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MC74HC112ADR2G

Onsemi

MC74HC112ADR2G by Onsemi

MC74HC112ADR2G by Onsemi is a dual flip-flop with 2 functions, operating at 5V. It has a load capacitance of 50pF and can handle up to 4A current. Ideal for military-grade applications requiring high-frequency operation up to 20MHz in small outline packages.

Median Price

$0.528

Lifecycle Status

Suppliers In-Stock

9

In-Stock Inventory

1k+

Distributors (Authorized)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Mouser Electronics

USA . 37 parts In-Stock

1+ parts

$0.570

100+ parts

$0.239

1k+ parts

$0.224

10k+ parts

$0.223

37

$0.570

$0.239

$0.224

$0.223

DigiKey

USA . 135,078 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

$0.590

10k+ parts

-

135,078

-

-

$0.590

-

Rochester

USA . 134,178 parts In-Stock

1+ parts

-

100+ parts

$0.468

1k+ parts

$0.389

10k+ parts

$0.347

134,178

-

$0.468

$0.389

$0.347

Verical

USA . 85,078 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

$0.486

10k+ parts

$0.433

85,078

-

-

$0.486

$0.433

Flip Electronics (Authorized)

USA . 45,000 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

45,000

-

-

-

-

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Nova Conductors

Japan . 10 parts In-Stock

1+ parts

$0.181

100+ parts

-

1k+ parts

-

10k+ parts

-

10

$0.181

-

-

-

Digiode

USA . 285 parts In-Stock

1+ parts

$0.187

100+ parts

-

1k+ parts

-

10k+ parts

-

285

$0.187

-

-

-

Vyrian

USA . 53,883 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

53,883

-

-

-

-

Flip Electronics

USA . 45,000 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

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45,000

-

-

-

-

Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Ampacity Inc.

Singapore . 53,916 parts In-Stock

1+ parts

$0.167

100+ parts

-

1k+ parts

-

10k+ parts

-

53,916

$0.167

-

-

-

Semicontronic

India . 53,491 parts In-Stock

1+ parts

$0.167

100+ parts

$0.163

1k+ parts

$0.162

10k+ parts

-

53,491

$0.167

$0.163

$0.162

-

Corphita

USA . 1,728 parts In-Stock

1+ parts

$0.177

100+ parts

-

1k+ parts

-

10k+ parts

-

1,728

$0.177

-

-

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Argo Parts USA

USA . 3,464 parts In-Stock

1+ parts

$0.181

100+ parts

-

1k+ parts

-

10k+ parts

$0.176

3,464

$0.181

-

-

$0.176

Continental Prestige Electronics

USA . 209 parts In-Stock

1+ parts

$0.181

100+ parts

-

1k+ parts

-

10k+ parts

$0.178

209

$0.181

-

-

$0.178

Netroflash

USA . 100 parts In-Stock

1+ parts

$0.181

100+ parts

-

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-

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100

$0.181

-

-

-

Corohmni

South Africa . 447 parts In-Stock

1+ parts

$0.197

100+ parts

-

1k+ parts

-

10k+ parts

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447

$0.197

-

-

-

Aztec Data Supply Inc.

USA . 668 parts In-Stock

1+ parts

$26.760

100+ parts

-

1k+ parts

-

10k+ parts

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668

$26.760

-

-

-

TANS Electronics

Latvia . 8,256 parts In-Stock

1+ parts

-

100+ parts

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8,256

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-

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Problanco Electronics

Mexico . 4,922 parts In-Stock

1+ parts

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100+ parts

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4,922

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-

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SupplyDigital Components

Austria . 1,388 parts In-Stock

1+ parts

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1,388

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Kulean Microsystems

USA . 1,026 parts In-Stock

1+ parts

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100+ parts

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1,026

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UHIMA Technologies

Türkiye . 920 parts In-Stock

1+ parts

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920

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Robosynatics

Brazil . 500 parts In-Stock

1+ parts

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500

-

-

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Lucentia Tech

USA . 500 parts In-Stock

1+ parts

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500

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-

Overview

Unleash the power of the MC74HC112ADR2G by Onsemi, a top-of-the-line latches & flip-flops device that guarantees quality and reliability. Manufactured by Onsemi, a trusted name in the industry, this product offers seamless functionality and versatility for a wide range of applications. With its cutting-edge technology and innovative design, the MC74HC112ADR2G ensures optimal performance and efficiency. Experience the value and benefits of this exceptional product today and take your projects to the next level!

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

The plastic/epoxy package body material provides durability and protection for the internal components of the latch, ensuring long-lasting performance.

Surface Mount: YES

Being surface mountable allows for easy PCB assembly, saving time and effort during the manufacturing process.

No. of Functions: 2

Having 2 functions in one component increases efficiency and saves space on the circuit board.

Nominal Supply Voltage / Vsup (V): 5

Operating at a standard 5V supply voltage makes integration with existing systems simpler and more convenient.

Maximum Operating Temperature: 125 °C

Being able to withstand high temperatures makes this latch suitable for a variety of industrial and automotive applications.

Technology: CMOS

CMOS technology offers low power consumption and high noise immunity, making the latch energy-efficient and reliable.

Technical Specifications

Latches & Flip-Flops MC74HC112ADR2G attributes and parameters. Explore more Latches & Flip-Flops devices from Onsemi

Specs

Family:

HC/UH

JESD-30 Code:

R-PDSO-G16

JESD-609 Code:

e3

Length:

9.9 mm

Load Capacitance (CL):

50 pF

Logic IC Type:

Maximum Frequency At Nominal Supply:

20000000 Hz

Maximum I (ol):

4 Amp

Moisture Sensitivity Level (MSL):

1

No. of Bits:

2

No. of Functions:

2

No. of Terminals:

16

Maximum Operating Temperature:

125 Cel

Minimum Operating Temperature:

-55 Cel

Output Polarity:

COMPLEMENTARY

Package Body Material:

PLASTIC/EPOXY

Package Code:

SOP

Package Equivalence Code:

SOP16,.25

Package Shape:

Package Style (Meter):

SMALL OUTLINE

Packing Method:

TR

Peak Reflow Temperature (C):

260

Power Supplies (V):

2/6

Qualification:

Not Qualified

Maximum Seated Height:

1.75 mm

Sub-Category:

FF/Latches

Maximum Supply Voltage (Vsup):

6 V

Minimum Supply Voltage (Vsup):

2 V

Nominal Supply Voltage / Vsup (V):

5

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Finish:

MATTE TIN

Terminal Form:

Terminal Pitch:

1.27 mm

Terminal Position:

DUAL

Maximum Time At Peak Reflow Temperature (s):

30

Trigger Type:

NEGATIVE EDGE

Width:

3.9 mm

Trade Compliance

MC74HC112ADR2G Logic ICs trade compliance attributes, and parameters.

HTS

8542.39.00.01

SB

8542.39.00.00

PCN

Manufacturer Highlights

Onsemi

Established in 1999, Onsemi is a leading global provider of power and image-sensing technologies. They are dedicated to building a better future for the automotive, industrial, cloud, medical, and IoT markets. Onsemi's core technologies include analog, digital, and mixed-signal products that offer innovative solutions for advanced automotive systems; highly reliable power management products for industrial applications; low-cost imaging solutions for medical equipment and consumer electronics; and robust communication architectures for the Internet of Things (IoT).

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Management team

President, CEO

Hassane El-Khoury

Executive VP, CFO, Treasurer

Thad Trent

Senior VP

Ross F. Jatou

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

Aizu Fab

Fabrication

Fab Initiation

1995

Japan

Aizu Wakamatsu

Wafer Capacity

52,000

1995

52,000

Si/EPI Fab

Fabrication

Fab Initiation

2018

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

10,000

2018

10,000

Expansion Phase 1 for SiC / EPI

Fabrication

Fab Initiation

2019

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

14,500

2019

14,500

Expansion Phase 2 for SiC / EPI

Fabrication

Fab Initiation

2024

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

2024

SiC Fab

Fabrication

Fab Initiation

2022

USA

Hudson

Wafer Capacity

2022

Bucheon

Fabrication

Fab Initiation

2013

South Korea

Bucheon

Wafer Capacity

61,000

2013

61,000

ISMF - Malaysia

Fabrication

Fab Initiation

1990

Malaysia

Seremban

Wafer Capacity

95,000

1990

95,000

Roznov Device Fab

Fabrication

Fab Initiation

1987

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

80,000

1987

80,000

Fab 10

Fabrication

Fab Initiation

2002

USA

East Fishkill

Wafer Capacity

15,000

2002

15,000

Burlington

Fabrication

Fab Initiation

1986

Canada

Burlington

Wafer Capacity

1986

Gresham

Fabrication

Fab Initiation

1998

USA

Gresham

Wafer Capacity

45,000

1998

45,000

Bucheon 150mm

Fabrication

Fab Initiation

2000

South Korea

Bucheon

Wafer Capacity

50,000

2000

50,000

Rochester

Fabrication

Fab Initiation

1983

USA

Rochester

Wafer Capacity

10,000

1983

10,000

Nampa

Fabrication

Fab Initiation

1995

USA

Nampa

Wafer Capacity

1995

Pennsylvania

Fabrication

Fab Initiation

1997

USA

Mountain Top

Wafer Capacity

36,000

1997

36,000

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