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NLV14175BDR2G

Onsemi

NLV14175BDR2G by Onsemi

NLV14175BDR2G by Onsemi is a 4-bit latch with 400ns propagation delay, operating at -55 to 125 °C. Suitable for military applications, it has a supply voltage range of 3-18V and can handle load capacitance up to 50pF. With AEC-Q100 screening, this CMOS technology flip-flop is ideal for high-frequency operations up to 2MHz.

Median Price

$0.418

Lifecycle Status

Suppliers In-Stock

9

In-Stock Inventory

1k+

Distributors (Authorized)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

DigiKey

USA . 2,500 parts In-Stock

1+ parts

$0.550

100+ parts

$0.299

1k+ parts

$0.258

10k+ parts

$0.236

2,500

$0.550

$0.299

$0.258

$0.236

Mouser Electronics

USA . 2,500 parts In-Stock

1+ parts

$0.550

100+ parts

$0.299

1k+ parts

$0.258

10k+ parts

$0.243

2,500

$0.550

$0.299

$0.258

$0.243

Rochester

USA . 128,646 parts In-Stock

1+ parts

-

100+ parts

$0.286

1k+ parts

$0.237

10k+ parts

$0.211

128,646

-

$0.286

$0.237

$0.211

Verical

USA . 19,987 parts In-Stock

1+ parts

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$0.264

19,987

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$0.264

Flip Electronics (Authorized)

USA . 10,000 parts In-Stock

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Distributors (In-Stock)

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Digiode

USA . 2,456 parts In-Stock

1+ parts

$0.222

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-

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2,456

$0.222

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Vyrian

USA . 1,281 parts In-Stock

1+ parts

$0.234

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1,281

$0.234

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Cyclops Electronics Ltd

UK . 22,244 parts In-Stock

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22,244

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Flip Electronics

USA . 10,000 parts In-Stock

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Distributors (Availability)

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Corphita

USA . 2,196 parts In-Stock

1+ parts

$0.211

100+ parts

-

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2,196

$0.211

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Corohmni

South Africa . 377 parts In-Stock

1+ parts

$0.234

100+ parts

-

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377

$0.234

-

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Vigor

Singapore . 828 parts In-Stock

1+ parts

$0.396

100+ parts

-

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828

$0.396

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Component Stockers USA

USA . 169,991 parts In-Stock

1+ parts

$0.580

100+ parts

$0.410

1k+ parts

$0.500

10k+ parts

$0.500

169,991

$0.580

$0.410

$0.500

$0.500

Perfect Parts

USA . 846,315 parts In-Stock

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846,315

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GreenTree Electronics

Israel . 52,500 parts In-Stock

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Authorized Procurement Solutions

USA . 30,000 parts In-Stock

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ChipstoGo Electronic ltd

UK . 20,000 parts In-Stock

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TANS Electronics

Latvia . 8,103 parts In-Stock

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SupplyDigital Components

Austria . 6,283 parts In-Stock

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6,283

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Kulean Microsystems

USA . 5,758 parts In-Stock

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5,758

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Problanco Electronics

Mexico . 4,282 parts In-Stock

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4,282

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iodParts Technologies Inc.

India . 2,202 parts In-Stock

1+ parts

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$0.801

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2,202

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$0.801

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UHIMA Technologies

Türkiye . 447 parts In-Stock

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447

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Overview

Experience unparalleled performance and reliability with the NLV14175BDR2G by Onsemi. As a leading manufacturer in the industry, Onsemi delivers top-notch quality latches & flip-flops that are perfect for a wide range of applications. This product guarantees seamless operation and efficiency, making it a valuable choice for customers seeking high-quality electronic components. Upgrade your systems with the NLV14175BDR2G and enjoy the benefits of superior technology at your fingertips.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

The use of plastic/epoxy material ensures durability and resistance to environmental factors, making this product suitable for various applications.

Surface Mount: YES

Being surface mountable allows for easy and convenient installation on a PCB, saving space and potentially lowering manufacturing costs.

Screening Level: AEC-Q100

AEC-Q100 screening ensures high reliability and quality, making this product suitable for automotive applications where robust performance is critical.

Nominal Supply Voltage / Vsup (V): 5

With a nominal supply voltage of 5V, this latch/flip-flop is compatible with standard voltage levels in many electronic systems, enhancing its versatility.

No. of Bits: 4

The 4-bit configuration provides sufficient storage capacity for digital data manipulation, making this latch/flip-flop suitable for a wide range of applications.

Propagation Delay (tpd): 400 ns

The low propagation delay of 400 ns ensures fast response times, making this latch/flip-flop suitable for high-speed operations.

Maximum Operating Temperature: 125 °C

The high maximum operating temperature of 125 °C allows for reliable operation in harsh environments and industrial applications.

Trigger Type: POSITIVE EDGE

The positive edge trigger type ensures precise timing control and reliable operation in synchronous digital systems.

Technology: CMOS

The CMOS technology used in this latch/flip-flop offers low power consumption, high noise immunity, and compatibility with a wide range of digital systems.

Technical Specifications

Latches & Flip-Flops NLV14175BDR2G attributes and parameters. Explore more Latches & Flip-Flops devices from Onsemi

Specs

Family:

4000/14000/40000

JESD-30 Code:

R-PDSO-G16

JESD-609 Code:

e3

Length:

9.9 mm

Load Capacitance (CL):

50 pF

Logic IC Type:

Maximum Frequency At Nominal Supply:

2000000 Hz

Moisture Sensitivity Level (MSL):

1

No. of Bits:

4

No. of Functions:

1

No. of Terminals:

16

Maximum Operating Temperature:

125 Cel

Minimum Operating Temperature:

-55 Cel

Output Polarity:

COMPLEMENTARY

Package Body Material:

PLASTIC/EPOXY

Package Code:

SOP

Package Equivalence Code:

SOP16,.25

Package Shape:

Package Style (Meter):

SMALL OUTLINE

Packing Method:

TR

Peak Reflow Temperature (C):

260

Power Supplies (V):

5/15

Propagation Delay (tpd):

400 ns

Qualification:

Not Qualified

Screening Level:

AEC-Q100

Maximum Seated Height:

1.75 mm

Sub-Category:

FF/Latches

Maximum Supply Voltage (Vsup):

18 V

Minimum Supply Voltage (Vsup):

3 V

Nominal Supply Voltage / Vsup (V):

5

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Finish:

MATTE TIN

Terminal Form:

Terminal Pitch:

1.27 mm

Terminal Position:

DUAL

Maximum Time At Peak Reflow Temperature (s):

30

Trigger Type:

POSITIVE EDGE

Width:

3.9 mm

Trade Compliance

NLV14175BDR2G Logic ICs trade compliance attributes, and parameters.

HTS

8542.39.00.01

SB

8542.39.00.00

Manufacturer Highlights

Onsemi

Established in 1999, Onsemi is a leading global provider of power and image-sensing technologies. They are dedicated to building a better future for the automotive, industrial, cloud, medical, and IoT markets. Onsemi's core technologies include analog, digital, and mixed-signal products that offer innovative solutions for advanced automotive systems; highly reliable power management products for industrial applications; low-cost imaging solutions for medical equipment and consumer electronics; and robust communication architectures for the Internet of Things (IoT).

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Management team

President, CEO

Hassane El-Khoury

Executive VP, CFO, Treasurer

Thad Trent

Senior VP

Ross F. Jatou

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

Aizu Fab

Fabrication

Fab Initiation

1995

Japan

Aizu Wakamatsu

Wafer Capacity

52,000

1995

52,000

Si/EPI Fab

Fabrication

Fab Initiation

2018

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

10,000

2018

10,000

Expansion Phase 1 for SiC / EPI

Fabrication

Fab Initiation

2019

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

14,500

2019

14,500

Expansion Phase 2 for SiC / EPI

Fabrication

Fab Initiation

2024

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

2024

SiC Fab

Fabrication

Fab Initiation

2022

USA

Hudson

Wafer Capacity

2022

Bucheon

Fabrication

Fab Initiation

2013

South Korea

Bucheon

Wafer Capacity

61,000

2013

61,000

ISMF - Malaysia

Fabrication

Fab Initiation

1990

Malaysia

Seremban

Wafer Capacity

95,000

1990

95,000

Roznov Device Fab

Fabrication

Fab Initiation

1987

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

80,000

1987

80,000

Fab 10

Fabrication

Fab Initiation

2002

USA

East Fishkill

Wafer Capacity

15,000

2002

15,000

Burlington

Fabrication

Fab Initiation

1986

Canada

Burlington

Wafer Capacity

1986

Gresham

Fabrication

Fab Initiation

1998

USA

Gresham

Wafer Capacity

45,000

1998

45,000

Bucheon 150mm

Fabrication

Fab Initiation

2000

South Korea

Bucheon

Wafer Capacity

50,000

2000

50,000

Rochester

Fabrication

Fab Initiation

1983

USA

Rochester

Wafer Capacity

10,000

1983

10,000

Nampa

Fabrication

Fab Initiation

1995

USA

Nampa

Wafer Capacity

1995

Pennsylvania

Fabrication

Fab Initiation

1997

USA

Mountain Top

Wafer Capacity

36,000

1997

36,000

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