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NLV14044BDG

Onsemi

NLV14044BDG by Onsemi

NLV14044BDG by Onsemi is a 4-bit latch with 350 ns propagation delay, suitable for AEC-Q100 applications. Operating at 5V, it has a load capacitance of 50 pF and can handle supply voltages from 3-18V. With a MILITARY temperature grade, this CMOS technology device is ideal for high-level trigger applications.

Median Price

$0.400

Lifecycle Status

Suppliers In-Stock

9

In-Stock Inventory

1k+

Distributors (Authorized)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Mouser Electronics

USA . 1 parts In-Stock

1+ parts

$0.880

100+ parts

$0.574

1k+ parts

$0.480

10k+ parts

$0.341

1

$0.880

$0.574

$0.480

$0.341

Flip Electronics (Authorized)

USA . 33,984 parts In-Stock

1+ parts

-

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33,984

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Rochester

USA . 5,334 parts In-Stock

1+ parts

-

100+ parts

$0.390

1k+ parts

$0.324

10k+ parts

$0.289

5,334

-

$0.390

$0.324

$0.289

DigiKey

USA . 5,334 parts In-Stock

1+ parts

-

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$0.400

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5,334

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$0.400

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Farnell

UK . 5,334 parts In-Stock

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$0.377

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5,334

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$0.377

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Verical

USA . 4,402 parts In-Stock

1+ parts

-

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1k+ parts

$0.488

10k+ parts

$0.435

4,402

-

-

$0.488

$0.435

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Digiode

USA . 1,127 parts In-Stock

1+ parts

$0.367

100+ parts

-

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1,127

$0.367

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Vyrian

USA . 1,550 parts In-Stock

1+ parts

$0.377

100+ parts

-

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1,550

$0.377

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Flip Electronics

USA . 33,984 parts In-Stock

1+ parts

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100+ parts

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1k+ parts

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33,984

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Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Corphita

USA . 1,066 parts In-Stock

1+ parts

$0.347

100+ parts

-

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1,066

$0.347

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Corohmni

South Africa . 442 parts In-Stock

1+ parts

$0.377

100+ parts

-

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442

$0.377

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Component Stockers USA

USA . 4,819 parts In-Stock

1+ parts

$0.400

100+ parts

$0.370

1k+ parts

$0.340

10k+ parts

-

4,819

$0.400

$0.370

$0.340

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Vigor

Singapore . 132 parts In-Stock

1+ parts

$0.910

100+ parts

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132

$0.910

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Advanced Electronics

New Zealand . 2,500 parts In-Stock

1+ parts

$19.878

100+ parts

$18.089

1k+ parts

$16.300

10k+ parts

-

2,500

$19.878

$18.089

$16.300

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Problanco Electronics

Mexico . 6,784 parts In-Stock

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6,784

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Continental Prestige Electronics

USA . 5,334 parts In-Stock

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$0.288

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5,334

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$0.288

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Authorized Procurement Solutions

USA . 3,000 parts In-Stock

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SupplyDigital Components

Austria . 2,773 parts In-Stock

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Kulean Microsystems

USA . 1,091 parts In-Stock

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1,091

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TANS Electronics

Latvia . 945 parts In-Stock

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945

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Microchip USA

USA . 468 parts In-Stock

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UHIMA Technologies

Türkiye . 64 parts In-Stock

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64

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Overview

Enhance your electronic projects with the NLV14044BDG by Onsemi, a top-notch latches & flip-flops component that guarantees reliability and precision. Crafted by the renowned manufacturer Onsemi, this product is designed to deliver high performance in a wide range of applications. With a compact package body made of durable plastic/epoxy material, this versatile component offers a nominal supply voltage of 5V and features a 3-STATE output characteristic, making it ideal for military-grade projects. Upgrade your designs today with the NLV14044BDG and experience unparalleled quality and efficiency like never before.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

Provides durability and protection for the internal components of the latch, ensuring a long lifespan.

Propagation Delay At Nominal Supply: 350 ns

Fast signal propagation allows for quick and efficient operation of the latch.

Surface Mount: YES

Allows for easy and convenient installation on circuit boards, saving space and simplifying assembly.

Package Shape: RECTANGULAR

Compact rectangular shape fits well in standard circuit board layouts.

Nominal Supply Voltage / Vsup (V): 5

Operates at a standard voltage level, making it compatible with a wide range of systems.

Output Characteristics: 3-STATE

Provides flexibility in controlling the output signal, allowing for tri-state logic functionality.

Trigger Type: HIGH LEVEL

Triggered by a high-level signal, allowing for easy integration into existing circuits.

Technology: CMOS

Utilizes CMOS technology for low power consumption and high noise immunity.

Temperature Grade: MILITARY

Meets military-grade standards for reliability and performance in harsh environments.

Technical Specifications

Latches & Flip-Flops NLV14044BDG attributes and parameters. Explore more Latches & Flip-Flops devices from Onsemi

Specs

Family:

4000/14000/40000

JESD-30 Code:

R-PDSO-G16

JESD-609 Code:

e3

Length:

9.9 mm

Load Capacitance (CL):

50 pF

Logic IC Type:

Moisture Sensitivity Level (MSL):

1

No. of Bits:

4

No. of Functions:

1

No. of Terminals:

16

Maximum Operating Temperature:

125 Cel

Minimum Operating Temperature:

-55 Cel

Output Characteristics:

3-STATE

Output Polarity:

TRUE

Package Body Material:

PLASTIC/EPOXY

Package Code:

SOP

Package Equivalence Code:

SOP16,.25

Package Shape:

Package Style (Meter):

SMALL OUTLINE

Packing Method:

TUBE

Peak Reflow Temperature (C):

260

Power Supplies (V):

5/15

Propagation Delay At Nominal Supply:

350 ns

Propagation Delay (tpd):

350 ns

Qualification:

Not Qualified

Screening Level:

AEC-Q100

Maximum Seated Height:

1.75 mm

Sub-Category:

FF/Latches

Maximum Supply Voltage (Vsup):

18 V

Minimum Supply Voltage (Vsup):

3 V

Nominal Supply Voltage / Vsup (V):

5

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Finish:

MATTE TIN

Terminal Form:

Terminal Pitch:

1.27 mm

Terminal Position:

DUAL

Maximum Time At Peak Reflow Temperature (s):

30

Trigger Type:

HIGH LEVEL

Width:

3.9 mm

Trade Compliance

NLV14044BDG Logic ICs trade compliance attributes, and parameters.

HTS

8542.39.00.01

SB

8542.39.00.00

PCN

Manufacturer Highlights

Onsemi

Established in 1999, Onsemi is a leading global provider of power and image-sensing technologies. They are dedicated to building a better future for the automotive, industrial, cloud, medical, and IoT markets. Onsemi's core technologies include analog, digital, and mixed-signal products that offer innovative solutions for advanced automotive systems; highly reliable power management products for industrial applications; low-cost imaging solutions for medical equipment and consumer electronics; and robust communication architectures for the Internet of Things (IoT).

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Management team

President, CEO

Hassane El-Khoury

Executive VP, CFO, Treasurer

Thad Trent

Senior VP

Ross F. Jatou

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

Aizu Fab

Fabrication

Fab Initiation

1995

Japan

Aizu Wakamatsu

Wafer Capacity

52,000

1995

52,000

Si/EPI Fab

Fabrication

Fab Initiation

2018

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

10,000

2018

10,000

Expansion Phase 1 for SiC / EPI

Fabrication

Fab Initiation

2019

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

14,500

2019

14,500

Expansion Phase 2 for SiC / EPI

Fabrication

Fab Initiation

2024

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

2024

SiC Fab

Fabrication

Fab Initiation

2022

USA

Hudson

Wafer Capacity

2022

Bucheon

Fabrication

Fab Initiation

2013

South Korea

Bucheon

Wafer Capacity

61,000

2013

61,000

ISMF - Malaysia

Fabrication

Fab Initiation

1990

Malaysia

Seremban

Wafer Capacity

95,000

1990

95,000

Roznov Device Fab

Fabrication

Fab Initiation

1987

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

80,000

1987

80,000

Fab 10

Fabrication

Fab Initiation

2002

USA

East Fishkill

Wafer Capacity

15,000

2002

15,000

Burlington

Fabrication

Fab Initiation

1986

Canada

Burlington

Wafer Capacity

1986

Gresham

Fabrication

Fab Initiation

1998

USA

Gresham

Wafer Capacity

45,000

1998

45,000

Bucheon 150mm

Fabrication

Fab Initiation

2000

South Korea

Bucheon

Wafer Capacity

50,000

2000

50,000

Rochester

Fabrication

Fab Initiation

1983

USA

Rochester

Wafer Capacity

10,000

1983

10,000

Nampa

Fabrication

Fab Initiation

1995

USA

Nampa

Wafer Capacity

1995

Pennsylvania

Fabrication

Fab Initiation

1997

USA

Mountain Top

Wafer Capacity

36,000

1997

36,000

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