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SN74HC74PWRE4

Texas Instruments

SN74HC74PWRE4 by Texas Instruments

SN74HC74PWRE4 by Texas Instruments is a dual-function latches & flip-flops IC with 14 terminals. It operates at a nominal voltage of 5V and has a load capacitance of 50pF. With a max frequency of 29MHz, it is ideal for industrial applications requiring positive edge triggering and complementary output polarity.

Median Price

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Lifecycle Status

Suppliers In-Stock

3

In-Stock Inventory

1k+

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Vyrian

USA . 4,977 parts In-Stock

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Digiode

USA . 1,898 parts In-Stock

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Nova Conductors

Japan . 48 parts In-Stock

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AZTECH Wire

Italy . 664 parts In-Stock

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$6.966

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$6.966

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Parana Technologies

USA . 1,886 parts In-Stock

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$8.482

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$9.135

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$8.482

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ChromeModa Solutions

Germany . 5,581 parts In-Stock

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$9.530

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$7.815

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IDEA Electronic Components Group

UK . 989 parts In-Stock

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$9.530

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$9.054

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$8.577

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989

$9.530

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$8.577

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Advanced Electronics

New Zealand . 40 parts In-Stock

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$10.927

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$10.381

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$10.381

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40

$10.927

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Corohmni

South Africa . 17 parts In-Stock

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$27.992

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One Stop Electronics

USA . 413 parts In-Stock

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$35.000

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Semicontronic

India . 1,401 parts In-Stock

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$40.000

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$39.000

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$38.800

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Ampacity Inc.

Singapore . 505 parts In-Stock

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Argo Parts USA

USA . 4,431 parts In-Stock

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Corphita

USA . 3,338 parts In-Stock

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Continental Prestige Electronics

USA . 1,942 parts In-Stock

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Robosynatics

Brazil . 950 parts In-Stock

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Lucentia Tech

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DigiPath Technology Company

USA . 496 parts In-Stock

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$8.592

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Bastille Electronics

Australia . 200 parts In-Stock

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Overview

Enhance your electronic projects with the SN74HC74PWRE4 by Texas Instruments, a top-tier manufacturer known for delivering high-quality components. This latch & flip-flop offers unmatched reliability and performance, making it perfect for a wide range of applications. With its innovative design and advanced features, this product provides exceptional value to customers seeking seamless integration and efficient operation. Elevate your projects with the superior benefits and advantages that the SN74HC74PWRE4 has to offer.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

This material is durable and lightweight, making the product suitable for various applications.

Surface Mount: YES

The surface mount feature allows for easy installation and space-saving design in electronic circuits.

No. of Functions: 2

Having multiple functions in one component simplifies circuit design and reduces overall system complexity.

Package Shape: RECTANGULAR

The rectangular shape offers compatibility with standard PCB layouts for easy integration.

Nominal Supply Voltage / Vsup (V): 5

The 5V supply voltage is commonly used in electronic systems, making this product versatile and widely compatible.

Load Capacitance (CL): 50 pF

The low load capacitance ensures fast and efficient operation in high-speed applications.

Power Supplies (V): 2/6

Compatible with a range of power supplies, allowing flexibility in usage and integration with different systems.

No. of Terminals: 14

The ample number of terminals provide connectivity options for versatile circuit configurations.

Package Style (Meter): SMALL OUTLINE, THIN PROFILE, SHRINK PITCH

The compact package style saves space on the PCB and allows for dense circuit layouts.

Maximum I (ol): 4 Amp

The high output current capability ensures reliable performance in demanding applications.

Propagation Delay (tpd): 220 ns

The low propagation delay enables rapid signal processing and improves overall system efficiency.

Maximum Operating Temperature: 85 °C

With a high operating temperature range, this product is suitable for industrial environments with varying temperature conditions.

Trigger Type: POSITIVE EDGE

The positive edge trigger type allows for precise timing control in digital systems.

Minimum Operating Temperature: -40 °C

The wide temperature range ensures reliable operation in extreme cold conditions.

Terminal Finish: NICKEL PALLADIUM GOLD

This terminal finish provides excellent contact reliability and corrosion resistance for long-term use.

Terminal Position: DUAL

The dual terminal position offers flexibility in circuit connections and layout design.

Maximum Seated Height: 1.2 mm

The low seated height is ideal for space-constrained applications and compact electronic devices.

Width: 4.4 mm

The narrow width allows for efficient use of PCB real estate and facilitates compact designs.

Output Polarity: COMPLEMENTARY

The complementary output polarity simplifies signal processing and logic operations in digital circuits.

Minimum Supply Voltage (Vsup): 2 V

The low minimum supply voltage requirement allows for operation in low-power systems and battery-powered devices.

Maximum Time At Peak Reflow Temperature (s): 30

This product can withstand peak reflow temperatures for extended periods during manufacturing processes.

Peak Reflow Temperature °C: 260

The high peak reflow temperature tolerance ensures reliable soldering and assembly in manufacturing environments.

Length: 5 mm

The compact length dimension allows for efficient use of PCB space and facilitates compact circuit designs.

Temperature Grade: INDUSTRIAL

Designed for industrial-grade applications, this product can withstand harsh environmental conditions and operating environments.

Maximum Frequency At Nominal Supply: 25000000 Hz

With a high maximum frequency, this product is suitable for high-speed digital applications requiring fast signal processing.

Technology: CMOS

CMOS technology offers low power consumption, high noise immunity, and compatibility with a wide range of digital systems.

Terminal Form: GULL WING

The gull wing terminal form provides secure solder connections and reliable electrical contact in PCB assembly.

Packing Method: TR

The TR packing method ensures safe handling and protection during shipping and storage.

Terminal Pitch: 0.65 mm

The small terminal pitch allows for high-density mounting on the PCB and efficient use of space.

Minimum fmax: 29 MHz

With a high minimum fmax value, this product can operate at high frequencies for fast signal processing.

Maximum Supply Voltage (Vsup): 6 V

The maximum supply voltage of 6V provides flexibility and compatibility with a wide range of power sources.

Technical Specifications

Latches & Flip-Flops SN74HC74PWRE4 attributes and parameters. Explore more Latches & Flip-Flops devices from Texas Instruments

Specs

Family:

HC/UH

JESD-30 Code:

R-PDSO-G14

JESD-609 Code:

e4

Length:

5 mm

Load Capacitance (CL):

50 pF

Logic IC Type:

Maximum Frequency At Nominal Supply:

25000000 Hz

Maximum I (ol):

4 Amp

Moisture Sensitivity Level (MSL):

1

No. of Bits:

1

No. of Functions:

2

No. of Terminals:

14

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

-40 Cel

Output Polarity:

COMPLEMENTARY

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Equivalence Code:

TSSOP14,.25

Package Shape:

Package Style (Meter):

SMALL OUTLINE, THIN PROFILE, SHRINK PITCH

Packing Method:

TR

Peak Reflow Temperature (C):

260

Power Supplies (V):

2/6

Propagation Delay (tpd):

220 ns

Qualification:

Not Qualified

Maximum Seated Height:

1.2 mm

Sub-Category:

FF/Latches

Maximum Supply Voltage (Vsup):

6 V

Minimum Supply Voltage (Vsup):

2 V

Nominal Supply Voltage / Vsup (V):

5

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Finish:

NICKEL PALLADIUM GOLD

Terminal Form:

Terminal Pitch:

.65 mm

Terminal Position:

DUAL

Maximum Time At Peak Reflow Temperature (s):

30

Trigger Type:

POSITIVE EDGE

Width:

4.4 mm

Minimum fmax:

29 MHz

Trade Compliance

SN74HC74PWRE4 Logic ICs trade compliance attributes, and parameters.

HTS

8542.39.00.01

SB

8542.39.00.00

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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