Active filters amplify desired signals while rejecting unwanted frequencies, and can be tailored to meet application-specific requirements in electronics.
Amplifiers boost signal strength, match impedance levels, and are essential in many circuit systems, including audio, broadcasting, and telecommunications.
Batteries store and provide electrical energy, come in various types and sizes for multiple uses, rechargeable or single-use.
Capacitors store electrical charge with metallic plates and a dielectric; types vary and can be combined for specific circuit characteristics.
Chip carriers and sockets provide an interface between components and PCBs, enabling easy replacement or upgrading without soldering.
Circuit protection devices prevent damage from overcurrent flow, including fuses, breakers, surge protectors, and voltage regulators.
Connector accessories and support devices aid connector function and longevity, including backshells, grips, clamps, and ties; must be compatible with connector type.
Connectors join electronic circuits to transfer signals and power, come in various sizes and shapes, and include support accessories.
Converters transform DC input to another voltage level, essential in electronic systems, renewable energy, and automotive electronics.
Crystals and resonators generate and stabilize frequency signals via piezoelectricity. They are used in timing, frequency control, and filters. Crystals are quartz and resonators are ceramic with a built-in capacitor.
Semiconductor diodes control current flow in one direction (uni-directionality) via low resistance. Useful for rectification, voltage regulation, detection, and digital logic.
Discover essential electronic components for your devices, including CPU accelerators, system cache controllers, computer processors, motherboards, and graphics computing systems. Enhance device performance and connectivity with reliable components engineered for seamless integration and optimal functionality.
Fiber optics use light pulses to transmit data over long distances. They have superior bandwidth capacity, low signal attenuation, and secure physical properties. They are essential in telecommunications networks today.
Filters enhance signal processing by selectively passing desired frequencies while suppressing unwanted ones. Filters can be passive (using capacitors, resistors, and inductors) or active (using transistors or amplifiers).
Flash devices are non-volatile storage solutions that offer fast read and write speeds, making them ideal for applications requiring high-speed data transfer. These devices utilize flash memory technology, providing reliable storage for data-intensive tasks such as gaming, multimedia, and enterprise-level applications.
General purpose ICs consist of multiple individual circuits or components (e.g., logic gates, amplifiers, oscillators, etc.) that are combined onto a single integrated circuit chip for a smaller physical footprint.
I/O and storage controllers are crucial components in computer systems, managing input/output operations and storage devices. These controllers facilitate efficient data transfer between peripherals, storage drives, and the central processing unit (CPU), enhancing system performance and enabling seamless connectivity.
Inductors store energy in magnetic fields, oppose sudden changes in current flow and prevent electrical surges. Common inductor applications include power supplies, signal filters, and oscillators.
Interface ICs allow efficient device connectivity with high-speed data transfer and low power consumption.They can be ASIC or FPGA types, and may perform additional functions such as sensing, storage, and conversion.
Logic ICs can be used for storage, memory, amplification, and multiplexing. They perform fundamental logical operations on digital input signals (1, 0, H, L) to generate a corresponding digital output signal.
Memory modules are essential components in electronic devices, storing data temporarily or permanently for processing and retrieval. From volatile RAM (Random Access Memory) to non-volatile ROM (Read-Only Memory), memory technologies vary in speed, capacity, and functionality, catering to diverse application requirements.
Memory ICs store digital data and retain the information even when the power is turned off. They come in various types, like RAM (Random Access Memory) for fast data access, and ROM (Read-Only Memory) for permanent data storage.
Miscellaneous semiconductor components are a diverse category of electronic components that combines elements from a mix of component devices.
Optoelectronic devices interact with light. This family of devices can emit light, detect light, generate current, and transmit light signals for long-distance communication.
Oscillators generate repetitive waveforms, such as sine, square, or triangle waves. They are commonly used to produce stable and precise frequencies for applications like clocks, signal generation, and communication systems.
Other Function Semiconductor components are a diverse category of semiconductor components that perform a range of specialized functions.
Passive component networks operate without a power source and support data transmission within system by performing filtering, energy storage, and/or signal coupling functions.
Peripheral ICs (Integrated Circuits) are designed to control and manage the peripheral devices connected to a computer or other electronic device.
Programmable Logic ICs are user-programmable devices that allow designers to create custom logic circuits. These cost saving ICs offer real-time data processing and maximum design flexibilty.
RF (Radio Frequency) and microwave devices are used in telecommunications, wireless communications, and electronic systems. These devices include amplifiers, attenuators, filters, mixers, oscillators, and antennas, and a host of other components.
Voltage regulators are used to ensure a constant output voltage despite power fluctuations and load changes. Linear and switching regulators are common types used to maintain voltage stability.
Relays are electromagnetic switches that are used to control the flow of electrical current in an electrical circuit. Relays are a safe means of providing isolation between a controlling circuit and a controlled circuit.
Resistors control the flow of electrical current in a circuit by introducing a set resistance. These passive components reduce current flow, adjust signal levels, and bias active elements in circuits.
Transducers convert energy from one form to another and are crucial in sensing, audio and control systems. They transform physical measures like temperature, pressure, or sound into electrical signals for circuits.
Storage drives are hardware devices used to store and retrieve digital data in computers and electronic devices. These drives come in various forms, including hard disk drives (HDDs), solid-state drives (SSDs), and hybrid drives, offering different levels of capacity, speed, and durability to suit specific storage needs.
Storage media encompass physical or digital mediums used for storing and preserving digital data. From optical discs and magnetic tapes to USB flash drives and memory cards, storage media come in diverse formats and capacities, offering flexibility and reliability for data storage and archival purposes.
Storage systems comprise hardware and software components designed to manage and store digital data efficiently. These systems range from simple standalone devices to complex network-attached storage (NAS) and storage area network (SAN) solutions, providing scalable storage capacity and data protection features for businesses and enterprises.
Switches control electrical current flow by making or breaking connections. These devices vary in design and application, from basic on/off switches to complex industrial automation systems.
Telecom integrated circuits (ICs) are specialized electronics for telecommunications, tailored to high data rates, low power use, and reliable long-distance transmission. These devices include amplifiers, filters, ADCs, DACs, and more-- and they are often integrated on one chip for specific telecom tasks.
Terminal blocks, or connection terminals, are modular blocks that bring together multiple electrical wires at one connection point. They offer a reliable, organized way to terminate cables.
Thermal management devices control heat in electronic systems, preventing overheating and ensuring optimal performance and reliability. Examples include heat sinks, fans, and thermal interface materials that dissipate or transfer heat away from components.
Transformers are devices that alter electrical voltage levels between circuits through electromagnetic induction. They are vital in power distribution, converting high-voltage electricity for transmission and lower voltage for safe usage.
Transistors are 3-layer semiconductor devices that regulate the flow of electrical current. They function as amplifiers, boosting weak signals, and as switches, controlling the flow of current between terminals.
Triggering devices initiate electronic processes or events in response to specific conditions. These devices support many automated tasks such as activating switches and signals, or turning on lights when motion is detected.
Video cards, also known as graphics cards or GPU (Graphics Processing Unit), are essential components in computers, responsible for rendering graphics and images on display devices. These cards feature dedicated processors and memory, delivering smooth and immersive visual experiences for gaming, multimedia, and professional applications.
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NLV14076BDR2G by Onsemi is a 4-bit latch with 600 ns propagation delay, operating at -55 to 125 °C. It has a supply voltage of 5V, load capacitance of 50 pF, and supports up to 1800000 Hz frequency. Ideal for military-grade applications requiring positive edge triggering in small outline packages.
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Plastic/Epoxy material provides durability and protection for the internal components of the latch or flip-flop.
Surface mount capability allows for easy and efficient installation on circuit boards, saving space and reducing assembly time.
AEC-Q100 screening ensures high reliability and quality standards, making this product suitable for automotive applications.
4-bit configuration allows for higher data processing capabilities and flexibility in controlling outputs.
Operates at a standard supply voltage of 5V, making it compatible with a wide range of electronic systems.
50 pF load capacitance helps in stabilizing the circuit and ensuring proper signal transmission.
Supports multiple power supply options, allowing for versatile use in different voltage environments.
16 terminals offer ample connectivity options and enable complex circuit configurations.
Small outline package style saves space on the PCB and enhances overall system design flexibility.
Low propagation delay of 600 ns ensures fast response time and efficient data processing.
High maximum operating temperature of 125 °C allows for reliable performance in harsh environmental conditions.
3-state output allows for tri-state logic, enabling multiple devices to share a common bus without interference.
Positive edge trigger ensures precise timing control and eliminates the risk of data loss during transitions.
Low minimum operating temperature of -55 °C guarantees functionality in extreme cold environments.
Matte tin finish provides good solderability and ensures strong electrical connections for enhanced reliability.
Dual terminal position offers increased flexibility in PCB layout and facilitates efficient signal routing.
Low maximum seated height of 1.75 mm reduces the overall profile of the device and enables compact design solutions.
Compact width of 3.9 mm allows for tight spacing between components on the PCB, optimizing board real estate.
True output polarity ensures accurate logic levels are maintained for reliable data processing and communication.
Low minimum supply voltage of 3V enables energy-efficient operation and supports a wide range of power sources.
Withstands peak reflow temperatures for up to 30 seconds, ensuring proper soldering and assembly during manufacturing.
High peak reflow temperature of 260 °C ensures reliable soldering connections and prevents component damage.
Moderate length of 9.9 mm provides a balanced form factor that fits well within standard PCB layouts.
Military-grade temperature rating guarantees robust performance in demanding operating conditions and harsh environments.
High maximum frequency of 1.8 MHz at nominal supply voltage ensures fast data processing and real-time operation.
CMOS technology offers low power consumption, high noise immunity, and compatibility with a wide range of applications.
Gull wing terminal form provides secure mechanical support and facilitates easy soldering during assembly.
TR packing method ensures safe transportation and handling of the product, protecting it from damage or contamination.
1.27 mm terminal pitch allows for precise alignment and soldering on the PCB, ensuring reliable electrical connections.
High maximum supply voltage of 18V provides headroom for voltage fluctuations and compatibility with diverse power sources.
Latches & Flip-Flops NLV14076BDR2G attributes and parameters. Explore more Latches & Flip-Flops devices from Onsemi
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NLV14076BDR2G Logic ICs trade compliance attributes, and parameters.
HTS
8542.39.00.01
SB
8542.39.00.00
PCN Assembly/Origin - SOIC14,16 LF 19/Sep/2023
Established in 1999, Onsemi is a leading global provider of power and image-sensing technologies. They are dedicated to building a better future for the automotive, industrial, cloud, medical, and IoT markets. Onsemi's core technologies include analog, digital, and mixed-signal products that offer innovative solutions for advanced automotive systems; highly reliable power management products for industrial applications; low-cost imaging solutions for medical equipment and consumer electronics; and robust communication architectures for the Internet of Things (IoT).
President, CEO
Hassane El-Khoury
Executive VP, CFO, Treasurer
Thad Trent
Senior VP
Ross F. Jatou
Aizu Fab
Fabrication
Fab Initiation
1995
Japan
Aizu Wakamatsu
Wafer Capacity
52,000
Si/EPI Fab
2018
Czech Republic
Rožnov pod Radhoštěm
10,000
Expansion Phase 1 for SiC / EPI
2019
14,500
Expansion Phase 2 for SiC / EPI
2024
SiC Fab
2022
USA
Hudson
Bucheon
2013
South Korea
61,000
ISMF - Malaysia
1990
Malaysia
Seremban
95,000
Roznov Device Fab
1987
80,000
Fab 10
2002
East Fishkill
15,000
Burlington
1986
Canada
Gresham
1998
45,000
Bucheon 150mm
2000
50,000
1983
Nampa
Pennsylvania
1997
Mountain Top
36,000
2N2222A
Baneasa S A
NPN; Configuration: SINGLE; Surface Mount: NO; Nominal Transition Frequency (fT): 250 MHz; Maximum Collector Current (IC): .8 A; Qualification: Not Qualified;
LM358M
Onsemi
OPERATIONAL AMPLIFIER; Temperature Grade: COMMERCIAL; Terminal Form: GULL WING; No. of Terminals: 8; Package Code: SOP; Package Shape: RECTANGULAR;
LM107H/883
Rochester Electronics
OPERATIONAL AMPLIFIER; Temperature Grade: MILITARY; Terminal Form: WIRE; No. of Terminals: 8; Package Shape: ROUND; Maximum Average Bias Current (IIB): .1 uA;
SS14
Forward International Electronics
RECTIFIER DIODE; Surface Mount: YES; Maximum Operating Temperature: 150 Cel; No. of Elements: 1; No. of Phases: 1; Maximum Output Current: 1 A;
LL4148-GS08
Vishay Intertechnology
The Vishay Intertechnology LL4148-GS08 is a glass diode with fast recovery time of 0.008 us and max reverse current of 5 uA. Ideal for applications requiring rectification, it has a breakdown voltage of 100 V and can handle a peak forward current of 2 A.
FDN5618P
Fairchild Semiconductor
P-CHANNEL; Configuration: SINGLE WITH BUILT-IN DIODE; Surface Mount: YES; Maximum Power Dissipation (Abs): .5 W; Transistor Element Material: SILICON; Moisture Sensitivity Level (MSL): 1;
2N7002
Taitron Components
N-CHANNEL; Configuration: SINGLE WITH BUILT-IN DIODE; Surface Mount: YES; Operating Mode: ENHANCEMENT MODE; Minimum DS Breakdown Voltage: 60 V; Package Shape: RECTANGULAR;
Bytesonic Electronics
N-CHANNEL; Configuration: SINGLE WITH BUILT-IN DIODE; Surface Mount: YES; Maximum Power Dissipation (Abs): .225 W; Terminal Position: DUAL; Minimum Operating Temperature: -55 Cel;
ISO1050DUBR
Texas Instruments
ISO1050DUBR by Texas Instruments is a network interface IC with 8 terminals, operating from -55 to 105°C. It features a small outline package, nickel palladium gold finish, and gull wing terminal form. Ideal for telecom applications requiring a 5V supply voltage and peak reflow temperature of 260°C.
Vishay Siliconix
N-CHANNEL; Configuration: SINGLE; Surface Mount: YES; No. of Elements: 1; Terminal Form: GULL WING; Qualification: Not Qualified;
1N4148
ROHM
RECTIFIER DIODE; Terminal Position: AXIAL; Terminal Form: WIRE; No. of Terminals: 2; Surface Mount: NO; Package Shape: ROUND;
Eic Semiconductor
RECTIFIER DIODE; Terminal Position: DUAL; Terminal Form: C BEND; No. of Terminals: 2; Surface Mount: YES; Package Shape: RECTANGULAR;
Cobham Plc
NPN; Configuration: SINGLE; Surface Mount: NO; Maximum Collector Current (IC): .8 A; Minimum DC Current Gain (hFE): 100; Maximum Turn Off Time (toff): 300 ns;
Zowie Technology
RECTIFIER DIODE; Surface Mount: YES; No. of Phases: 1; Maximum Operating Temperature: 125 Cel; No. of Elements: 1; Maximum Non Repetitive Peak Forward Current: 30 A;
M39029/58-360
Fct Electronic
CONNECTOR ACCESSORY; IEC Conformity: NO; Alternate Contact Sources: MILITARY; MIL Conformity: YES; Contact Gender: MALE; MIL-Connector Accessory Name: CONTACT;
General Semiconductor
OPA2277UA/2K5E4
OPA2277UA/2K5E4 by Texas Instruments is a dual operational amplifier with low-offset and micropower features. It has a max input offset voltage of 100uV, nominal common mode reject ratio of 140dB, and min slew rate of 0.8V/us. Ideal for industrial applications requiring precise signal amplification in compact designs.
Micropac Industries
NPN; Configuration: SINGLE; Surface Mount: NO; Nominal Transition Frequency (fT): 300 MHz; Maximum Power Dissipation (Abs): .5 W; Maximum Collector Current (IC): .8 A;
Hi-tron Semiconductor
SMBJ18CA
Semtech
TRANS VOLTAGE SUPPRESSOR DIODE; Terminal Position: DUAL; Terminal Form: C BEND; No. of Terminals: 2; Surface Mount: YES; Package Shape: RECTANGULAR;
CD4013BE
Harris Semiconductor
D FLIP-FLOP; Temperature Grade: MILITARY; Terminal Form: THROUGH-HOLE; No. of Terminals: 14; Package Code: DIP; Package Shape: RECTANGULAR;
74HC174PW,118
Nexperia
D FLIP-FLOP; Temperature Grade: AUTOMOTIVE; Terminal Form: GULL WING; No. of Terminals: 16; Package Code: TSSOP; Package Shape: RECTANGULAR;
CD74HC74E
HEF4013BP
NXP Semiconductors
HEF4013BP by NXP Semiconductors is a CMOS latch with 2 functions, 220 ns propagation delay at 5V. It operates b/w -40 to 125°C and has a max frequency of 7MHz. Widely used in automotive applications due to its positive edge trigger and complementary output polarity.
CD4043BE
R-S LATCH; Temperature Grade: MILITARY; Terminal Form: THROUGH-HOLE; No. of Terminals: 16; Package Code: DIP; Package Shape: RECTANGULAR;
CD74HC73MTG4
CD74HC73MTG4 by Texas Instruments is a dual latches & flip-flops IC with 2 bits, operating at 4.5V nominal voltage and 240ns propagation delay. It is designed for military-grade applications, featuring negative edge trigger type, complementary output polarity, and a max frequency of 20MHz.
SN74LS273NS
SN74LS273NS by Texas Instruments is an 8-bit latch with a propagation delay of 27ns, ideal for applications requiring fast data storage. Operating b/w 0-70°C, it has a supply voltage range of 4.75-5.25V and supports a max frequency of 30MHz. This small outline package with gull wing terminals is suitable for commercial-grade TTL technology projects.
CD4013BPWRG4
CD4013BPWRG4 by Texas Instruments is a CMOS latches & flip-flops IC with 2 functions, 300ns propagation delay at 5V. It has a trigger type of positive edge and operates b/w -55 to 125°C. Ideal for applications requiring complementary output polarity and high frequency up to 3.5MHz in military-grade environments.
CD74AC174M
General Electric Solid State
D FLIP-FLOP; Temperature Grade: MILITARY; Terminal Form: GULL WING; No. of Terminals: 16; Package Code: SOP; Package Shape: RECTANGULAR;
74AC74SCX
D FLIP-FLOP; Temperature Grade: INDUSTRIAL; Terminal Form: GULL WING; No. of Terminals: 14; Package Code: SOP; Package Shape: RECTANGULAR;
SN74LS74ADR2
SN74LS74ADR2 by Onsemi is a TTL technology latches & flip-flops IC with 2 functions, 40 ns propagation delay, and 8 mA max power supply current. It operates at 5V with positive edge trigger for applications requiring fast data storage and retrieval in commercial-grade temperature environments.
74HCT74D,653
NXP Semiconductors' 74HCT74D,653 is a dual-function latch with 14 terminals and a supply voltage of 5V. It has a propagation delay of 53ns, operates b/w -40 to 125°C, and supports up to 18MHz frequency. Ideal for automotive applications due to its small outline package and positive edge trigger type.
SN74HC273DWG4
SN74HC273DWG4 by Texas Instruments is an 8-bit latch with a 5V supply voltage, 50pF load capacitance, and 200ns propagation delay. It is used in industrial applications for positive edge triggering, with a max frequency of 21MHz at nominal voltage.
74LVC2G74DP,125
D FLIP-FLOP; Temperature Grade: AUTOMOTIVE; Terminal Form: GULL WING; No. of Terminals: 8; Package Code: TSSOP; Package Shape: SQUARE;
74HC73D,653
74HC73D,653 by NXP Semiconductors is a dual-function latch with 2 bits and a supply voltage of 5V. It has a propagation delay of 240ns, operates in temperatures ranging from -40 to 125°C, and supports a max frequency of 20MHz. Ideal for automotive applications due to its small outline package and complementary output polarity.
74HC74D,652
D FLIP-FLOP; Temperature Grade: AUTOMOTIVE; Terminal Form: GULL WING; No. of Terminals: 14; Package Code: SOP; Package Shape: RECTANGULAR;
SN74AHC74NSRE4
SN74AHC74NSRE4 by Texas Instruments is a dual-function latch with 10.5 ns propagation delay at 3.3V, ideal for industrial applications. It features complementary output polarity, operates b/w -40 to 85°C, and supports a max frequency of 75 MHz. This small-outline package has 14 terminals and is surface-mountable for compact designs.
SN74LVC2G74DCUTG4
SN74LVC2G74DCUTG4 by Texas Instruments is a latches & flip-flops IC with 5.9ns propagation delay, 1.8V nominal voltage, and 32A max I (ol). It is used in automotive applications due to its small outline package and positive edge trigger type for high-speed operations.
74AUP1G79GV,125
NXP Semiconductors' 74AUP1G79GV,125 is a CMOS latch with 25.6 ns propagation delay and 30 pF load capacitance. It operates at supply voltages of 1.2V to 3.3V, making it suitable for automotive applications requiring fast signal switching in a compact form factor.
CD40175BE
D FLIP-FLOP; Temperature Grade: MILITARY; Terminal Form: THROUGH-HOLE; No. of Terminals: 16; Package Code: DIP; Package Shape: RECTANGULAR;
Partstack™ will investigate all reported instances of potential suspect/counterfeit part listings.
NLV17SZ74USG
NLV17SZ74USG by Onsemi is a CMOS latch with 8ns propagation delay, 32A max I (ol), and 250MHz min fmax. Ideal for military applications, it operates at -55 to 125 °C with AEC-Q100 screening level. It features 3-STATE output polarity and positive edge trigger type in a small outline package.
NLV14013BCPG
NLV14013BDG
D FLIP-FLOP; Temperature Grade: MILITARY; Terminal Form: GULL WING; No. of Terminals: 14; Package Code: SOP; Package Shape: RECTANGULAR;
NLV14013BDR2G
NLV14013BDTR2G
D FLIP-FLOP; Temperature Grade: MILITARY; Terminal Form: GULL WING; No. of Terminals: 14; Package Code: TSSOP; Package Shape: RECTANGULAR;
NLV14027BDG
J-K FLIP-FLOP; Temperature Grade: MILITARY; Terminal Form: GULL WING; No. of Terminals: 16; Package Code: SOP; Package Shape: RECTANGULAR;
NLV14027BDR2G
NLV14042BDG
D LATCH; Temperature Grade: MILITARY; Terminal Form: GULL WING; No. of Terminals: 16; Package Code: SOP; Package Shape: RECTANGULAR;
NLV14042BDR2G
NLV14043BDG
R-S LATCH; Temperature Grade: MILITARY; Terminal Form: GULL WING; No. of Terminals: 16; Package Code: SOP; Package Shape: RECTANGULAR;
NLV14043BDR2G
NLV14044BDG
NLV14044BDR2G
NLV14099BDWR2G
NLV14174BDR2G
NLV14175BDR2G
NLV17SZ74MQ1TCG
D FLIP-FLOP; Temperature Grade: MILITARY; Terminal Form: NO LEAD; No. of Terminals: 8; Package Code: VQCCN; Package Shape: SQUARE;
NLV18SZ74USG
D FLIP-FLOP; Temperature Grade: MILITARY; Terminal Form: GULL WING; No. of Terminals: 8; Package Code: VSSOP; Package Shape: RECTANGULAR;
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