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NLV17SZ74USG

Onsemi

NLV17SZ74USG by Onsemi

NLV17SZ74USG by Onsemi is a CMOS latch with 8ns propagation delay, 32A max I (ol), and 250MHz min fmax. Ideal for military applications, it operates at -55 to 125 °C with AEC-Q100 screening level. It features 3-STATE output polarity and positive edge trigger type in a small outline package.

Median Price

$2.500

Lifecycle Status

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15

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1k+

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Chip1Stop

Japan . 15 parts In-Stock

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$2.500

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Farnell

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Nova Conductors

Japan . 450 parts In-Stock

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$1.000

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Digiode

USA . 1,253 parts In-Stock

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$2.375

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Sensible Micro Corp

USA . 295,970 parts In-Stock

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Flip Electronics

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Rebound Electronics

UK . 9,000 parts In-Stock

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Vyrian

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Next Level Components, LLC

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Cyclops Electronics Ltd

UK . 2,498 parts In-Stock

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Elcom Components

USA . 1,971 parts In-Stock

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PC Components Company LLC

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Bristol Electronics

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LIBRA Elektronik GmbH

Germany . 500 parts In-Stock

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Microfarads

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Continental Prestige Electronics

USA . 4,775 parts In-Stock

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$0.286

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$0.280

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$0.286

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Argo Parts USA

USA . 3,890 parts In-Stock

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$0.286

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$0.277

3,890

$0.286

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Advanced Electronics

New Zealand . 50 parts In-Stock

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$0.292

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$0.292

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Ampacity Inc.

Singapore . 58 parts In-Stock

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$0.306

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Semicontronic

India . 58 parts In-Stock

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$0.306

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$0.298

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$0.297

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Corohmni

South Africa . 141 parts In-Stock

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$0.360

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Vigor

Singapore . 500 parts In-Stock

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$0.660

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Netroflash

USA . 100 parts In-Stock

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$0.950

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Corphita

USA . 1,425 parts In-Stock

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$2.250

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AZTECH Wire

Italy . 209 parts In-Stock

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Aztec Data Supply Inc.

USA . 55 parts In-Stock

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Perfect Parts

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ChipstoGo Electronic ltd

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GreenTree Electronics

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Lixinc

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Infinite Electronics LLP (Excess)

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Microchip USA

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Kulean Microsystems

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TANS Electronics

Latvia . 5,582 parts In-Stock

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SupplyDigital Components

Austria . 3,679 parts In-Stock

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Authorized Procurement Solutions

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iodParts Technologies Inc.

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Problanco Electronics

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UHIMA Technologies

Türkiye . 545 parts In-Stock

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Overview

Enhance your electronic projects with the NLV17SZ74USG from Onsemi. As a trusted manufacturer in the industry, Onsemi delivers high-quality latches and flip-flops that are perfect for a wide range of applications. With a compact design and fast propagation delay, this product offers exceptional value and reliability. Whether you're working on automotive electronics or consumer devices, the NLV17SZ74USG provides the performance and efficiency you need to bring your creations to life. Upgrade your projects today with this top-of-the-line component from Onsemi.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

This material provides durability and protection for the internal components of the latch, ensuring a longer lifespan.

Propagation Delay At Nominal Supply: 8 ns

Fast propagation delay allows for quick response times, making this latch suitable for high-speed applications.

Surface Mount: YES

Surface mount capability makes installation and integration easier, saving time and effort for the user.

Screening Level: AEC-Q100

AEC-Q100 certification ensures that the latch meets automotive industry standards for reliability and performance.

Nominal Supply Voltage / Vsup (V): 1.8

Low nominal supply voltage helps in reducing power consumption, making this latch energy-efficient.

Maximum Operating Temperature: 125 °C

High maximum operating temperature allows for reliable performance in various environmental conditions.

Technology: CMOS

CMOS technology offers low power consumption and high noise immunity, making this latch suitable for battery-operated devices.

Minimum Supply Voltage (Vsup): 1.65 V

Low minimum supply voltage ensures compatibility with a wide range of power sources.

Technical Specifications

Latches & Flip-Flops NLV17SZ74USG attributes and parameters. Explore more Latches & Flip-Flops devices from Onsemi

Specs

Family:

LVC/LCX/Z

JESD-30 Code:

R-PDSO-G8

JESD-609 Code:

e3

Length:

2.3 mm

Load Capacitance (CL):

50 pF

Logic IC Type:

Maximum I (ol):

32 Amp

Moisture Sensitivity Level (MSL):

1

No. of Bits:

1

No. of Functions:

1

No. of Terminals:

8

Maximum Operating Temperature:

125 Cel

Minimum Operating Temperature:

-55 Cel

Output Characteristics:

3-STATE

Output Polarity:

COMPLEMENTARY

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Equivalence Code:

TSSOP8,.12,20

Package Shape:

Package Style (Meter):

SMALL OUTLINE, VERY THIN PROFILE, SHRINK PITCH

Packing Method:

TR

Peak Reflow Temperature (C):

260

Power Supplies (V):

3.3

Maximum Power Supply Current (ICC):

100 mA

Propagation Delay At Nominal Supply:

8 ns

Propagation Delay (tpd):

13 ns

Qualification:

Not Qualified

Screening Level:

AEC-Q100

Maximum Seated Height:

.9 mm

Sub-Category:

FF/Latches

Maximum Supply Voltage (Vsup):

5.5 V

Minimum Supply Voltage (Vsup):

1.65 V

Nominal Supply Voltage / Vsup (V):

1.8

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Finish:

MATTE TIN

Terminal Form:

Terminal Pitch:

.5 mm

Terminal Position:

DUAL

Maximum Time At Peak Reflow Temperature (s):

30

Trigger Type:

POSITIVE EDGE

Width:

2 mm

Minimum fmax:

250 MHz

Trade Compliance

NLV17SZ74USG Logic ICs trade compliance attributes, and parameters.

HTS

8542.39.00.01

SB

8542.39.00.00

PCN

Manufacturer Highlights

Onsemi

Established in 1999, Onsemi is a leading global provider of power and image-sensing technologies. They are dedicated to building a better future for the automotive, industrial, cloud, medical, and IoT markets. Onsemi's core technologies include analog, digital, and mixed-signal products that offer innovative solutions for advanced automotive systems; highly reliable power management products for industrial applications; low-cost imaging solutions for medical equipment and consumer electronics; and robust communication architectures for the Internet of Things (IoT).

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Management team

President, CEO

Hassane El-Khoury

Executive VP, CFO, Treasurer

Thad Trent

Senior VP

Ross F. Jatou

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

Aizu Fab

Fabrication

Fab Initiation

1995

Japan

Aizu Wakamatsu

Wafer Capacity

52,000

1995

52,000

Si/EPI Fab

Fabrication

Fab Initiation

2018

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

10,000

2018

10,000

Expansion Phase 1 for SiC / EPI

Fabrication

Fab Initiation

2019

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

14,500

2019

14,500

Expansion Phase 2 for SiC / EPI

Fabrication

Fab Initiation

2024

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

2024

SiC Fab

Fabrication

Fab Initiation

2022

USA

Hudson

Wafer Capacity

2022

Bucheon

Fabrication

Fab Initiation

2013

South Korea

Bucheon

Wafer Capacity

61,000

2013

61,000

ISMF - Malaysia

Fabrication

Fab Initiation

1990

Malaysia

Seremban

Wafer Capacity

95,000

1990

95,000

Roznov Device Fab

Fabrication

Fab Initiation

1987

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

80,000

1987

80,000

Fab 10

Fabrication

Fab Initiation

2002

USA

East Fishkill

Wafer Capacity

15,000

2002

15,000

Burlington

Fabrication

Fab Initiation

1986

Canada

Burlington

Wafer Capacity

1986

Gresham

Fabrication

Fab Initiation

1998

USA

Gresham

Wafer Capacity

45,000

1998

45,000

Bucheon 150mm

Fabrication

Fab Initiation

2000

South Korea

Bucheon

Wafer Capacity

50,000

2000

50,000

Rochester

Fabrication

Fab Initiation

1983

USA

Rochester

Wafer Capacity

10,000

1983

10,000

Nampa

Fabrication

Fab Initiation

1995

USA

Nampa

Wafer Capacity

1995

Pennsylvania

Fabrication

Fab Initiation

1997

USA

Mountain Top

Wafer Capacity

36,000

1997

36,000

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