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NLV18SZ74USG

Onsemi

NLV18SZ74USG by Onsemi

NLV18SZ74USG by Onsemi is a CMOS latch with 7.5ns propagation delay, suitable for military applications. It operates at 3.3V with 50pF load capacitance and has a max frequency of 250MHz. This flip-flop features positive edge trigger, AEC-Q100 screening, and small outline packaging for high-speed operations in harsh environments.

Median Price

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Lifecycle Status

Suppliers In-Stock

2

In-Stock Inventory

1k+

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Vyrian

USA . 7,260 parts In-Stock

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Digiode

USA . 297 parts In-Stock

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Vigor

Singapore . 465 parts In-Stock

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$0.210

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AZTECH Wire

Italy . 828 parts In-Stock

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$13.340

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Kulean Microsystems

USA . 8,012 parts In-Stock

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TANS Electronics

Latvia . 6,112 parts In-Stock

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SupplyDigital Components

Austria . 5,060 parts In-Stock

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UHIMA Technologies

Türkiye . 691 parts In-Stock

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Problanco Electronics

Mexico . 515 parts In-Stock

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Corohmni

South Africa . 359 parts In-Stock

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Microchip USA

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Corphita

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Overview

Discover the cutting-edge NLV18SZ74USG by Onsemi, a top-tier manufacturer known for delivering high-quality latches & flip-flops. This versatile component offers lightning-fast 7.5 ns propagation delay, making it ideal for a wide range of applications. With a nominal supply voltage of 3.3V and AEC-Q100 screening level, this product ensures reliability and performance. Elevate your projects with the NLV18SZ74USG, providing exceptional value, efficiency, and precision to meet all your design needs.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

Plastic/Epoxy material provides durability and protection to the internal components of the latch, ensuring a longer lifespan.

Propagation Delay At Nominal Supply: 7.5 ns

Low propagation delay ensures fast response time, making this latch suitable for high-speed applications.

Surface Mount: YES

Surface mount capability allows for easy and convenient installation on circuit boards, saving space and simplifying assembly processes.

Screening Level: AEC-Q100

AEC-Q100 certification ensures high quality and reliability, making this latch suitable for automotive applications where robustness is essential.

Nominal Supply Voltage / Vsup (V): 3.3

Operates at a common voltage level of 3.3V, making it compatible with a wide range of systems and devices.

Maximum Frequency At Nominal Supply: 175000000 Hz

High maximum frequency allows for efficient operation in high-speed applications, ensuring reliable performance.

Technology: CMOS

CMOS technology offers low power consumption and high noise immunity, making this latch energy-efficient and reliable in noisy environments.

Technical Specifications

Latches & Flip-Flops NLV18SZ74USG attributes and parameters. Explore more Latches & Flip-Flops devices from Onsemi

Specs

Family:

LVC/LCX/Z

JESD-30 Code:

R-PDSO-G8

JESD-609 Code:

e4

Length:

2.3 mm

Load Capacitance (CL):

50 pF

Logic IC Type:

Maximum Frequency At Nominal Supply:

175000000 Hz

Maximum I (ol):

24 Amp

Moisture Sensitivity Level (MSL):

1

No. of Bits:

1

No. of Functions:

1

No. of Terminals:

8

Maximum Operating Temperature:

125 Cel

Minimum Operating Temperature:

-55 Cel

Output Polarity:

COMPLEMENTARY

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Equivalence Code:

TSSOP8,.12,20

Package Shape:

Package Style (Meter):

SMALL OUTLINE, VERY THIN PROFILE, SHRINK PITCH

Packing Method:

TR

Peak Reflow Temperature (C):

260

Maximum Power Supply Current (ICC):

.01 mA

Propagation Delay At Nominal Supply:

7.5 ns

Propagation Delay (tpd):

14.5 ns

Screening Level:

AEC-Q100

Maximum Seated Height:

.9 mm

Maximum Supply Voltage (Vsup):

5.5 V

Minimum Supply Voltage (Vsup):

1.65 V

Nominal Supply Voltage / Vsup (V):

3.3

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Finish:

NICKEL PALLADIUM GOLD SILVER

Terminal Form:

Terminal Pitch:

.5 mm

Terminal Position:

DUAL

Maximum Time At Peak Reflow Temperature (s):

30

Trigger Type:

POSITIVE EDGE

Width:

2 mm

Minimum fmax:

250 MHz

Trade Compliance

NLV18SZ74USG Logic ICs trade compliance attributes, and parameters.

HTS

8542.39.00.01

SB

8542.39.00.00

PCN

Manufacturer Highlights

Onsemi

Established in 1999, Onsemi is a leading global provider of power and image-sensing technologies. They are dedicated to building a better future for the automotive, industrial, cloud, medical, and IoT markets. Onsemi's core technologies include analog, digital, and mixed-signal products that offer innovative solutions for advanced automotive systems; highly reliable power management products for industrial applications; low-cost imaging solutions for medical equipment and consumer electronics; and robust communication architectures for the Internet of Things (IoT).

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Management team

President, CEO

Hassane El-Khoury

Executive VP, CFO, Treasurer

Thad Trent

Senior VP

Ross F. Jatou

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

Aizu Fab

Fabrication

Fab Initiation

1995

Japan

Aizu Wakamatsu

Wafer Capacity

52,000

1995

52,000

Si/EPI Fab

Fabrication

Fab Initiation

2018

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

10,000

2018

10,000

Expansion Phase 1 for SiC / EPI

Fabrication

Fab Initiation

2019

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

14,500

2019

14,500

Expansion Phase 2 for SiC / EPI

Fabrication

Fab Initiation

2024

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

2024

SiC Fab

Fabrication

Fab Initiation

2022

USA

Hudson

Wafer Capacity

2022

Bucheon

Fabrication

Fab Initiation

2013

South Korea

Bucheon

Wafer Capacity

61,000

2013

61,000

ISMF - Malaysia

Fabrication

Fab Initiation

1990

Malaysia

Seremban

Wafer Capacity

95,000

1990

95,000

Roznov Device Fab

Fabrication

Fab Initiation

1987

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

80,000

1987

80,000

Fab 10

Fabrication

Fab Initiation

2002

USA

East Fishkill

Wafer Capacity

15,000

2002

15,000

Burlington

Fabrication

Fab Initiation

1986

Canada

Burlington

Wafer Capacity

1986

Gresham

Fabrication

Fab Initiation

1998

USA

Gresham

Wafer Capacity

45,000

1998

45,000

Bucheon 150mm

Fabrication

Fab Initiation

2000

South Korea

Bucheon

Wafer Capacity

50,000

2000

50,000

Rochester

Fabrication

Fab Initiation

1983

USA

Rochester

Wafer Capacity

10,000

1983

10,000

Nampa

Fabrication

Fab Initiation

1995

USA

Nampa

Wafer Capacity

1995

Pennsylvania

Fabrication

Fab Initiation

1997

USA

Mountain Top

Wafer Capacity

36,000

1997

36,000

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