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NLV14076BDR2G

Onsemi

NLV14076BDR2G by Onsemi

NLV14076BDR2G by Onsemi is a 4-bit latch with 600 ns propagation delay, operating at -55 to 125 °C. It has a supply voltage of 5V, load capacitance of 50 pF, and supports up to 1800000 Hz frequency. Ideal for military-grade applications requiring positive edge triggering in small outline packages.

Median Price

$0.453

Lifecycle Status

Suppliers In-Stock

7

In-Stock Inventory

1k+

Distributors (Authorized)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

DigiKey

USA . 2,495 parts In-Stock

1+ parts

$0.590

100+ parts

$0.328

1k+ parts

$0.285

10k+ parts

$0.261

2,495

$0.590

$0.328

$0.285

$0.261

Mouser Electronics

USA . 2,480 parts In-Stock

1+ parts

$0.590

100+ parts

$0.329

1k+ parts

$0.285

10k+ parts

$0.261

2,480

$0.590

$0.329

$0.285

$0.261

Rochester

USA . 2,368 parts In-Stock

1+ parts

-

100+ parts

$0.316

1k+ parts

$0.262

10k+ parts

$0.234

2,368

-

$0.316

$0.262

$0.234

Verical

USA . 2,368 parts In-Stock

1+ parts

-

100+ parts

-

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$0.292

2,368

-

-

-

$0.292

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Digiode

USA . 1,709 parts In-Stock

1+ parts

$0.245

100+ parts

-

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1,709

$0.245

-

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Vyrian

USA . 2,058 parts In-Stock

1+ parts

$0.258

100+ parts

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2,058

$0.258

-

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Flip Electronics

USA . 2,500 parts In-Stock

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2,500

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Distributors (Availability)

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Corphita

USA . 2,451 parts In-Stock

1+ parts

$0.232

100+ parts

-

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2,451

$0.232

-

-

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Corohmni

South Africa . 368 parts In-Stock

1+ parts

$0.258

100+ parts

-

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368

$0.258

-

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Vigor

Singapore . 230 parts In-Stock

1+ parts

$0.310

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230

$0.310

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QUARKTWIN TECHNOLOGY LTD

USA . 13,597 parts In-Stock

1+ parts

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13,597

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SupplyDigital Components

Austria . 7,918 parts In-Stock

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7,918

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iodParts Technologies Inc.

India . 5,000 parts In-Stock

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5,000

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Kulean Microsystems

USA . 2,837 parts In-Stock

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2,837

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Problanco Electronics

Mexico . 2,604 parts In-Stock

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TANS Electronics

Latvia . 2,349 parts In-Stock

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2,349

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UHIMA Technologies

Türkiye . 72 parts In-Stock

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72

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Overview

Discover the innovative NLV14076BDR2G by Onsemi, a top-of-the-line latches & flip-flops device designed to exceed expectations in various applications. Crafted with precision and expertise by Onsemi, this product offers unparalleled quality and reliability. Ideal for demanding environments, this small outline package boasts a nominal supply voltage of 5V and true output polarity, providing customers with exceptional performance and peace of mind. Elevate your projects with the NLV14076BDR2G and experience the superior value it brings to your designs.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

Plastic/Epoxy material provides durability and protection for the internal components of the latch or flip-flop.

Surface Mount: YES

Surface mount capability allows for easy and efficient installation on circuit boards, saving space and reducing assembly time.

Screening Level: AEC-Q100

AEC-Q100 screening ensures high reliability and quality standards, making this product suitable for automotive applications.

No. of Bits: 4

4-bit configuration allows for higher data processing capabilities and flexibility in controlling outputs.

Nominal Supply Voltage / Vsup (V): 5

Operates at a standard supply voltage of 5V, making it compatible with a wide range of electronic systems.

Load Capacitance (CL): 50 pF

50 pF load capacitance helps in stabilizing the circuit and ensuring proper signal transmission.

Power Supplies (V): 5/15

Supports multiple power supply options, allowing for versatile use in different voltage environments.

No. of Terminals: 16

16 terminals offer ample connectivity options and enable complex circuit configurations.

Package Style (Meter): SMALL OUTLINE

Small outline package style saves space on the PCB and enhances overall system design flexibility.

Propagation Delay (tpd): 600 ns

Low propagation delay of 600 ns ensures fast response time and efficient data processing.

Maximum Operating Temperature: 125 °C

High maximum operating temperature of 125 °C allows for reliable performance in harsh environmental conditions.

Output Characteristics: 3-STATE

3-state output allows for tri-state logic, enabling multiple devices to share a common bus without interference.

Trigger Type: POSITIVE EDGE

Positive edge trigger ensures precise timing control and eliminates the risk of data loss during transitions.

Minimum Operating Temperature: -55 °C

Low minimum operating temperature of -55 °C guarantees functionality in extreme cold environments.

Terminal Finish: MATTE TIN

Matte tin finish provides good solderability and ensures strong electrical connections for enhanced reliability.

Terminal Position: DUAL

Dual terminal position offers increased flexibility in PCB layout and facilitates efficient signal routing.

Maximum Seated Height: 1.75 mm

Low maximum seated height of 1.75 mm reduces the overall profile of the device and enables compact design solutions.

Width: 3.9 mm

Compact width of 3.9 mm allows for tight spacing between components on the PCB, optimizing board real estate.

Output Polarity: TRUE

True output polarity ensures accurate logic levels are maintained for reliable data processing and communication.

Minimum Supply Voltage (Vsup): 3 V

Low minimum supply voltage of 3V enables energy-efficient operation and supports a wide range of power sources.

Maximum Time At Peak Reflow Temperature (s): 30

Withstands peak reflow temperatures for up to 30 seconds, ensuring proper soldering and assembly during manufacturing.

Peak Reflow Temperature °C: 260

High peak reflow temperature of 260 °C ensures reliable soldering connections and prevents component damage.

Length: 9.9 mm

Moderate length of 9.9 mm provides a balanced form factor that fits well within standard PCB layouts.

Temperature Grade: MILITARY

Military-grade temperature rating guarantees robust performance in demanding operating conditions and harsh environments.

Maximum Frequency At Nominal Supply: 1800000 Hz

High maximum frequency of 1.8 MHz at nominal supply voltage ensures fast data processing and real-time operation.

Technology: CMOS

CMOS technology offers low power consumption, high noise immunity, and compatibility with a wide range of applications.

Terminal Form: GULL WING

Gull wing terminal form provides secure mechanical support and facilitates easy soldering during assembly.

Packing Method: TR

TR packing method ensures safe transportation and handling of the product, protecting it from damage or contamination.

Terminal Pitch: 1.27 mm

1.27 mm terminal pitch allows for precise alignment and soldering on the PCB, ensuring reliable electrical connections.

Maximum Supply Voltage (Vsup): 18 V

High maximum supply voltage of 18V provides headroom for voltage fluctuations and compatibility with diverse power sources.

Technical Specifications

Latches & Flip-Flops NLV14076BDR2G attributes and parameters. Explore more Latches & Flip-Flops devices from Onsemi

Specs

Family:

4000/14000/40000

JESD-30 Code:

R-PDSO-G16

JESD-609 Code:

e3

Length:

9.9 mm

Load Capacitance (CL):

50 pF

Logic IC Type:

Maximum Frequency At Nominal Supply:

1800000 Hz

Moisture Sensitivity Level (MSL):

1

No. of Bits:

4

No. of Functions:

1

No. of Terminals:

16

Maximum Operating Temperature:

125 Cel

Minimum Operating Temperature:

-55 Cel

Output Characteristics:

3-STATE

Output Polarity:

TRUE

Package Body Material:

PLASTIC/EPOXY

Package Code:

SOP

Package Equivalence Code:

SOP16,.25

Package Shape:

Package Style (Meter):

SMALL OUTLINE

Packing Method:

TR

Peak Reflow Temperature (C):

260

Power Supplies (V):

5/15

Propagation Delay (tpd):

600 ns

Qualification:

Not Qualified

Screening Level:

AEC-Q100

Maximum Seated Height:

1.75 mm

Sub-Category:

FF/Latches

Maximum Supply Voltage (Vsup):

18 V

Minimum Supply Voltage (Vsup):

3 V

Nominal Supply Voltage / Vsup (V):

5

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Finish:

MATTE TIN

Terminal Form:

Terminal Pitch:

1.27 mm

Terminal Position:

DUAL

Maximum Time At Peak Reflow Temperature (s):

30

Trigger Type:

POSITIVE EDGE

Width:

3.9 mm

Trade Compliance

NLV14076BDR2G Logic ICs trade compliance attributes, and parameters.

HTS

8542.39.00.01

SB

8542.39.00.00

PCN

Manufacturer Highlights

Onsemi

Established in 1999, Onsemi is a leading global provider of power and image-sensing technologies. They are dedicated to building a better future for the automotive, industrial, cloud, medical, and IoT markets. Onsemi's core technologies include analog, digital, and mixed-signal products that offer innovative solutions for advanced automotive systems; highly reliable power management products for industrial applications; low-cost imaging solutions for medical equipment and consumer electronics; and robust communication architectures for the Internet of Things (IoT).

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Management team

President, CEO

Hassane El-Khoury

Executive VP, CFO, Treasurer

Thad Trent

Senior VP

Ross F. Jatou

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

Aizu Fab

Fabrication

Fab Initiation

1995

Japan

Aizu Wakamatsu

Wafer Capacity

52,000

1995

52,000

Si/EPI Fab

Fabrication

Fab Initiation

2018

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

10,000

2018

10,000

Expansion Phase 1 for SiC / EPI

Fabrication

Fab Initiation

2019

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

14,500

2019

14,500

Expansion Phase 2 for SiC / EPI

Fabrication

Fab Initiation

2024

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

2024

SiC Fab

Fabrication

Fab Initiation

2022

USA

Hudson

Wafer Capacity

2022

Bucheon

Fabrication

Fab Initiation

2013

South Korea

Bucheon

Wafer Capacity

61,000

2013

61,000

ISMF - Malaysia

Fabrication

Fab Initiation

1990

Malaysia

Seremban

Wafer Capacity

95,000

1990

95,000

Roznov Device Fab

Fabrication

Fab Initiation

1987

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

80,000

1987

80,000

Fab 10

Fabrication

Fab Initiation

2002

USA

East Fishkill

Wafer Capacity

15,000

2002

15,000

Burlington

Fabrication

Fab Initiation

1986

Canada

Burlington

Wafer Capacity

1986

Gresham

Fabrication

Fab Initiation

1998

USA

Gresham

Wafer Capacity

45,000

1998

45,000

Bucheon 150mm

Fabrication

Fab Initiation

2000

South Korea

Bucheon

Wafer Capacity

50,000

2000

50,000

Rochester

Fabrication

Fab Initiation

1983

USA

Rochester

Wafer Capacity

10,000

1983

10,000

Nampa

Fabrication

Fab Initiation

1995

USA

Nampa

Wafer Capacity

1995

Pennsylvania

Fabrication

Fab Initiation

1997

USA

Mountain Top

Wafer Capacity

36,000

1997

36,000

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