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NLV14174BDR2G

Onsemi

NLV14174BDR2G by Onsemi

NLV14174BDR2G by Onsemi is a 6-bit latch with 400ns propagation delay. Operating at -55 to 125 °C, it has a supply voltage range of 3-18V and can handle load capacitance of 50pF. Ideal for military applications due to AEC-Q100 screening level.

Median Price

$0.530

Lifecycle Status

Suppliers In-Stock

5

In-Stock Inventory

1k+

Distributors (Authorized)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Mouser Electronics

USA . 2,500 parts In-Stock

1+ parts

$0.530

100+ parts

$0.289

1k+ parts

$0.249

10k+ parts

$0.248

2,500

$0.530

$0.289

$0.249

$0.248

DigiKey

USA . 2,471 parts In-Stock

1+ parts

$0.530

100+ parts

$0.289

1k+ parts

$0.248

10k+ parts

$0.228

2,471

$0.530

$0.289

$0.248

$0.228

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Digiode

USA . 1,443 parts In-Stock

1+ parts

$1.036

100+ parts

-

1k+ parts

-

10k+ parts

-

1,443

$1.036

-

-

-

Vyrian

USA . 2,071 parts In-Stock

1+ parts

$1.090

100+ parts

-

1k+ parts

-

10k+ parts

-

2,071

$1.090

-

-

-

Flip Electronics

USA . 5,000 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

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5,000

-

-

-

-

Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Vigor

Singapore . 555 parts In-Stock

1+ parts

$0.300

100+ parts

-

1k+ parts

-

10k+ parts

-

555

$0.300

-

-

-

Corphita

USA . 377 parts In-Stock

1+ parts

$0.981

100+ parts

-

1k+ parts

-

10k+ parts

-

377

$0.981

-

-

-

Corohmni

South Africa . 373 parts In-Stock

1+ parts

$1.090

100+ parts

-

1k+ parts

-

10k+ parts

-

373

$1.090

-

-

-

TANS Electronics

Latvia . 3,857 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

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3,857

-

-

-

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Kulean Microsystems

USA . 3,732 parts In-Stock

1+ parts

-

100+ parts

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1k+ parts

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10k+ parts

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3,732

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-

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SupplyDigital Components

Austria . 1,903 parts In-Stock

1+ parts

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100+ parts

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1k+ parts

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10k+ parts

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1,903

-

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Problanco Electronics

Mexico . 675 parts In-Stock

1+ parts

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100+ parts

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1k+ parts

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10k+ parts

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675

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UHIMA Technologies

Türkiye . 110 parts In-Stock

1+ parts

-

100+ parts

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1k+ parts

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10k+ parts

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110

-

-

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Overview

Enhance your electronic designs with the NLV14174BDR2G by Onsemi. As a leading manufacturer in the industry, Onsemi delivers top-quality latches & flip-flops that are ideal for a wide range of applications. With a focus on reliability and performance, this product offers customers unmatched value and benefits. Whether you are working on automotive, industrial, or consumer electronics projects, the NLV14174BDR2G provides the perfect solution with its high-quality construction and advanced technology. Upgrade your designs today with Onsemi's exceptional components.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

Provides durability and resistance to external elements, ensuring long-term reliability of the product.

Surface Mount: YES

Allows for easy and convenient installation on a PCB, reducing assembly time and effort.

Screening Level: AEC-Q100

Indicates that the product meets automotive industry standards for reliability and quality.

Package Shape: RECTANGULAR

Enables space-efficient placement on the PCB, maximizing layout flexibility.

Nominal Supply Voltage / Vsup (V): 5

Operates at a commonly available supply voltage, making it compatible with a wide range of systems.

Load Capacitance (CL): 50 pF

Suitable for driving low capacitance loads, ensuring efficient signal propagation.

Power Supplies (V): 5/15

Offers flexibility in power supply options, allowing compatibility with different voltage requirements.

No. of Terminals: 16

Sufficient number of terminals for proper connectivity and signal transmission within the circuit.

Package Style (Meter): SMALL OUTLINE

Compact form factor saves space on the PCB, ideal for designs with limited real estate.

Propagation Delay (tpd): 400 ns

Fast signal propagation ensures efficient operation and minimizes delays in the system.

Maximum Operating Temperature: 125 °C

Can operate reliably in high-temperature environments, suitable for a variety of applications.

Trigger Type: POSITIVE EDGE

Utilizes positive edge triggering for accurate and precise signal processing.

Minimum Operating Temperature: -55 °C

Capable of functioning in extreme cold conditions, expanding the range of potential applications.

Terminal Finish: MATTE TIN

Provides a reliable and corrosion-resistant finish for the terminals, ensuring long-term performance.

Terminal Position: DUAL

Dual terminal positioning allows for enhanced stability and connectivity in the circuit.

Maximum Seated Height: 1.75 mm

Low profile design enables compact PCB layout and integration in space-constrained environments.

Width: 3.9 mm

Narrow width facilitates efficient placement and routing on the PCB, optimizing space utilization.

Output Polarity: TRUE

True output polarity ensures accurate signal processing and compatibility with standard logic levels.

Minimum Supply Voltage (Vsup): 3 V

Wide operating voltage range accommodates various voltage levels, enhancing versatility.

Maximum Time At Peak Reflow Temperature (s): 30

Capable of withstanding peak reflow temperatures for a specified duration, ensuring reliable soldering.

Peak Reflow Temperature °C: 260

Can withstand high reflow temperatures during the assembly process without compromising performance.

Length: 9.9 mm

Optimal length for easy integration and placement on the PCB, facilitating efficient assembly.

Temperature Grade: MILITARY

Meets stringent military-grade specifications for durability, reliability, and performance in harsh environments.

Maximum Frequency At Nominal Supply: 2000000 Hz

High operating frequency capability enables fast and responsive signal processing for demanding applications.

Technology: CMOS

Utilizes CMOS technology for low power consumption, high noise immunity, and reliable operation.

Terminal Form: GULL WING

Gull wing terminal design offers secure solder joints and easy integration during assembly.

Packing Method: TR

Designed for tape and reel packaging, facilitating automated assembly processes for high-volume production.

Terminal Pitch: 1.27 mm

Optimal terminal pitch for easy soldering and reliable electrical connections on the PCB.

Maximum Supply Voltage (Vsup): 18 V

Supports a wide range of supply voltages, providing flexibility and compatibility with various power sources.

Technical Specifications

Latches & Flip-Flops NLV14174BDR2G attributes and parameters. Explore more Latches & Flip-Flops devices from Onsemi

Specs

Family:

4000/14000/40000

JESD-30 Code:

R-PDSO-G16

JESD-609 Code:

e3

Length:

9.9 mm

Load Capacitance (CL):

50 pF

Logic IC Type:

Maximum Frequency At Nominal Supply:

2000000 Hz

Moisture Sensitivity Level (MSL):

1

No. of Bits:

6

No. of Functions:

1

No. of Terminals:

16

Maximum Operating Temperature:

125 Cel

Minimum Operating Temperature:

-55 Cel

Output Polarity:

TRUE

Package Body Material:

PLASTIC/EPOXY

Package Code:

SOP

Package Equivalence Code:

SOP16,.25

Package Shape:

Package Style (Meter):

SMALL OUTLINE

Packing Method:

TR

Peak Reflow Temperature (C):

260

Power Supplies (V):

5/15

Propagation Delay (tpd):

400 ns

Qualification:

Not Qualified

Screening Level:

AEC-Q100

Maximum Seated Height:

1.75 mm

Sub-Category:

FF/Latches

Maximum Supply Voltage (Vsup):

18 V

Minimum Supply Voltage (Vsup):

3 V

Nominal Supply Voltage / Vsup (V):

5

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Finish:

MATTE TIN

Terminal Form:

Terminal Pitch:

1.27 mm

Terminal Position:

DUAL

Maximum Time At Peak Reflow Temperature (s):

30

Trigger Type:

POSITIVE EDGE

Width:

3.9 mm

Trade Compliance

NLV14174BDR2G Logic ICs trade compliance attributes, and parameters.

HTS

8542.39.00.01

SB

8542.39.00.00

PCN

Manufacturer Highlights

Onsemi

Established in 1999, Onsemi is a leading global provider of power and image-sensing technologies. They are dedicated to building a better future for the automotive, industrial, cloud, medical, and IoT markets. Onsemi's core technologies include analog, digital, and mixed-signal products that offer innovative solutions for advanced automotive systems; highly reliable power management products for industrial applications; low-cost imaging solutions for medical equipment and consumer electronics; and robust communication architectures for the Internet of Things (IoT).

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Management team

President, CEO

Hassane El-Khoury

Executive VP, CFO, Treasurer

Thad Trent

Senior VP

Ross F. Jatou

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

Aizu Fab

Fabrication

Fab Initiation

1995

Japan

Aizu Wakamatsu

Wafer Capacity

52,000

1995

52,000

Si/EPI Fab

Fabrication

Fab Initiation

2018

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

10,000

2018

10,000

Expansion Phase 1 for SiC / EPI

Fabrication

Fab Initiation

2019

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

14,500

2019

14,500

Expansion Phase 2 for SiC / EPI

Fabrication

Fab Initiation

2024

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

2024

SiC Fab

Fabrication

Fab Initiation

2022

USA

Hudson

Wafer Capacity

2022

Bucheon

Fabrication

Fab Initiation

2013

South Korea

Bucheon

Wafer Capacity

61,000

2013

61,000

ISMF - Malaysia

Fabrication

Fab Initiation

1990

Malaysia

Seremban

Wafer Capacity

95,000

1990

95,000

Roznov Device Fab

Fabrication

Fab Initiation

1987

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

80,000

1987

80,000

Fab 10

Fabrication

Fab Initiation

2002

USA

East Fishkill

Wafer Capacity

15,000

2002

15,000

Burlington

Fabrication

Fab Initiation

1986

Canada

Burlington

Wafer Capacity

1986

Gresham

Fabrication

Fab Initiation

1998

USA

Gresham

Wafer Capacity

45,000

1998

45,000

Bucheon 150mm

Fabrication

Fab Initiation

2000

South Korea

Bucheon

Wafer Capacity

50,000

2000

50,000

Rochester

Fabrication

Fab Initiation

1983

USA

Rochester

Wafer Capacity

10,000

1983

10,000

Nampa

Fabrication

Fab Initiation

1995

USA

Nampa

Wafer Capacity

1995

Pennsylvania

Fabrication

Fab Initiation

1997

USA

Mountain Top

Wafer Capacity

36,000

1997

36,000

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