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NLV14043BDR2G

Onsemi

NLV14043BDR2G by Onsemi

NLV14043BDR2G by Onsemi is a 4-bit latch with 350 ns propagation delay at 5V. It features a small outline package, AEC-Q100 screening level, and operates in temperatures ranging from -55 to 125°C. Ideal for military-grade applications requiring high-level trigger type and true output polarity.

Median Price

$0.550

Lifecycle Status

Suppliers In-Stock

8

In-Stock Inventory

1k+

Distributors (Authorized)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

DigiKey

USA . 7,406 parts In-Stock

1+ parts

$0.550

100+ parts

$0.303

1k+ parts

$0.261

10k+ parts

$0.236

7,406

$0.550

$0.303

$0.261

$0.236

Mouser Electronics

USA . 383 parts In-Stock

1+ parts

$0.550

100+ parts

$0.303

1k+ parts

$0.261

10k+ parts

$0.246

383

$0.550

$0.303

$0.261

$0.246

Rochester

USA . 611 parts In-Stock

1+ parts

-

100+ parts

$0.290

1k+ parts

$0.240

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$0.214

611

-

$0.290

$0.240

$0.214

Distributors (In-Stock)

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Digiode

USA . 1,702 parts In-Stock

1+ parts

$0.225

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1,702

$0.225

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NAC Semi

USA . 5,000 parts In-Stock

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$0.354

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$0.354

Sensible Micro Corp

USA . 3,437 parts In-Stock

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3,437

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ComSIT Distribution GmbH

Germany . 2,081 parts In-Stock

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Vyrian

USA . 1,085 parts In-Stock

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Distributors (Availability)

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Corphita

USA . 893 parts In-Stock

1+ parts

$0.213

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893

$0.213

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Corohmni

South Africa . 311 parts In-Stock

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$0.237

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311

$0.237

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Vigor

Singapore . 274 parts In-Stock

1+ parts

$0.910

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274

$0.910

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Advanced Electronics

New Zealand . 600 parts In-Stock

1+ parts

$13.190

100+ parts

$12.003

1k+ parts

$10.816

10k+ parts

-

600

$13.190

$12.003

$10.816

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AZTECH Wire

Italy . 1,085 parts In-Stock

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$21.430

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$21.430

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Kepictronics

USA . 20,000 parts In-Stock

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Authorized Procurement Solutions

USA . 20,000 parts In-Stock

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iodParts Technologies Inc.

India . 15,000 parts In-Stock

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Perfect Parts

USA . 8,512 parts In-Stock

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Problanco Electronics

Mexico . 7,902 parts In-Stock

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Lixinc

USA . 5,252 parts In-Stock

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Kulean Microsystems

USA . 1,771 parts In-Stock

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TANS Electronics

Latvia . 1,767 parts In-Stock

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SupplyDigital Components

Austria . 1,713 parts In-Stock

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UHIMA Technologies

Türkiye . 923 parts In-Stock

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923

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Overview

Unlock a world of possibilities with the NLV14043BDR2G by Onsemi. As a leading manufacturer in the industry, Onsemi delivers superior quality and reliability in every product they create. The NLV14043BDR2G falls under the category of Latches & Flip-Flops, offering a versatile solution for various applications. With a nominal supply voltage of 5V and a propagation delay of 350ns, this small outline package with dual terminal position provides high-level triggering and true output polarity. Experience seamless integration and enhanced performance with the NLV14043BDR2G, designed to meet your needs with precision and efficiency.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

This material is durable and can withstand various environmental conditions, making the product reliable for long-term use.

Propagation Delay At Nominal Supply: 350 ns

Low propagation delay ensures fast and efficient operation of the latch/flip-flop.

Surface Mount: YES

Surface mount capability allows for easy and convenient installation on circuit boards.

Package Shape: RECTANGULAR

Rectangular shape makes it easy to integrate the latch/flip-flop into existing circuit designs.

Nominal Supply Voltage / Vsup (V): 5

Operates at a standard 5V supply voltage, compatible with most electronic systems.

Load Capacitance (CL): 50 pF

Designed to work efficiently with a load capacitance of 50 pF, ensuring optimal performance.

Technical Specifications

Latches & Flip-Flops NLV14043BDR2G attributes and parameters. Explore more Latches & Flip-Flops devices from Onsemi

Specs

Family:

4000/14000/40000

JESD-30 Code:

R-PDSO-G16

JESD-609 Code:

e3

Length:

9.9 mm

Load Capacitance (CL):

50 pF

Logic IC Type:

Moisture Sensitivity Level (MSL):

1

No. of Bits:

4

No. of Functions:

1

No. of Terminals:

16

Maximum Operating Temperature:

125 Cel

Minimum Operating Temperature:

-55 Cel

Output Characteristics:

3-STATE

Output Polarity:

TRUE

Package Body Material:

PLASTIC/EPOXY

Package Code:

SOP

Package Equivalence Code:

SOP16,.25

Package Shape:

Package Style (Meter):

SMALL OUTLINE

Packing Method:

TR

Peak Reflow Temperature (C):

260

Power Supplies (V):

5/15

Propagation Delay At Nominal Supply:

350 ns

Propagation Delay (tpd):

350 ns

Qualification:

Not Qualified

Screening Level:

AEC-Q100

Maximum Seated Height:

1.75 mm

Sub-Category:

FF/Latches

Maximum Supply Voltage (Vsup):

18 V

Minimum Supply Voltage (Vsup):

3 V

Nominal Supply Voltage / Vsup (V):

5

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Finish:

MATTE TIN

Terminal Form:

Terminal Pitch:

1.27 mm

Terminal Position:

DUAL

Maximum Time At Peak Reflow Temperature (s):

30

Trigger Type:

HIGH LEVEL

Width:

3.9 mm

Trade Compliance

NLV14043BDR2G Logic ICs trade compliance attributes, and parameters.

HTS

8542.39.00.01

SB

8542.39.00.00

PCN

Manufacturer Highlights

Onsemi

Established in 1999, Onsemi is a leading global provider of power and image-sensing technologies. They are dedicated to building a better future for the automotive, industrial, cloud, medical, and IoT markets. Onsemi's core technologies include analog, digital, and mixed-signal products that offer innovative solutions for advanced automotive systems; highly reliable power management products for industrial applications; low-cost imaging solutions for medical equipment and consumer electronics; and robust communication architectures for the Internet of Things (IoT).

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Management team

President, CEO

Hassane El-Khoury

Executive VP, CFO, Treasurer

Thad Trent

Senior VP

Ross F. Jatou

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

Aizu Fab

Fabrication

Fab Initiation

1995

Japan

Aizu Wakamatsu

Wafer Capacity

52,000

1995

52,000

Si/EPI Fab

Fabrication

Fab Initiation

2018

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

10,000

2018

10,000

Expansion Phase 1 for SiC / EPI

Fabrication

Fab Initiation

2019

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

14,500

2019

14,500

Expansion Phase 2 for SiC / EPI

Fabrication

Fab Initiation

2024

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

2024

SiC Fab

Fabrication

Fab Initiation

2022

USA

Hudson

Wafer Capacity

2022

Bucheon

Fabrication

Fab Initiation

2013

South Korea

Bucheon

Wafer Capacity

61,000

2013

61,000

ISMF - Malaysia

Fabrication

Fab Initiation

1990

Malaysia

Seremban

Wafer Capacity

95,000

1990

95,000

Roznov Device Fab

Fabrication

Fab Initiation

1987

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

80,000

1987

80,000

Fab 10

Fabrication

Fab Initiation

2002

USA

East Fishkill

Wafer Capacity

15,000

2002

15,000

Burlington

Fabrication

Fab Initiation

1986

Canada

Burlington

Wafer Capacity

1986

Gresham

Fabrication

Fab Initiation

1998

USA

Gresham

Wafer Capacity

45,000

1998

45,000

Bucheon 150mm

Fabrication

Fab Initiation

2000

South Korea

Bucheon

Wafer Capacity

50,000

2000

50,000

Rochester

Fabrication

Fab Initiation

1983

USA

Rochester

Wafer Capacity

10,000

1983

10,000

Nampa

Fabrication

Fab Initiation

1995

USA

Nampa

Wafer Capacity

1995

Pennsylvania

Fabrication

Fab Initiation

1997

USA

Mountain Top

Wafer Capacity

36,000

1997

36,000

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