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NLV14099BDWR2G

Onsemi

NLV14099BDWR2G by Onsemi

NLV14099BDWR2G by Onsemi is a 16-terminal CMOS latch with trigger type LOW LEVEL. It operates b/w -55 to 125 °C and has a propagation delay of 400 ns. Suitable for military applications, it features TRUE output polarity and AEC-Q100 screening level.

Median Price

$0.687

Lifecycle Status

Suppliers In-Stock

7

In-Stock Inventory

1k+

Distributors (Authorized)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Rochester

USA . 26,241 parts In-Stock

1+ parts

-

100+ parts

$0.662

1k+ parts

$0.549

10k+ parts

$0.490

26,241

-

$0.662

$0.549

$0.490

DigiKey

USA . 26,241 parts In-Stock

1+ parts

-

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$0.830

10k+ parts

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26,241

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-

$0.830

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Verical

USA . 19,000 parts In-Stock

1+ parts

-

100+ parts

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1k+ parts

$0.687

10k+ parts

$0.613

19,000

-

-

$0.687

$0.613

Flip Electronics (Authorized)

USA . 6,000 parts In-Stock

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6,000

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Distributors (In-Stock)

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Vyrian

USA . 439 parts In-Stock

1+ parts

$0.467

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439

$0.467

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Digiode

USA . 1,849 parts In-Stock

1+ parts

$0.515

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-

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1,849

$0.515

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Flip Electronics

USA . 6,000 parts In-Stock

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6,000

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Distributors (Availability)

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Corohmni

South Africa . 468 parts In-Stock

1+ parts

$0.467

100+ parts

-

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468

$0.467

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Vigor

Singapore . 300 parts In-Stock

1+ parts

$0.480

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300

$0.480

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Corphita

USA . 329 parts In-Stock

1+ parts

$0.488

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329

$0.488

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Component Stockers USA

USA . 26,981 parts In-Stock

1+ parts

$0.550

100+ parts

$0.520

1k+ parts

$0.470

10k+ parts

$0.470

26,981

$0.550

$0.520

$0.470

$0.470

Continental Prestige Electronics

USA . 26,241 parts In-Stock

1+ parts

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$0.429

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26,241

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$0.429

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QUARKTWIN TECHNOLOGY LTD

USA . 11,159 parts In-Stock

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SupplyDigital Components

Austria . 7,890 parts In-Stock

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7,890

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Kulean Microsystems

USA . 7,137 parts In-Stock

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7,137

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TANS Electronics

Latvia . 5,488 parts In-Stock

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5,488

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Problanco Electronics

Mexico . 3,699 parts In-Stock

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3,699

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UHIMA Technologies

Türkiye . 793 parts In-Stock

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793

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Overview

Unlock a world of possibilities with the NLV14099BDWR2G by Onsemi. Crafted with precision and expertise, this small outline latches & flip-flops device offers unparalleled quality and reliability. Ideal for a wide range of applications, from automotive to industrial settings, this product boasts a true output polarity and low trigger type for seamless operation. With a nominal supply voltage of 5V and a temperature grade suitable for military use, Onsemi's NLV14099BDWR2G delivers exceptional value and performance. Upgrade your projects with this top-of-the-line component today.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

This material provides durability and protection to the internal components of the latch or flip-flop, ensuring long-lasting performance.

Surface Mount: YES

Allows for easy and convenient installation on PCBs, saving time and effort during assembly.

Screening Level: AEC-Q100

Ensures high reliability and quality standards, making this product suitable for automotive applications.

Nominal Supply Voltage / Vsup (V): 5

Operates at a standard voltage level commonly used in electronic circuits, ensuring compatibility with various systems.

No. of Terminals: 16

Provides multiple connection points for interfacing with other components, allowing for versatile circuit designs.

Propagation Delay (tpd): 400 ns

Offers fast signal processing and response times, crucial for time-sensitive applications.

Maximum Operating Temperature: 125 °C

Can withstand high temperatures without compromising performance, making it suitable for harsh operating environments.

Trigger Type: LOW LEVEL

Responds to low-level signals for triggering actions, providing flexibility in circuit design and operation.

Minimum Operating Temperature: -55 °C

Functions reliably even in extremely cold conditions, ensuring performance in a wide range of operating environments.

Terminal Finish: MATTE TIN

Provides a corrosion-resistant and reliable contact surface, maintaining signal integrity over extended periods of use.

Output Polarity: TRUE

Provides accurate and consistent output signals, ensuring reliable operation in digital systems.

Temperature Grade: MILITARY

Meets stringent military standards for operation in rugged and demanding environments, ensuring high reliability under extreme conditions.

Technology: CMOS

Utilizes CMOS technology for low power consumption and high noise immunity, making it suitable for battery-operated devices and sensitive applications.

Moisture Sensitivity Level (MSL): 3

Indicates moderate sensitivity to moisture, providing some level of protection against environmental humidity.

Technical Specifications

Latches & Flip-Flops NLV14099BDWR2G attributes and parameters. Explore more Latches & Flip-Flops devices from Onsemi

Specs

Family:

4000/14000/40000

JESD-30 Code:

R-PDSO-G16

JESD-609 Code:

e3

Length:

10.3 mm

Logic IC Type:

Moisture Sensitivity Level (MSL):

3

No. of Bits:

1

No. of Functions:

1

No. of Terminals:

16

Maximum Operating Temperature:

125 Cel

Minimum Operating Temperature:

-55 Cel

Output Polarity:

TRUE

Package Body Material:

PLASTIC/EPOXY

Package Code:

SOP

Package Shape:

Package Style (Meter):

SMALL OUTLINE

Peak Reflow Temperature (C):

260

Propagation Delay (tpd):

400 ns

Screening Level:

AEC-Q100

Maximum Seated Height:

2.65 mm

Maximum Supply Voltage (Vsup):

18 V

Minimum Supply Voltage (Vsup):

3 V

Nominal Supply Voltage / Vsup (V):

5

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Finish:

MATTE TIN

Terminal Form:

Terminal Pitch:

1.27 mm

Terminal Position:

DUAL

Maximum Time At Peak Reflow Temperature (s):

30

Trigger Type:

LOW LEVEL

Width:

7.5 mm

Trade Compliance

NLV14099BDWR2G Logic ICs trade compliance attributes, and parameters.

HTS

8542.39.00.01

SB

8542.39.00.00

Manufacturer Highlights

Onsemi

Established in 1999, Onsemi is a leading global provider of power and image-sensing technologies. They are dedicated to building a better future for the automotive, industrial, cloud, medical, and IoT markets. Onsemi's core technologies include analog, digital, and mixed-signal products that offer innovative solutions for advanced automotive systems; highly reliable power management products for industrial applications; low-cost imaging solutions for medical equipment and consumer electronics; and robust communication architectures for the Internet of Things (IoT).

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Management team

President, CEO

Hassane El-Khoury

Executive VP, CFO, Treasurer

Thad Trent

Senior VP

Ross F. Jatou

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

Aizu Fab

Fabrication

Fab Initiation

1995

Japan

Aizu Wakamatsu

Wafer Capacity

52,000

1995

52,000

Si/EPI Fab

Fabrication

Fab Initiation

2018

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

10,000

2018

10,000

Expansion Phase 1 for SiC / EPI

Fabrication

Fab Initiation

2019

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

14,500

2019

14,500

Expansion Phase 2 for SiC / EPI

Fabrication

Fab Initiation

2024

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

2024

SiC Fab

Fabrication

Fab Initiation

2022

USA

Hudson

Wafer Capacity

2022

Bucheon

Fabrication

Fab Initiation

2013

South Korea

Bucheon

Wafer Capacity

61,000

2013

61,000

ISMF - Malaysia

Fabrication

Fab Initiation

1990

Malaysia

Seremban

Wafer Capacity

95,000

1990

95,000

Roznov Device Fab

Fabrication

Fab Initiation

1987

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

80,000

1987

80,000

Fab 10

Fabrication

Fab Initiation

2002

USA

East Fishkill

Wafer Capacity

15,000

2002

15,000

Burlington

Fabrication

Fab Initiation

1986

Canada

Burlington

Wafer Capacity

1986

Gresham

Fabrication

Fab Initiation

1998

USA

Gresham

Wafer Capacity

45,000

1998

45,000

Bucheon 150mm

Fabrication

Fab Initiation

2000

South Korea

Bucheon

Wafer Capacity

50,000

2000

50,000

Rochester

Fabrication

Fab Initiation

1983

USA

Rochester

Wafer Capacity

10,000

1983

10,000

Nampa

Fabrication

Fab Initiation

1995

USA

Nampa

Wafer Capacity

1995

Pennsylvania

Fabrication

Fab Initiation

1997

USA

Mountain Top

Wafer Capacity

36,000

1997

36,000

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