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NLV14044BDR2G

Onsemi

NLV14044BDR2G by Onsemi

NLV14044BDR2G by Onsemi is a 4-bit latch with 350ns propagation delay, suitable for AEC-Q100 applications. Operating at 5V, it features a load capacitance of 50pF and output polarity as TRUE. With a MILITARY temperature grade, this CMOS technology flip-flop has a terminal pitch of 1.27mm and is ideal for high-level trigger applications.

Median Price

$0.440

Lifecycle Status

Suppliers In-Stock

7

In-Stock Inventory

1k+

Distributors (Authorized)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Rochester

USA . 737 parts In-Stock

1+ parts

$0.259

100+ parts

$0.244

1k+ parts

$0.221

10k+ parts

-

737

$0.259

$0.244

$0.221

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DigiKey

USA . 577 parts In-Stock

1+ parts

$0.540

100+ parts

$0.298

1k+ parts

$0.257

10k+ parts

$0.232

577

$0.540

$0.298

$0.257

$0.232

Mouser Electronics

USA . 130 parts In-Stock

1+ parts

$0.540

100+ parts

$0.298

1k+ parts

$0.257

10k+ parts

$0.235

130

$0.540

$0.298

$0.257

$0.235

Verical

USA . 5,000 parts In-Stock

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$0.340

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5,000

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-

$0.340

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Distributors (In-Stock)

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Vyrian

USA . 966 parts In-Stock

1+ parts

$0.225

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966

$0.225

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Digiode

USA . 515 parts In-Stock

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$0.246

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515

$0.246

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Flip Electronics

USA . 110,000 parts In-Stock

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Distributors (Availability)

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Corohmni

South Africa . 145 parts In-Stock

1+ parts

$0.225

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145

$0.225

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Corphita

USA . 2,179 parts In-Stock

1+ parts

$0.233

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2,179

$0.233

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Vigor

Singapore . 180 parts In-Stock

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$0.320

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180

$0.320

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Ampacity Inc.

Singapore . 2,858 parts In-Stock

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$0.416

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2,858

$0.416

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Microchip USA

USA . 1,502 parts In-Stock

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$4.420

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1,502

$4.420

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Perfect Parts

USA . 109,178 parts In-Stock

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GreenTree Electronics

Israel . 70,000 parts In-Stock

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TANS Electronics

Latvia . 7,708 parts In-Stock

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Problanco Electronics

Mexico . 7,602 parts In-Stock

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SupplyDigital Components

Austria . 4,915 parts In-Stock

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iodParts Technologies Inc.

India . 1,941 parts In-Stock

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Kulean Microsystems

USA . 636 parts In-Stock

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636

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UHIMA Technologies

Türkiye . 29 parts In-Stock

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Overview

Unlock a world of possibilities with Onsemi's NLV14044BDR2G, a top-of-the-line latches & flip-flops device that guarantees high-quality performance and reliability. Designed with precision and expertise, this product offers unparalleled value to customers in various applications. Whether you're looking to enhance your electronics projects or streamline your industrial processes, the NLV14044BDR2G is the perfect solution. Experience the benefits of superior technology and innovation with Onsemi's cutting-edge product.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

The use of plastic/epoxy material makes the latch/flip-flop lightweight and durable, ensuring longevity and ease of handling.

Propagation Delay At Nominal Supply: 350 ns

The fast propagation delay of 350 ns ensures efficient and quick operation of the latch/flip-flop, making it suitable for applications requiring rapid response times.

Surface Mount: YES

Being surface mountable allows for easy and convenient PCB assembly, saving space and simplifying the manufacturing process.

Screening Level: AEC-Q100

The AEC-Q100 screening level ensures high reliability and quality standards, making this latch/flip-flop suitable for automotive applications where rigorous testing is required.

Nominal Supply Voltage / Vsup (V): 5

Operating at a nominal supply voltage of 5V makes this latch/flip-flop compatible with standard electronic systems, providing a reliable power source.

Load Capacitance (CL): 50 pF

The low load capacitance of 50 pF allows for efficient energy transfer and minimal power consumption, enhancing the overall performance of the latch/flip-flop.

Technology: CMOS

Utilizing CMOS technology ensures low power consumption and high noise immunity, making this latch/flip-flop energy-efficient and reliable in noisy environments.

Technical Specifications

Latches & Flip-Flops NLV14044BDR2G attributes and parameters. Explore more Latches & Flip-Flops devices from Onsemi

Specs

Family:

4000/14000/40000

JESD-30 Code:

R-PDSO-G16

JESD-609 Code:

e3

Length:

9.9 mm

Load Capacitance (CL):

50 pF

Logic IC Type:

Moisture Sensitivity Level (MSL):

1

No. of Bits:

4

No. of Functions:

1

No. of Terminals:

16

Maximum Operating Temperature:

125 Cel

Minimum Operating Temperature:

-55 Cel

Output Characteristics:

3-STATE

Output Polarity:

TRUE

Package Body Material:

PLASTIC/EPOXY

Package Code:

SOP

Package Equivalence Code:

SOP16,.25

Package Shape:

Package Style (Meter):

SMALL OUTLINE

Packing Method:

TR

Peak Reflow Temperature (C):

260

Power Supplies (V):

5/15

Propagation Delay At Nominal Supply:

350 ns

Propagation Delay (tpd):

350 ns

Qualification:

Not Qualified

Screening Level:

AEC-Q100

Maximum Seated Height:

1.75 mm

Sub-Category:

FF/Latches

Maximum Supply Voltage (Vsup):

18 V

Minimum Supply Voltage (Vsup):

3 V

Nominal Supply Voltage / Vsup (V):

5

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Finish:

MATTE TIN

Terminal Form:

Terminal Pitch:

1.27 mm

Terminal Position:

DUAL

Maximum Time At Peak Reflow Temperature (s):

30

Trigger Type:

HIGH LEVEL

Width:

3.9 mm

Trade Compliance

NLV14044BDR2G Logic ICs trade compliance attributes, and parameters.

HTS

8542.39.00.01

SB

8542.39.00.00

PCN

Manufacturer Highlights

Onsemi

Established in 1999, Onsemi is a leading global provider of power and image-sensing technologies. They are dedicated to building a better future for the automotive, industrial, cloud, medical, and IoT markets. Onsemi's core technologies include analog, digital, and mixed-signal products that offer innovative solutions for advanced automotive systems; highly reliable power management products for industrial applications; low-cost imaging solutions for medical equipment and consumer electronics; and robust communication architectures for the Internet of Things (IoT).

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Management team

President, CEO

Hassane El-Khoury

Executive VP, CFO, Treasurer

Thad Trent

Senior VP

Ross F. Jatou

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

Aizu Fab

Fabrication

Fab Initiation

1995

Japan

Aizu Wakamatsu

Wafer Capacity

52,000

1995

52,000

Si/EPI Fab

Fabrication

Fab Initiation

2018

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

10,000

2018

10,000

Expansion Phase 1 for SiC / EPI

Fabrication

Fab Initiation

2019

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

14,500

2019

14,500

Expansion Phase 2 for SiC / EPI

Fabrication

Fab Initiation

2024

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

2024

SiC Fab

Fabrication

Fab Initiation

2022

USA

Hudson

Wafer Capacity

2022

Bucheon

Fabrication

Fab Initiation

2013

South Korea

Bucheon

Wafer Capacity

61,000

2013

61,000

ISMF - Malaysia

Fabrication

Fab Initiation

1990

Malaysia

Seremban

Wafer Capacity

95,000

1990

95,000

Roznov Device Fab

Fabrication

Fab Initiation

1987

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

80,000

1987

80,000

Fab 10

Fabrication

Fab Initiation

2002

USA

East Fishkill

Wafer Capacity

15,000

2002

15,000

Burlington

Fabrication

Fab Initiation

1986

Canada

Burlington

Wafer Capacity

1986

Gresham

Fabrication

Fab Initiation

1998

USA

Gresham

Wafer Capacity

45,000

1998

45,000

Bucheon 150mm

Fabrication

Fab Initiation

2000

South Korea

Bucheon

Wafer Capacity

50,000

2000

50,000

Rochester

Fabrication

Fab Initiation

1983

USA

Rochester

Wafer Capacity

10,000

1983

10,000

Nampa

Fabrication

Fab Initiation

1995

USA

Nampa

Wafer Capacity

1995

Pennsylvania

Fabrication

Fab Initiation

1997

USA

Mountain Top

Wafer Capacity

36,000

1997

36,000

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