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NLV14013BDG

Onsemi

NLV14013BDG by Onsemi

NLV14013BDG by Onsemi is a CMOS latch with 2 functions, 350 ns propagation delay at 5V. It has a small outline package and operates b/w -55 to 125 °C. Ideal for military applications requiring positive edge triggering and complementary output polarity.

Median Price

$0.252

Lifecycle Status

Suppliers In-Stock

3

In-Stock Inventory

1k+

Distributors (Authorized)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Rochester

USA . 615 parts In-Stock

1+ parts

-

100+ parts

$0.252

1k+ parts

$0.209

10k+ parts

$0.187

615

-

$0.252

$0.209

$0.187

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Digiode

USA . 2,255 parts In-Stock

1+ parts

$0.206

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2,255

$0.206

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Vyrian

USA . 11,355 parts In-Stock

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11,355

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Distributors (Availability)

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Corohmni

South Africa . 239 parts In-Stock

1+ parts

$0.164

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239

$0.164

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Corphita

USA . 1,992 parts In-Stock

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$0.195

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1,992

$0.195

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Vigor

Singapore . 201 parts In-Stock

1+ parts

$0.210

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201

$0.210

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AZTECH Wire

Italy . 99 parts In-Stock

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$12.450

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99

$12.450

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Advanced Electronics

New Zealand . 5,000 parts In-Stock

1+ parts

$17.082

100+ parts

$15.545

1k+ parts

$14.007

10k+ parts

-

5,000

$17.082

$15.545

$14.007

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QUARKTWIN TECHNOLOGY LTD

USA . 11,875 parts In-Stock

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11,875

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Problanco Electronics

Mexico . 6,854 parts In-Stock

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TANS Electronics

Latvia . 6,258 parts In-Stock

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Kulean Microsystems

USA . 5,348 parts In-Stock

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Continental Prestige Electronics

USA . 615 parts In-Stock

1+ parts

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$0.157

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615

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$0.157

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SupplyDigital Components

Austria . 592 parts In-Stock

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592

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Microchip USA

USA . 480 parts In-Stock

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480

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UHIMA Technologies

Türkiye . 107 parts In-Stock

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Overview

Boost your electronic projects with the NLV14013BDG by Onsemi! Manufactured by a trusted industry leader, this versatile latches & flip-flops component offers exceptional performance and reliability. Ideal for a wide range of applications, this product ensures seamless integration and smooth operation. Unlock endless possibilities and enjoy the benefits of high-quality design, precision engineering, and cutting-edge technology with the NLV14013BDG. Elevate your projects to new heights with this must-have component from Onsemi.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

This material provides durability and protection to the internal components, ensuring a longer lifespan for the product.

Propagation Delay At Nominal Supply: 350 ns

Fast propagation delay ensures quick response times, ideal for applications requiring high-speed operation.

Surface Mount: YES

Surface mount technology allows for easy and efficient installation on circuit boards, saving space and reducing assembly time.

Nominal Supply Voltage / Vsup (V): 5

Operates at a standard voltage level of 5V, making it compatible with a wide range of electronic systems.

Maximum Operating Temperature: 125 °C

High operating temperature range ensures reliability in harsh environmental conditions.

Technology: CMOS

CMOS technology offers low power consumption and high noise immunity, making it efficient and reliable for various applications.

Technical Specifications

Latches & Flip-Flops NLV14013BDG attributes and parameters. Explore more Latches & Flip-Flops devices from Onsemi

Specs

Family:

4000/14000/40000

JESD-30 Code:

R-PDSO-G14

JESD-609 Code:

e3

Length:

8.65 mm

Load Capacitance (CL):

50 pF

Logic IC Type:

Maximum Frequency At Nominal Supply:

2000000 Hz

Moisture Sensitivity Level (MSL):

1

No. of Bits:

1

No. of Functions:

2

No. of Terminals:

14

Maximum Operating Temperature:

125 Cel

Minimum Operating Temperature:

-55 Cel

Output Polarity:

COMPLEMENTARY

Package Body Material:

PLASTIC/EPOXY

Package Code:

SOP

Package Equivalence Code:

SOP14,.25

Package Shape:

Package Style (Meter):

SMALL OUTLINE

Packing Method:

RAIL

Peak Reflow Temperature (C):

260

Power Supplies (V):

5/15

Propagation Delay At Nominal Supply:

350 ns

Propagation Delay (tpd):

350 ns

Qualification:

Not Qualified

Screening Level:

AEC-Q100

Maximum Seated Height:

1.75 mm

Sub-Category:

FF/Latches

Maximum Supply Voltage (Vsup):

18 V

Minimum Supply Voltage (Vsup):

3 V

Nominal Supply Voltage / Vsup (V):

5

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Finish:

MATTE TIN

Terminal Form:

Terminal Pitch:

1.27 mm

Terminal Position:

DUAL

Maximum Time At Peak Reflow Temperature (s):

30

Trigger Type:

POSITIVE EDGE

Width:

3.9 mm

Trade Compliance

NLV14013BDG Logic ICs trade compliance attributes, and parameters.

HTS

8542.39.00.01

SB

8542.39.00.00

PCN

Manufacturer Highlights

Onsemi

Established in 1999, Onsemi is a leading global provider of power and image-sensing technologies. They are dedicated to building a better future for the automotive, industrial, cloud, medical, and IoT markets. Onsemi's core technologies include analog, digital, and mixed-signal products that offer innovative solutions for advanced automotive systems; highly reliable power management products for industrial applications; low-cost imaging solutions for medical equipment and consumer electronics; and robust communication architectures for the Internet of Things (IoT).

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Management team

President, CEO

Hassane El-Khoury

Executive VP, CFO, Treasurer

Thad Trent

Senior VP

Ross F. Jatou

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

Aizu Fab

Fabrication

Fab Initiation

1995

Japan

Aizu Wakamatsu

Wafer Capacity

52,000

1995

52,000

Si/EPI Fab

Fabrication

Fab Initiation

2018

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

10,000

2018

10,000

Expansion Phase 1 for SiC / EPI

Fabrication

Fab Initiation

2019

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

14,500

2019

14,500

Expansion Phase 2 for SiC / EPI

Fabrication

Fab Initiation

2024

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

2024

SiC Fab

Fabrication

Fab Initiation

2022

USA

Hudson

Wafer Capacity

2022

Bucheon

Fabrication

Fab Initiation

2013

South Korea

Bucheon

Wafer Capacity

61,000

2013

61,000

ISMF - Malaysia

Fabrication

Fab Initiation

1990

Malaysia

Seremban

Wafer Capacity

95,000

1990

95,000

Roznov Device Fab

Fabrication

Fab Initiation

1987

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

80,000

1987

80,000

Fab 10

Fabrication

Fab Initiation

2002

USA

East Fishkill

Wafer Capacity

15,000

2002

15,000

Burlington

Fabrication

Fab Initiation

1986

Canada

Burlington

Wafer Capacity

1986

Gresham

Fabrication

Fab Initiation

1998

USA

Gresham

Wafer Capacity

45,000

1998

45,000

Bucheon 150mm

Fabrication

Fab Initiation

2000

South Korea

Bucheon

Wafer Capacity

50,000

2000

50,000

Rochester

Fabrication

Fab Initiation

1983

USA

Rochester

Wafer Capacity

10,000

1983

10,000

Nampa

Fabrication

Fab Initiation

1995

USA

Nampa

Wafer Capacity

1995

Pennsylvania

Fabrication

Fab Initiation

1997

USA

Mountain Top

Wafer Capacity

36,000

1997

36,000

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