538 parts In-Stock

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Corohmni

South Africa . 439 parts In-Stock

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UHIMA Technologies

Türkiye . 286 parts In-Stock

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Overview

Unlock a world of possibilities with the NL17SZ74MQ2TCG by Onsemi. This high-quality latches & flip-flops component offers lightning-fast propagation delay, versatile surface mount capabilities, and robust 3-state output characteristics. Perfect for military-grade applications, this chip carrier is designed to exceed expectations. Elevate your projects with the reliability and precision of Onsemi technology.

Feature Benefit Bullets

Propagation Delay At Nominal Supply: 8 ns

Low propagation delay ensures quick response time, making this latch efficient for high-speed applications.

Surface Mount: YES

Surface mount design offers easy and convenient installation, saving time and effort.

Nominal Supply Voltage / Vsup (V): 2.3

Suitable voltage range for various applications, providing flexibility in usage.

Output Characteristics: 3-STATE

3-state output allows for tristate operation, providing additional flexibility in controlling the output state.

Trigger Type: POSITIVE EDGE

Positive edge trigger ensures precise timing control, enhancing the reliability of signal processing.

Technology: CMOS

CMOS technology offers low power consumption and high noise immunity, making this latch energy-efficient and reliable.

Minimum fmax: 250 MHz

High maximum frequency allows for fast operation, suitable for high-speed applications.

Technical Specifications

Latches & Flip-Flops NL17SZ74MQ2TCG attributes and parameters. Explore more Latches & Flip-Flops devices from Onsemi

Specs

Family:

LVC/LCX/Z

JESD-30 Code:

R-XQCC-N8

Length:

1.4 mm

Load Capacitance (CL):

50 pF

Logic IC Type:

Maximum I (ol):

32 Amp

Moisture Sensitivity Level (MSL):

1

No. of Bits:

1

No. of Functions:

1

No. of Terminals:

8

Maximum Operating Temperature:

125 Cel

Minimum Operating Temperature:

-55 Cel

Output Characteristics:

3-STATE

Output Polarity:

COMPLEMENTARY

Package Body Material:

UNSPECIFIED

Package Code:

Package Equivalence Code:

LCC8,.05X.06,16

Package Shape:

Package Style (Meter):

CHIP CARRIER, VERY THIN PROFILE

Packing Method:

TR

Maximum Power Supply Current (ICC):

100 mA

Propagation Delay At Nominal Supply:

8 ns

Propagation Delay (tpd):

13 ns

Maximum Seated Height:

.55 mm

Maximum Supply Voltage (Vsup):

5.5 V

Minimum Supply Voltage (Vsup):

1.65 V

Nominal Supply Voltage / Vsup (V):

2.3

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Form:

Terminal Pitch:

.4 mm

Terminal Position:

QUAD

Trigger Type:

POSITIVE EDGE

Width:

1.2 mm

Minimum fmax:

250 MHz

Trade Compliance

NL17SZ74MQ2TCG Logic ICs trade compliance attributes, and parameters.

HTS

8542.39.00.01

SB

8542.39.00.00

Manufacturer Highlights

Onsemi

Established in 1999, Onsemi is a leading global provider of power and image-sensing technologies. They are dedicated to building a better future for the automotive, industrial, cloud, medical, and IoT markets. Onsemi's core technologies include analog, digital, and mixed-signal products that offer innovative solutions for advanced automotive systems; highly reliable power management products for industrial applications; low-cost imaging solutions for medical equipment and consumer electronics; and robust communication architectures for the Internet of Things (IoT).

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Management team

President, CEO

Hassane El-Khoury

Executive VP, CFO, Treasurer

Thad Trent

Senior VP

Ross F. Jatou

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

Aizu Fab

Fabrication

Fab Initiation

1995

Japan

Aizu Wakamatsu

Wafer Capacity

52,000

1995

52,000

Si/EPI Fab

Fabrication

Fab Initiation

2018

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

10,000

2018

10,000

Expansion Phase 1 for SiC / EPI

Fabrication

Fab Initiation

2019

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

14,500

2019

14,500

Expansion Phase 2 for SiC / EPI

Fabrication

Fab Initiation

2024

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

2024

SiC Fab

Fabrication

Fab Initiation

2022

USA

Hudson

Wafer Capacity

2022

Bucheon

Fabrication

Fab Initiation

2013

South Korea

Bucheon

Wafer Capacity

61,000

2013

61,000

ISMF - Malaysia

Fabrication

Fab Initiation

1990

Malaysia

Seremban

Wafer Capacity

95,000

1990

95,000

Roznov Device Fab

Fabrication

Fab Initiation

1987

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

80,000

1987

80,000

Fab 10

Fabrication

Fab Initiation

2002

USA

East Fishkill

Wafer Capacity

15,000

2002

15,000

Burlington

Fabrication

Fab Initiation

1986

Canada

Burlington

Wafer Capacity

1986

Gresham

Fabrication

Fab Initiation

1998

USA

Gresham

Wafer Capacity

45,000

1998

45,000

Bucheon 150mm

Fabrication

Fab Initiation

2000

South Korea

Bucheon

Wafer Capacity

50,000

2000

50,000

Rochester

Fabrication

Fab Initiation

1983

USA

Rochester

Wafer Capacity

10,000

1983

10,000

Nampa

Fabrication

Fab Initiation

1995

USA

Nampa

Wafer Capacity

1995

Pennsylvania

Fabrication

Fab Initiation

1997

USA

Mountain Top

Wafer Capacity

36,000

1997

36,000

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