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NLV14013BDTR2G

Onsemi

NLV14013BDTR2G by Onsemi

NLV14013BDTR2G by Onsemi is a CMOS latch with 350ns propagation delay, suitable for military applications. It operates at 5V with 50pF load capacitance and has dual terminal position. The device features positive edge trigger and complementary output polarity.

Median Price

$0.480

Lifecycle Status

Suppliers In-Stock

8

In-Stock Inventory

1k+

Distributors (Authorized)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Rochester

USA . 165 parts In-Stock

1+ parts

$0.224

100+ parts

$0.211

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$0.191

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165

$0.224

$0.211

$0.191

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DigiKey

USA . 14,744 parts In-Stock

1+ parts

$0.480

100+ parts

$0.260

1k+ parts

$0.222

10k+ parts

$0.205

14,744

$0.480

$0.260

$0.222

$0.205

Mouser Electronics

USA . 2,041 parts In-Stock

1+ parts

$0.480

100+ parts

$0.261

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$0.222

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$0.200

2,041

$0.480

$0.261

$0.222

$0.200

Distributors (In-Stock)

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Digiode

USA . 861 parts In-Stock

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$0.213

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$0.213

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Vyrian

USA . 1,273 parts In-Stock

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$0.224

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Bristol Electronics

USA . 218 parts In-Stock

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$0.563

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$0.225

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$0.208

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218

$0.563

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$0.208

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Cyclops Electronics Ltd

UK . 50,000 parts In-Stock

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Chip Stock

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Corphita

USA . 2,352 parts In-Stock

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$0.202

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$0.202

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Corohmni

South Africa . 351 parts In-Stock

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$0.224

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Vigor

Singapore . 675 parts In-Stock

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$0.690

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675

$0.690

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Microchip USA

USA . 3,375 parts In-Stock

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$4.225

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$4.225

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Advanced Electronics

New Zealand . 70 parts In-Stock

1+ parts

$12.863

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$11.705

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$10.548

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70

$12.863

$11.705

$10.548

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Problanco Electronics

Mexico . 7,831 parts In-Stock

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Kulean Microsystems

USA . 3,903 parts In-Stock

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Authorized Procurement Solutions

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Component Stockers USA

USA . 3,386 parts In-Stock

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iodParts Technologies Inc.

India . 2,500 parts In-Stock

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TANS Electronics

Latvia . 2,011 parts In-Stock

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SupplyDigital Components

Austria . 1,658 parts In-Stock

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GreenTree Electronics

Israel . 515 parts In-Stock

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UHIMA Technologies

Türkiye . 312 parts In-Stock

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Perfect Parts

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Overview

Experience top-notch quality and reliability with the NLV14013BDTR2G from Onsemi. As a leading manufacturer in the industry, Onsemi offers a wide range of applications for latches & flip-flops, ensuring exceptional performance in every use. With a focus on value and benefits for customers, this product provides unparalleled advantages such as fast propagation delay, surface mount capability, and a wide temperature range. Trust Onsemi to deliver cutting-edge technology that meets your needs and exceeds your expectations. Elevate your projects with the NLV14013BDTR2G today.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

Provides good durability and protection for the internal components, ensuring long-lasting performance.

Propagation Delay At Nominal Supply: 350 ns

Fast propagation delay allows for quick response times in signal processing applications.

Surface Mount: YES

Allows for easy and efficient installation on circuit boards, saving time and effort during assembly.

No. of Functions: 2

Offers versatility and flexibility in circuit design, allowing for multiple functions in a single component.

Package Shape: RECTANGULAR

Sleek and compact design makes it easy to integrate into various electronic devices or systems.

Nominal Supply Voltage / Vsup (V): 5

Operates at a common supply voltage, ensuring compatibility with a wide range of systems.

Load Capacitance (CL): 50 pF

Suitable for applications that require a specific load capacitance for optimal performance.

Maximum Operating Temperature: 125 °C

Can withstand high temperatures, making it suitable for use in harsh environments or industrial settings.

Minimum Operating Temperature: -55 °C

Can operate in cold temperatures, providing reliability in various climate conditions.

Technology: CMOS

Utilizes CMOS technology for low power consumption and high noise immunity, enhancing overall performance.

Technical Specifications

Latches & Flip-Flops NLV14013BDTR2G attributes and parameters. Explore more Latches & Flip-Flops devices from Onsemi

Specs

Family:

4000/14000/40000

JESD-30 Code:

R-PDSO-G14

JESD-609 Code:

e4

Length:

5 mm

Load Capacitance (CL):

50 pF

Logic IC Type:

Maximum Frequency At Nominal Supply:

2000000 Hz

Moisture Sensitivity Level (MSL):

1

No. of Bits:

1

No. of Functions:

2

No. of Terminals:

14

Maximum Operating Temperature:

125 Cel

Minimum Operating Temperature:

-55 Cel

Output Polarity:

COMPLEMENTARY

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Equivalence Code:

TSSOP14,.25

Package Shape:

Package Style (Meter):

SMALL OUTLINE, THIN PROFILE, SHRINK PITCH

Packing Method:

TR

Peak Reflow Temperature (C):

260

Power Supplies (V):

5/15

Propagation Delay At Nominal Supply:

350 ns

Propagation Delay (tpd):

350 ns

Qualification:

Not Qualified

Screening Level:

AEC-Q100

Maximum Seated Height:

1.2 mm

Sub-Category:

FF/Latches

Maximum Supply Voltage (Vsup):

18 V

Minimum Supply Voltage (Vsup):

3 V

Nominal Supply Voltage / Vsup (V):

5

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Finish:

NICKEL PALLADIUM GOLD

Terminal Form:

Terminal Pitch:

.65 mm

Terminal Position:

DUAL

Maximum Time At Peak Reflow Temperature (s):

30

Trigger Type:

POSITIVE EDGE

Width:

4.4 mm

Trade Compliance

NLV14013BDTR2G Logic ICs trade compliance attributes, and parameters.

HTS

8542.39.00.01

SB

8542.39.00.00

Manufacturer Highlights

Onsemi

Established in 1999, Onsemi is a leading global provider of power and image-sensing technologies. They are dedicated to building a better future for the automotive, industrial, cloud, medical, and IoT markets. Onsemi's core technologies include analog, digital, and mixed-signal products that offer innovative solutions for advanced automotive systems; highly reliable power management products for industrial applications; low-cost imaging solutions for medical equipment and consumer electronics; and robust communication architectures for the Internet of Things (IoT).

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Management team

President, CEO

Hassane El-Khoury

Executive VP, CFO, Treasurer

Thad Trent

Senior VP

Ross F. Jatou

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

Aizu Fab

Fabrication

Fab Initiation

1995

Japan

Aizu Wakamatsu

Wafer Capacity

52,000

1995

52,000

Si/EPI Fab

Fabrication

Fab Initiation

2018

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

10,000

2018

10,000

Expansion Phase 1 for SiC / EPI

Fabrication

Fab Initiation

2019

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

14,500

2019

14,500

Expansion Phase 2 for SiC / EPI

Fabrication

Fab Initiation

2024

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

2024

SiC Fab

Fabrication

Fab Initiation

2022

USA

Hudson

Wafer Capacity

2022

Bucheon

Fabrication

Fab Initiation

2013

South Korea

Bucheon

Wafer Capacity

61,000

2013

61,000

ISMF - Malaysia

Fabrication

Fab Initiation

1990

Malaysia

Seremban

Wafer Capacity

95,000

1990

95,000

Roznov Device Fab

Fabrication

Fab Initiation

1987

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

80,000

1987

80,000

Fab 10

Fabrication

Fab Initiation

2002

USA

East Fishkill

Wafer Capacity

15,000

2002

15,000

Burlington

Fabrication

Fab Initiation

1986

Canada

Burlington

Wafer Capacity

1986

Gresham

Fabrication

Fab Initiation

1998

USA

Gresham

Wafer Capacity

45,000

1998

45,000

Bucheon 150mm

Fabrication

Fab Initiation

2000

South Korea

Bucheon

Wafer Capacity

50,000

2000

50,000

Rochester

Fabrication

Fab Initiation

1983

USA

Rochester

Wafer Capacity

10,000

1983

10,000

Nampa

Fabrication

Fab Initiation

1995

USA

Nampa

Wafer Capacity

1995

Pennsylvania

Fabrication

Fab Initiation

1997

USA

Mountain Top

Wafer Capacity

36,000

1997

36,000

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