Loading...

NLV17SZ74MQ1TCG

Onsemi

NLV17SZ74MQ1TCG by Onsemi

NLV17SZ74MQ1TCG by Onsemi is a CMOS latches & flip-flops chip with 8ns propagation delay, suitable for military applications. It operates at 2.3V nominal voltage, has 32A max I (ol), and supports positive edge trigger type. With a temperature range of -55 to 125 °C, it features a very thin profile square package style and is AEC-Q100 screened.

Median Price

-

Lifecycle Status

Suppliers In-Stock

2

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Vyrian

USA . 2,393 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

2,393

-

-

-

-

Digiode

USA . 2,345 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

2,345

-

-

-

-

Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

SupplyDigital Components

Austria . 7,918 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

7,918

-

-

-

-

Problanco Electronics

Mexico . 6,398 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

6,398

-

-

-

-

Kulean Microsystems

USA . 5,543 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

5,543

-

-

-

-

Corphita

USA . 1,705 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

1,705

-

-

-

-

UHIMA Technologies

Türkiye . 963 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

963

-

-

-

-

TANS Electronics

Latvia . 842 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

842

-

-

-

-

Corohmni

South Africa . 375 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

375

-

-

-

-

Overview

Enhance your electronic projects with the NLV17SZ74MQ1TCG by Onsemi, a top-of-the-line Latches & Flip-Flops component that guarantees superior quality and performance. Manufactured by Onsemi, a renowned industry leader, this product offers exceptional value and benefits to customers in various applications. With a low propagation delay, high operating temperature range, and AEC-Q100 screening level, this versatile chip carrier is perfect for demanding environments. Trust Onsemi's innovation and reliability to take your projects to the next level.

Feature Benefit Bullets

Propagation Delay At Nominal Supply: 8 ns

Low propagation delay ensures fast response times, making this latch efficient for high-speed applications.

Surface Mount: YES

Surface mount capability allows for easy and secure installation on PCBs, saving space and reducing assembly time.

Screening Level: AEC-Q100

AEC-Q100 screening ensures high reliability and quality, making this latch suitable for automotive applications.

Nominal Supply Voltage / Vsup (V): 2.3

Operates at a low nominal supply voltage, saving power and making it suitable for battery-operated devices.

No. of Terminals: 8

The ample number of terminals allows for versatile connectivity options and integration into complex circuits.

Maximum I (ol): 32 Amp

High output current capability allows for driving heavy loads, making this latch suitable for power applications.

Trigger Type: POSITIVE EDGE

Positive edge triggering ensures precise control and synchronization of the latch with external signals.

Maximum Operating Temperature: 125 °C

Wide operating temperature range allows for reliable performance in varying environmental conditions.

Technology: CMOS

CMOS technology offers low power consumption and high noise immunity, enhancing the overall efficiency and reliability of the latch.

Technical Specifications

Latches & Flip-Flops NLV17SZ74MQ1TCG attributes and parameters. Explore more Latches & Flip-Flops devices from Onsemi

Specs

Family:

LVC/LCX/Z

JESD-30 Code:

S-XQCC-N8

Length:

1.6 mm

Load Capacitance (CL):

50 pF

Logic IC Type:

Maximum I (ol):

32 Amp

Moisture Sensitivity Level (MSL):

1

No. of Bits:

1

No. of Functions:

1

No. of Terminals:

8

Maximum Operating Temperature:

125 Cel

Minimum Operating Temperature:

-55 Cel

Output Characteristics:

3-STATE

Output Polarity:

COMPLEMENTARY

Package Body Material:

UNSPECIFIED

Package Code:

Package Equivalence Code:

LCC8,.06SQ,20

Package Shape:

Package Style (Meter):

CHIP CARRIER, VERY THIN PROFILE

Packing Method:

TR

Peak Reflow Temperature (C):

260

Maximum Power Supply Current (ICC):

100 mA

Propagation Delay At Nominal Supply:

8 ns

Propagation Delay (tpd):

13 ns

Screening Level:

AEC-Q100

Maximum Seated Height:

.6 mm

Maximum Supply Voltage (Vsup):

5.5 V

Minimum Supply Voltage (Vsup):

1.65 V

Nominal Supply Voltage / Vsup (V):

2.3

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Form:

Terminal Pitch:

.5 mm

Terminal Position:

QUAD

Maximum Time At Peak Reflow Temperature (s):

40

Trigger Type:

POSITIVE EDGE

Width:

1.6 mm

Minimum fmax:

250 MHz

Trade Compliance

NLV17SZ74MQ1TCG Logic ICs trade compliance attributes, and parameters.

HTS

8542.39.00.01

SB

8542.39.00.00

Manufacturer Highlights

Onsemi

Established in 1999, Onsemi is a leading global provider of power and image-sensing technologies. They are dedicated to building a better future for the automotive, industrial, cloud, medical, and IoT markets. Onsemi's core technologies include analog, digital, and mixed-signal products that offer innovative solutions for advanced automotive systems; highly reliable power management products for industrial applications; low-cost imaging solutions for medical equipment and consumer electronics; and robust communication architectures for the Internet of Things (IoT).

previous next
The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

President, CEO

Hassane El-Khoury

Executive VP, CFO, Treasurer

Thad Trent

Senior VP

Ross F. Jatou

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

Aizu Fab

Fabrication

Fab Initiation

1995

Japan

Aizu Wakamatsu

Wafer Capacity

52,000

1995

52,000

Si/EPI Fab

Fabrication

Fab Initiation

2018

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

10,000

2018

10,000

Expansion Phase 1 for SiC / EPI

Fabrication

Fab Initiation

2019

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

14,500

2019

14,500

Expansion Phase 2 for SiC / EPI

Fabrication

Fab Initiation

2024

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

2024

SiC Fab

Fabrication

Fab Initiation

2022

USA

Hudson

Wafer Capacity

2022

Bucheon

Fabrication

Fab Initiation

2013

South Korea

Bucheon

Wafer Capacity

61,000

2013

61,000

ISMF - Malaysia

Fabrication

Fab Initiation

1990

Malaysia

Seremban

Wafer Capacity

95,000

1990

95,000

Roznov Device Fab

Fabrication

Fab Initiation

1987

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

80,000

1987

80,000

Fab 10

Fabrication

Fab Initiation

2002

USA

East Fishkill

Wafer Capacity

15,000

2002

15,000

Burlington

Fabrication

Fab Initiation

1986

Canada

Burlington

Wafer Capacity

1986

Gresham

Fabrication

Fab Initiation

1998

USA

Gresham

Wafer Capacity

45,000

1998

45,000

Bucheon 150mm

Fabrication

Fab Initiation

2000

South Korea

Bucheon

Wafer Capacity

50,000

2000

50,000

Rochester

Fabrication

Fab Initiation

1983

USA

Rochester

Wafer Capacity

10,000

1983

10,000

Nampa

Fabrication

Fab Initiation

1995

USA

Nampa

Wafer Capacity

1995

Pennsylvania

Fabrication

Fab Initiation

1997

USA

Mountain Top

Wafer Capacity

36,000

1997

36,000

Category top products 20

Authentic purchasing experiences

Partstack™ will investigate all reported instances of potential suspect/counterfeit part listings.

Similar products 18